• Journal of Korean Society for Atmospheric Environment
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• v.16 no.E
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• pp.19-27
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• 2000

Particle Induced X-ray Emission (PIXE) and Elemental Analysis Syztem (EAS) were applied to the investiga-tion of the Characteristics and sources of wintertime atmospheric aerosols in Seoul. Atmospheric aerosols were collected by both fine and coarse fractions using a two-stage filter pack sampler from Kon-Kuk university during the winter season of 1999. PIXE was applied to the analysis of the middle and heavy elements with atomic numbers greater than 14(Si) and EAS was applied to the measurement of the light elements such as H, C and N. The fact that 64.2% of mass of fine particles in Seoul consists of the light elements (N, C , and H) suggests that the measurement of light elements is extremely important. The average mass concentration is Seoul was 38.6$\mu\textrm{g}$m(sup)-3. Elements such as Ca, Fe, Mg, and Ti appeared to have very low Fine/Coarse ratios(0.1∼0.4), whereas che-mical components related to anthropogenic sources such as Br, V, Pb, and Zn were observed to accumulate in the fine fraction. In the Asian Dust Storm(ADS) event, the concentation of soil components increased dramatically. Reconstruction of the fine mass concentrations estimated by a newly revised simple model was fairly in good agreement with the measured ones. Source identification was attempted using the enrichment factor and Pearsons coefficient of correlation. The typical elements derived from each source could be classified by this method.

• Journal of Biomedical Engineering Research
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• v.6 no.1
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• pp.37-46
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• 1985

Development of a dental Ni-Cr alloy system for porcelain veneering crown and bridge was studied in this research. The principles of alloy design were a) It should not contain toxic beryllium. b) It should have low melting Point. c) It should be easily ground and polished. d) It should possess an adequate strength to resist the deformational force In the mouth. e) It should be bondable Ivith porcelain by chemically. After investigating the effect of minor elements such as boron and rare earth metals on the mechanical properties of the Ni-Cr alloy system, the compromised ideal composition for dental use was determined. The composition was l9.6%, Cr, 5.6% Mo, 3.4% Si, 1, 0% Fe, 0.01% Ti, 0.5-1.0% B, 0.2-0.6% misch metal, balance Ni. To compare the performance of experimental alloy with commercially available alloys, the properties such as strength, melting point, and bond strength were measured. The results Ivere as follows: a) Boron increases the strength of the alloy but reduces the elongation. b) Misch metal increases the strength when the boron content is low, but does not increase the strength when boron content is high. And it reduces the elongation drastically, c) Mechanical strength of the experimental alloy was not superior to commercially available Be containing alloy, but handling performance such as castability, ease of granting and polishing, and cuttability were superior to the Be containing alloy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.62-62
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• 2008

As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.120-120
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• 2006

탄소나노튜브는 nm급의 크기에 높은 전기전도도, 열전도 효율, 감한 기계적 강도 등의 장점을 가지며, FED(Field Emission Display), 극미세 전자 스위칭 소자, SET(Single Electron Transistor), AFM(Atomic Force Microscope) tip등 여러 분야로의 응용을 연구하고 있다. 본 연구에서는 탄소나노튜브를 Si 웨이퍼 위에 Ni/Ti 금속층을 촉매층으로 사용하고, 암모니아($NH_3$)가스와 아세틸렌 ($C_2H_2$)가스를 각각 희석가스와 성장원으로 사용하여 합성하였다. 탄소나노튜브의 성장은 Hot filament 화학기상증측(HFPECVD) 방식을 사용하였으며, 이 방법은 다량의 합성, 높은 균일성, 좋은 정렬 특성등의 장점을 가진다. 성장 온도는 탄소나노튜브의 성장 특성을 변화시키는 중요한 요소이다. 성장 온도에 따라 수직적 성장, 성장 밀도등의 특성 변화를 관찰하였다. 성장된 탄소나노튜브층 성분 분석은 에너지 분산형 X-선 측정기(EDS)를 통해 관찰하였고, 끝단에 촉매층이 존재하는 30~50 nm 폭을 가진 다중벽 탄소나노튜브를 고배율 투과전자현미경(HRTEM) 분석을 통해 관찰하였다. 전계방사 주사전자현미경(FESEM) 분석을 동해 1~3${\mu}m$의 길이를 가진 탄소나노튜브가 높은 밀도로 성장된 것을 확인하였다.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.2 s.31
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• pp.23-28
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• 2004

We utilized Ag capping layer for fluxless bonding. To investigate the effect of Ag capping layer, two sets of sample were used. One set was bare In and Sn solders. The other set was In and Sn solders with Ag capping layer. In ($10{\mu}m$) and Sn ($10{\mu}m$) solders were deposited on Cu/Ti/Si substrate using thermal-evaporation, and Ag ($0.1{\mu}m$) capping layers were deposited on In and Sn solders. Solder joints were made by joining two In and Sn deposited specimens at $130^{\circ}C$ for 30 s under 0.8, 1.6, 3.2 MPa using thermal compression bonder. The contact resistance was measured using four-point probe method. The shear strength of the solder joints was measured by the shear test of cross-bar sample in the direction. The microstructure of the solder joints was characterized with SEM and EDS. In and Sn solders without Ag capping layers were only bonded at $130^{\circ}C$ under high bonding pressure. Also the shear strength of the In-Sn solder joints under was lower than that of the Ag/In-Ag/Sn solder joints. The resistance of the solder joints was $2-4\;m{\Omega}$ The solder joints consisted of In-rich phase and Sn-rich phase and the intermixed compounds were found at the interface. As bonding pressure increased, the intermixed compounds formed more.

• Journal of The Korean Astronomical Society
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• v.52 no.3
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• pp.57-69
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• 2019

We present an analysis of the chemical abundances and kinematics of six low-mass dwarf stars, previously claimed to be candidate hypervelocity stars (HVSs). We obtained moderate-resolution (R ~ 6000) spectra of these stars to estimate the abundances of several chemical elements (Mg, Si, Ca, Ti, Cr, Fe, and Ni), and derived their space velocities and orbital parameters using proper motions from the Gaia Data Release 2. All six stars are shown to be bound to the Milky Way, and in fact are not even considered high-velocity stars with respect to the Galactic rest frame. Nevertheless, we attempt to characterize their parent Galactic stellar components by simultaneously comparing their element abundance patterns and orbital parameters with those expected from various Galactic stellar components. We find that two of our program stars are typical disk stars. For four stars, even though their kinematic probabilistic membership assignment suggests membership in the Galactic disk, based on their distinct orbital properties and chemical characteristics, we cannot rule out exotic origins as follows. Two stars may be runaway stars from the Galactic disk. One star has possibly been accreted from a disrupted dwarf galaxy or dynamically heated from a birthplace in the Galactic bulge. The last object may be either a runaway disk star or has been dynamically heated. Spectroscopic follow-up observations with higher resolution for these curious objects will provide a better understanding of their origin.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.5-5
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• 2009

Thin-film-transistors (TFTs) that can be prepared at low temperatures have attracted much attention because of the great potential for transparent and flexible electronics. One of the mainstreams in this field is the use of organic semiconductors such as pentacene. But device performance of the organic TFTs is still limited due to low field-effect mobility and rapid degradation after exposing to air. Alternative approach is the use of amorphous oxide semiconductors as a channel. Amorphous oxide semiconductors (AOSs) based TFTs showed the fast technological development, because AOS films can be fabricated at room temperature and exhibit the possibility in application like flexible display, electronic paper, and larges solar cells. Among the various AOSs, a-IGZO has lots of advantages because it has high channel mobility, uniform surface roughness and good transparency. [1] The high mobility is attributed to the overlap of spherical s-orbital of the heavy post-transition metal cations. This study demonstrated the effect of the variation in channel thickness from 30nm to 200nm on the TFT device performance. When the thickness was increased, turn-on voltage and subthreshold swing was decreased. The a-IGZO channels and source/drain metals were deposited with shadow mask. The a-IGZO channel layer was deposited on $SiO_2$/p-Si substrates by RF magnetron sputtering, where RF power is 150W. And working pressure is 3m Torr, at $O_2/Ar$ (2/28 sccm) atmosphere. The electrodes were formed with electron-beam evaporated Ti (30 nm) and Au (70 nm) bilayer. Finally, Al (150nm) as a gate metal was thermal-evaporated. TFT devices were heat-treated in a furnace at 250 $^{\circ}C$ and nitrogen atmosphere for 1hour. The electrical properties of the TFTs were measured using a probe-station. The TFT with channel thickness of 150nm exhibits a good subthreshold swing (SS) of 0.72 V/decade and on-off ratio of $1{\times}10^8$. The field effect mobility and threshold voltage were evaluated as 7.2 and 8 V, respectively.

• Applied Chemistry for Engineering
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• v.17 no.5
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• pp.458-464
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• 2006

The Pd-Ni-Ag alloy composite membrane using modified porous stainless steel (PSS) as a substrate was prepared by a electroless plating technique. In this work, we have introduced the intermediate layer between Pd-based alloy and a metal substrate. As an intermediate layer, the mixtures of nickel powder and inorganic sol such as $SiO_{2}$ sol, $Al_{2}O_{3}$ sol, and $TiO_{2}$ sol were used. The intermediate layers were coated onto a PSS substrate according to various membrane preparation conditions and then $N_{2}$ fluxes through the membranes with different intermediate layers were measured. The surface morphology of the intermediate layer in the mixture of nickel powder and inorganic sol was analyzed using scanning electron microscope (SEM). Finally, the Pd-Ni-Ag alloy composite membrane using the support coated with the mixture of nickel powder and silica as an intermediate layer was fabricated and then the gas permeances for $H_{2}$ and $N_{2}$ through the Pd-based membrane were investigated. The selectivity of $H_2/N_2$ was infinite and the $H_{2}$ flux was $1.39{\times}10^{-2}mol/m^2{\cdot}s$ at the temperature of $500^{\circ}C$ and trans-membrane pressure difference of 1 bar.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2002.07a
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• pp.25-37
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• 2002

The most important industrial application of gamma radiation in characterizing green compacts is the determination of the density. Examples are given where this method is applied in manufacturing technical components in powder metallurgy. The requirements imposed by modern quality management systems and operation by the workforce in industrial production are described. The accuracy of measurement achieved with this method is demonstrated and a comparison is given with other test methods to measure the density. The advantages and limitations of gamma ray densitometry are outlined. The gamma ray densitometer measures the attenuation of gamma radiation penetrating the test parts (Fig. 1). As the capability of compacts to absorb this type of radiation depends on their density, the attenuation of gamma radiation can serve as a measure of the density. The volume of the part being tested is defined by the size of the aperture screeniing out the radiation. It is a channel with the cross section of the aperture whose length is the height of the test part. The intensity of the radiation identified by the detector is the quantity used to determine the material density. Gamma ray densitometry can equally be performed on green compacts as well as on sintered components. Neither special preparation of test parts nor skilled personnel is required to perform the measurement; neither liquids nor other harmful substances are involved. When parts are exhibiting local density variations, which is normally the case in powder compaction, sectional densities can be determined in different parts of the sample without cutting it into pieces. The test is non-destructive, i.e. the parts can still be used after the measurement and do not have to be scrapped. The measurement is controlled by a special PC based software. All results are available for further processing by in-house quality documentation and supervision of measurements. Tool setting for multi-level components can be much improved by using this test method. When a densitometer is installed on the press shop floor, it can be operated by the tool setter himself. Then he can return to the press and immediately implement the corrections. Transfer of sample parts to the lab for density testing can be eliminated and results for the correction of tool settings are more readily available. This helps to reduce the time required for tool setting and clearly improves the productivity of powder presses. The range of materials where this method can be successfully applied covers almost the entire periodic system of the elements. It reaches from the light elements such as graphite via light metals (AI, Mg, Li, Ti) and their alloys, ceramics ($AI_20_3$, SiC, Si_3N_4, $Zr0_2$, ...), magnetic materials (hard and soft ferrites, AlNiCo, Nd-Fe-B, ...), metals including iron and alloy steels, Cu, Ni and Co based alloys to refractory and heavy metals (W, Mo, ...) as well as hardmetals. The gamma radiation required for the measurement is generated by radioactive sources which are produced by nuclear technology. These nuclear materials are safely encapsulated in stainless steel capsules so that no radioactive material can escape from the protective shielding container. The gamma ray densitometer is subject to the strict regulations for the use of radioactive materials. The radiation shield is so effective that there is no elevation of the natural radiation level outside the instrument. Personal dosimetry by the operating personnel is not required. Even in case of malfunction, loss of power and incorrect operation, the escape of gamma radiation from the instrument is positively prevented.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.