• 대한기계학회논문집A
• /
• 제40권3호
• /
• pp.267-273
• /
• 2016

본 연구에서는 부분 안정화 지르코니아(Z)와 자기치유능력을 부여하기 위하여 SiC와 $TiO_2$를 첨가한 5종류의 복합 지르코니아(ZS, ZST1, ZST2, ZST3, ZST5)를 소결하여, 기계적 특성과 열처리에 의한 균열 치유 가능성을 평가하였다. 6종류 지르코니아 세라믹스의 비커스 경도는 큰 차이가 없으며, 부분 안정화 지르코니아에 SiC 첨가(ZS)는 급격한 굽힘강도의 저하가 나타났지만, $TiO_2$의 첨가(ZST1, ZST2, ZST3, ZST5)는 강도가 향상하였다. 이는 SiC 및 $TiO_2$의 첨가의 따른 결정화의 영향이라 판단된다. 최고 굽힘 강도를 나타내는 균열 치유 조건에서 지르코니아 단상체는 비커스 균열이 남았으나, SiC가 첨가된 4종류는 비커스 균열이 관찰되지 않아 균열이 치유되었다.

• 한국재료학회지
• /
• 제12권11호
• /
• pp.835-839
• /
• 2002

Metal-Ferroelectric-Metal(MFM) capacitors were prepared using $Bi_{3.3}$ $La_{0.7}$ $Ti_3$$O_{12}$ (BLT) ferroelectric thin films which were spin coated on $Pt/Ti/SiO_2$/Si substrates by the Sol-Gel method. BLT thin films annealed at above $650^{\circ}C$ showed polycrystalline structures with typical c-axis preferred orientation. The grain size and surface roughness were increased as the annealing temperature increased from $650^{\circ}C$ to $700^{\circ}C$. In addition, the full width at half maximum (FWHM) values were decreased with increasing annealing temperatures, indicating the improvement of crystallinity. The remanent polarization (2Pr= $Pr^{+}$ $+Pr^{-) }$ and leakage current of the BLT film annealed at $650^{\circ}C$ were about 29.3 $\mu$C/cm$^2$ and $2.3$\times$10^{-8}$$ A/cm^2$ at 3V. There were no distinct changes in the retention charges after $10^{10}$ polarization switching cycles, showing good fatigue property of the annealed BLT films.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2007년도 제38회 하계학술대회
• /
• pp.1303-1304
• /
• 2007

The composites were fabricated, respectively, using 61[vol.%]SiC-39[vol.%]$TiB_2$ and using 61[vol.%]SiC-39[vol.%]$ZrB_2$ powders with the liquid forming additives of 12[wt%] $Al_{2}O_{3}+Y_{2}O_{3}$ by hot pressing annealing at $1650[^{\circ}C]$ for 4 hours. Reactions between SiC and transition metal $TiB_2$, $ZrB_2$ were not observed in this microstructure. ${\beta}{\rightarrow}{\alpha}$-SiC phase transformation was occurred on the SiC-$TiB_2$ and SiC-$ZrB_2$ composite. The relative density, the flexural strength and Young's modulus showed the highest value of 98.57[%], 226.06[Mpa] and 86.38[Gpa] in SiC-$ZrB_2$ composite at room temperature respectively. The electrical resistivity showed the lowest value of $7.96{\times}10^{-4}[{\Omega}{\cdot}cm]$ for SiC-$ZrB_2$ composite at $25[^{\circ}C]$. The electrical resistivity of the SiC-$TiB_2$ and SiC-$ZrB_2$ composite was all positive temperature coefficient resistance (PTCR) in the temperature ranges from $25[^{\circ}C]$ to $700[^{\circ}C]$. The resistance temperature coefficient of composite showed the value of $6.88{\times}10^{-3}/[^{\circ}C]$ and $3.57{\times}10^{-3}/[^{\circ}C]$ for SiC-$ZrB_2$ and SiC-$TiB_2$ composite in the temperature ranges from $25[^{\circ}C]$ to $700[^{\circ}C]$.

• 한국재료학회지
• /
• 제3권1호
• /
• pp.12-18
• /
• 1993

단결정 실리콘위에 스퍼터법으로 증착된 티타니움막을 급속가열로에서 고상반응에 의해 형성시킨 면저항 1.2 ohm/sq. 내외의 TiS$i_2$ 박막에 있어서 열안정성을 상부절연막의 유무 및 종류에 따라 조사하였다. 상부절연막은 상압 CVD로 증착한 USG(Undoped Silicate Glass, Si$i_2$) 막과 플라즈마 CVD법으로 증착한 PE-SiN(S$i_3$$N_4$)막을 사용했다. 열안정성 평가는 90$0^{\circ}C$에서 시간을 달리하여 TiS$i_2$막, PE-SiN막, USG막의 스트레스는 각각 1.3${\times}{10^{9}}$, 1.25 ${\times}{10^{10}}$, 2.26 ${\times}{10^{10}}$ dyne/c$m^2$의 인장응력을 나타내었다. 응집현상은 TiS$i_2$의 응집현상은 Nabarro-Herring 마이크로 크리프에 의한 원자의 확산관점에서 검토되었다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
• /
• pp.406-407
• /
• 2006

This paper describes the ohmic contact formation between a TiW film as a contact material deposied by RF magnetron sputter and polycrystalline 3C-SiC films deposied on thermally grown Si wafers. The specific contact resistance (${\rho}_c$) of the TiW contact was measured by using the C-TLM. The contact phase and interfacial reaction between TiW and 3C-SiC at high-temperature were also analyzed by XRD and SEM. All of the samples didn't show cracks of the TiW film and any interfacial reaction after annealing. Especially, when the sample was annealed at $800^{\circ}$ for 30min., the lowest contact resistivity of $2.90{\times}10^{-5}{\Omega}cm^2$ was obtained due to the improved interfacial adhesion.

• 한국재료학회지
• /
• 제1권3호
• /
• pp.168-174
• /
• 1991

Ti-Silicides를 single-Si wafer와 그 위에 oxide를 성장시킨 기판위에 composite target($TiSi_{2.6}$)을 sputtering함으로써 증착시켰다. 증착된 비정질 상태의 Ti-silicide는 급속 열처리(RTA)방법으로 $600^{\circ}C$에서 $850^{\circ}C$가지 20초간 처리하였다. RTA온도가 $800^{\circ}C$가 되어서야 비로소 안정한 $TiSi_2$가 형성되었으며, 그 때의 비저항 값은 $27~29{\mu}\Omega-cm$로 Ti-metal reactive방법에 의한 $TiSi_2$보다 약간 높은 값으로 드러났다. X-ray로 상천이를 조사한 결과 역시 $750^{\circ}C$가지 C49 $TiSi_2$가 형성되고, $800^{\circ}C$가 되어서야 안정한 C54 $TiSi_2$로의 상천이가 일어남을 나타내고 있다. 또한 완전히 형성된 Ti-silicide의 조성비는 x-ray photoelectron spectroscopy(XPS)결과에서 Ti : Si이 1 : 2로 드러났으며, 그 동안 reactive 시켰을 때 $TiSi_2$의 단점으로 지적되어 왔던 형성 완료된 $TiSi_2$의 surface roughness는 $17{\pm}1mm$이내로 매우 우수한 값으로 판명되어, device에 대한 응용 가능성을 높이고 있다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제50권10호
• /
• pp.500-503
• /
• 2001

The mechanical and electrical properties of the hot-pressed and pressureless annealed SiC+39vol.%$TiB_2$electroconductive ceramic composites were investigated as a function of the liquid additives of $Al_2O_3+Y_2O_3$. The result of phase analysis for the SiC+39vol.%$TiB_2$composites by XRD revealed $\alpha$-SiC(6H), $TiB_2$, and $YAG(Al_5Y_3O_{12})4 crystal phase. The relative density of SiC+39vol.%$TiB_2$ composites was increased with increased $Al_2O_3+Y_2O_3$. contents. The fracture toughness showed the highest value of $7.8 MPa.m^{1/2}$ for composites added with 12 wt % $Al_2O_3+Y_2O_3$. additives at room temperature. The electrical resistivity and the resistance temperature coefficient showed the lowest value of $7.3\times10_{-4}\Omega.cm\; and\; 3.8\times10_{-3}/^{\circ}C$ for composite added with 12 wt% $Al_2O_3+Y_2O_3$. additives at room temperature. The electrical resistivity of the SiC+39vol.%$TiB_2$composites was all positive temperature coefficient resistance(PTCR) in the temperature ranges from $25^{\circ}C\; to\; 700^{\circ}C$.

• 한국재료학회지
• /
• 제9권6호
• /
• pp.577-582
• /
• 1999

전도성 $Si_3N_4$-TiN 세라믹 복합재료를 제조하기 위해 성형체를 $1450^{\circ}C$에서 20시간 질화처리한 후 $1950^{\circ}C$에서 3.5시간 가스압소결 기술에 의해 후소결하였다. 초기 분말로 약 $10\mu\textrm{m}$로 된 상용 Si분말, 100mesh와 325mesh로된 Ti분말, 그리고 미세한 $\2.5mu\textrm{m}$ TiN분말을 사용하였다. Ti분말울 사용한 $Si_3N_4$-TiN 소결체에서 상대밀도 및 파괴인성값은 다량의 조대한 기공의 존재로 인하여 낮은 값을 보였다. 그러나 TiN분말을 사용한 $Si_3N_4$-TiN 복합체에서 파괴인성, 파괴강도 및 전기저항은 각각 $5.0MPa{\cdot}m^{1/2}$, 624MPa 그리고 $1400{\omega}cm$였다. 복합체에서 TiN 업자의 분산은 $Si_3N_4$ 업자의 조대한 봉상형태로의 성장올 방해하며 $Si_3N_4$/TiN 계면에 강한 변형장울 만든다. $Si_3N_4$-TiN 복합체의 전기전도도 및 기계적 특성을 향상시키기 위해 TiN 업자가 균일하게 분산 된 미세조직 제어가 요망된다.

• 한국재료학회지
• /
• 제12권11호
• /
• pp.889-893
• /
• 2002

The reactions of $Cu/Ti/SiO_2$ structures at temperatures ranging from 200 to $700^{\circ}C$ have been studied for various Ti thicknesses. The reaction products initially formed, at around $300^{\circ}C$, were a series of Cu-Ti intermetallics ($Cu_3$Ti/CuTi) with the oxygen dissolved in the Ti moving from the compounds into the remaining unreacted Ti. At $500^{\circ}C$, the $Cu_3$Ti was converted into Cu-rich intermetallics, $Cu_4$Ti, which grew at the expense of the CuTi due to the increased oxygen content in the Ti. In addition, the outdiffusion of Ti, to the Cu surface, and the $Ti-SiO_2$ reactions, caused an abrupt increase in the oxygen content in the Ti layer, which placed thermodynamic restraints on further Ti reactions. Furthermore, thinner Ti layers showed a higher increasing rate of oxygen accumulation for the same consumption of Ti, which led to significantly reduced Ti consumption. The $SiO_2$ film under the Ti diffusion barrier was more easily destroyed with increasing Ti thickness.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제52권2호
• /
• pp.80-84
• /
• 2003

The mechanical and electrical properties of the hot-pressed and pressureless annealed SiC-Ti $B_2$electroconductive ceramic composites were investigated as functions of the liquid additives of $Al_2$ $O_3$+ $Y_2$ $O_3$. The result of phase analysis for the SiC-Ti $B_2$ composites by XRD revealed $\alpha$-SiC(6H), Ti $B_2$, and YAG(A $l_{5}$ $Y_3$ $O_{12}$ ) crystal phase. The relative density of SiC-Ti $B_2$ composites was increased with increased $Al_2$ $O_3$+ $Y_2$ $O_3$ contents. The fracture toughness showed the highest value of 6.04 Mpa $m^{\frac{1}{2}}$ for composites added with l2wt% A1$_2$ $O_3$+ $Y_2$ $O_3$ additives at room temperature. The electrical resistivity showed the lowest value of 6.2$\times$10$^{-3}$ $\Omega$ㆍcm for composite added with l6wt% $Al_2$ $O_3$+ $Y_2$ $O_3$ additives at room temperature. The electrical resistivity of the SiC-Ti $B_2$ composites was all positive temperature cofficient resistance(PTCR) in the temperature ranges from $25^{\circ}C$ to $700^{\circ}C$.