• 한국생산제조학회지
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• 제20권4호
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• pp.490-494
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• 2011

In this paper, using by rapid heating and cooling systems for injection molding and temperatures to changes. In the process of molding temperature and pressure inside the mold was found. In addition, the tensile strength of test specimens were molded, mechanical properties of injection molded parts were identified on mold temperature. Copper could withstand more tensile force than NAK. Therefore, it can be concluded that materials with high heat conductivity must be used in thin walled products.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 추계학술대회 논문집
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• pp.75-76
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• 2008

• 대한기계학회논문집A
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• 제31권5호
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• pp.556-561
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• 2007

The rapid thermal response(RTR) molding is a novel process developed to raise the temperature of mold surface rapidly in the injection stage and then cool rapidly to the ejection temperature by air or water. The objectives of this paper are to investigate the effect of mold temperature, pressure and thickness of micro pattern molding and to provide a optimization of RTR injection molding for micro pattern from Moldflow simulation. Optimal minimum temperature and pressure was found without shortcut according to thickness. Filling percentage was influenced by glass transition temperature with the kinds of resin. Optimal temperature is slightly higher than glass transition temperature irrespectively of pressure, thickness, the kinds of resin in the micro pattern molding.

• 소성∙가공
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• 제17권8호
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• pp.657-661
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• 2008

Recently, products of electronic industry and related parts are required to have the thickness thinner and thinner to reduce the part weight. To go with this trend, LGP(light guide plate) of LCD-BLU(Liquid Crystal Display-Back Light Unit: It is one of kernel parts of LCD) for cell phone has the thickness of ${\sim}0.3mm$ and the battery case of cell phone has ${\sim}0.25mm$. Accordingly, high speed injection molding is required to mold products which have thinner parts. To achieve high speed injection and proper control of hydraulic unit, various design was applied to conventional injection unit. In the present paper, we concentrated on the molding stability of hydro-mechanical high speed injection machine to make an LGP of 0.3mm thickness.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.425-426
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• 2010

• Design & Manufacturing
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• 제10권2호
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• pp.50-54
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• 2016

In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

• 소성∙가공
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• 제23권1호
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• pp.41-48
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• 2014

The light guide plate has become the major component for the backlight module in general information technology products (e.g. mobile phones, monitors, etc.). High speed injection molding has been adopted for thin walled LGP giving advantages such as weight, shape, size, and reduction in production costs. In the current study, the rheological characteristics of high liquidity plastic resin PC(HL8000) were measured using a capillary rheometer to improve the reliability of the numerical analysis for high speed injection molding. With the measured viscosity and PVT of PC(HL8000), numerical analysis of injection molding was conducted using the simulation software(Moldflow). Filling time and deflection were predicted and compared with those of traditional PC resins(H3000, H4000). The results show that PC(HL8000) has significantly different rheological characteristics during high speed injection molding. Hence proper properties of the resin should be used to improve the accuracy of numerical predictions.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1601-1604
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• 2005

The demand increasing of optical applications like as display devices derives interest for fabrication process. The product s development is apt to fabricate numerous thin and wide surfaces with micro pattern. Naturally that needs injection molding fabrication for the mass production. In existing manufacturing, the product quality is controlled by input fabrication condition from the outside. That can be called as a try and error method and not fundamentally solve the troubles; imperfect replication, war page, short shot, etc. To understand the cause and bring a solution, it is needed that check of changing in the cavity. This study can catch them. Data acquisition system about temperature and pressure distribution is settled and can get some data. From this research, other studies related with DAQ in cavity can start on the easier step.

• Design & Manufacturing
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• 제10권3호
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• pp.1-7
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• 2016

In the semiconductor industry the memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. After injection molding process the side gates were needed to remove for further assembly process. ln this study, the cold press cutting process was applied to remove the gates. For design of punch and die, the cold press cutting analysis was implemented by$DEFORM-2D^{TM}$ ln consideration of the simulation results, an adequate punch and die was designed and made for the cutting unit. In order to verify the performance of cutting process, the roughness of cutting section of the part was measured and was satisfied in requirement.

• 대한기계학회논문집A
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• 제31권5호
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• pp.594-600
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• 2007

Rapid mold heating has been recent issue to enable the injection molding of thin-walled parts or micro/nano structures. Induction heating is an efficient way to heat a conductive workpiece by means of high-frequency electric current caused by electromagnetic induction. Because the induction heating is a convenient and efficient way of indirect heating, it has various applications such as heat treatment, brazing, welding, melting, and mold heating. The present study covers an experimental investigation on the rapid heating using the induction heating and rapid cooling using a vortex tube in order to eliminate an excessive cycle time increase. Experiments are performed in the case of a steel cup mold core with various heating and cooling conditions. Temperature is measured during heating and cooling time, from which appropriate mold heating and cooling conditions can be obtained.