• Title/Summary/Keyword: Thin-film manufacturing process

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New SMOLED Deposition System for Mass Production

  • Lee, J.H.;Kim, C.W.;Choi, D.K.;Kim, D.S.;Bae, K.B.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.407-410
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    • 2003
  • We will introduce our new concept deposition system for SMOLED manufacturing in this conference. This system is designed to deposit organic and metal material to downward to overcome the limit of substrate size and process tact time hurdle for OLED mass production, and is organized with organic deposition chamber, substrate pre-cleaning chamber, metal deposition chamber and encapsulation system. These entire process chambers are integrated with linear type substrate transfer system. We also compare our new SMOLED manufacturing system with conventional vacuum deposition systems, and show basic organic thin film property data, organic material deposition property data, and basic device property.

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Characterization of $CuInSe_2$ thin film depending on deposition parameters (박막증착조건 변화에 따른 $CuInSe_2$ 박막의 특성에 관한 연구)

  • Kim, Young-Jun;Yang, Hyeon-Hun;So, Soon-Youl;Jeong, Woon-Jo;Park, Gye-Choon;Lee, Jin;Chung, Hae-Deok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.12a
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    • pp.119-122
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    • 2006
  • Process variables for manufacturing the $CuInSe_2$ thin film were established in order to clarify optimum conditions for growth of the thin film depending upon process conditions (substrate temperature, sputtering pressure, DC/RF Power), and then by changing a number of vapor deposition conditions and Annealing conditions variously, structural and electrical characteristics were measured. Thereby, optimum process variables were derived. For the manufacture of the $CuInSe_2$, Cu, In and Se were vapor-deposited in the named order. Among them, Cu and In were vapor-deposited by using the sputtering method in consideration of their adhesive force to the substrate, and the DC/RF power was controlled so that the composition of Cu and In might be 1:1, while the surface temperature having an effect on the quality of the thin film was changed from 100[$^{\circ}C$] to 300[$^{\circ}C$] at intervals of 50[$^{\circ}C$].

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A Study on Fabrication of La0.5Sr0.5CoO3Thin Films as an Electrode for Ferroelectric Memory by Self-patterning Technique (Self-patterning 기술을 이용한 강유전체 메모리 전극용La0.5Sr0.5CoO3박막의 제조에 관한 연구)

  • 손현수;김병호
    • Journal of the Korean Ceramic Society
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    • v.40 no.2
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    • pp.153-158
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    • 2003
  • Self-patterning of thin films using photosensitive sol solution has advantages such as simple manufacturing process compared to photoresist/dry etching process. In this study,$La_{0.5}SR_{0.5}CoO_3$(LSCO) thin films as an electrode material for ferroelectric memories have been prepared by spin coating method using photosensitive sol solution. La-2methoxyethoxide, Sr-ethoxide, Co-2methoxyethoxide were used as starting materials. As UV exposure time to the LSCO gel thin film increased, the UV absorption peak intensity of metal${beta}$-diketonate decreased due to reduced solubility by M(metal)-O-M bond formation. Solubility difference by UV irradiation on LSCO gel thin film allows to obtain a fine patterning of thin film. The LSCO thin films annealed over$680{\circ}C$ in air showed perovskite phase and the lowest resistivity$(4{ imes}10^{-3}{Omega}cm)$ of the thin films were obtained by annealing at$740{\circ}C$.

Direct Current (DC) Bias Stress Characteristics of a Bottom-Gate Thin-Film Transistor with an Amorphous/Microcrystalline Si Double Layer

  • Jeong, Tae-Hoon;Kim, Si-Joon;Kim, Hyun-Jae
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.5
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    • pp.197-199
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    • 2011
  • In this paper, the bottom-gate thin-film transistors (TFTs) were fabricated with an amorphous/microcrystalline Si double layer (DL) as an active layer and the variations of the electrical characteristics were investigated according to the DC bias stresses. Since the fabrication process of DL TFTs was identical to that of the conventional amorphous Si (a-Si) TFTs, it creates no additional manufacturing cost. Moreover, the amorphous/microcrystalline Si DL could possibly improve stability and mass production efficiency. Although the field effect mobility of the typical DL TFTs is similar to that of a-Si TFTs, the DL TFTs had a higher reliability with respect to the direct current (DC) bias stresses.

Fabrication and Properties of Thin-Film Inductors with Magnetic Core (박막 자심 인덕터의 제조와 특성)

  • Kim, Hyun-Sik;Min, Bok-Ki;Byun, Woo-Bong;Kim, Ki-Uk;Song, Jae-Sung;Oh, Young-Woo
    • Proceedings of the KIEE Conference
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    • 1997.07d
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    • pp.1314-1316
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    • 1997
  • In this study, We fabricated thin film magnetic core inductors by using thin film manufacturing techniques such as photolithography and wet etching process. The inductors were prepared using multi-layered CoNbZr/Cu/CoNbZr. These devices are measured at high frequency range of $1\;MHz{\sim}1\;GHz$.

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The Effect of the Preformed Oil or Oxide Film on the Lubricated Sliding Surfaces. (윤활마찰시에 윤활피막 혹은 산화막이 초기 마찰특성에 미치는 영향)

  • 강석춘
    • Tribology and Lubricants
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    • v.2 no.1
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    • pp.53-60
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    • 1986
  • The methods to prevent or suppress the initial failure of the sliding surfaces by the formation of the protection film during the manufacturing process were studied. Now it has been known that the surface protection film which was formed during the running-in process is mainly $Fe_3O_4$ and its film was formed only at the limited oxygen ability during the lubricated sliding. So it was tried to form the same oxide film before the sliding by heat treatment at 300$\circ$C with the wetted specimen by oil. The results show that a thin oxide film ($Fe_3O_4$) was formed on the surface beneath the solid oil film and the specimen with this film has much better friction properties than those prepared with heat treatment at 500$\circ$C and 700$\circ$C or the original one.

Effect of Thin-Film Thickness on Electrical Performance of Indium-Zinc-Oxide Transistors Fabricated by Solution Process (용액 공정을 이용한 IZO 트랜지스터의 전기적 성능에 대한 박막 두께의 영향)

  • Kim, Han-Sang;Kyung, Dong-Gu;Kim, Sung-Jin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.8
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    • pp.469-473
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    • 2017
  • We investigated the effect of different thin-film thicknesses (25, 30, and 40 nm) on the electrical performance of solution-processed indium-zinc-oxide (IZO) thin-film transistors (TFTs). The structural properties of the IZO thin films were investigated by atomic force microscopy (AFM). AFM images revealed that the IZO thin films with thicknesses of 25 and 40 nm exhibit an uneven distribution of grains, which deforms the thin film and degrades the performance of the IZO TFT. Further, the IZO thin film with a thickness of 30 nm exhibits a homogeneous and smooth surface with a low RMS roughness of 1.88 nm. The IZO TFTs with the 30-nm-thick IZO film exhibit excellent results, with a field-effect mobility of $3.0({\pm}0.2)cm^2/Vs$, high Ion/Ioff ratio of $1.1{\times}10^7$, threshold voltage of $0.4({\pm}0.1)V$, and subthreshold swing of $0.7({\pm}0.01)V/dec$. The optimization of oxide semiconductor thickness through analysis of the surface morphologies can thus contribute to the development of oxide TFT manufacturing technology.

[ LiCoO2 ] Thin Film Deposited by Bias Sputtering Method I. Electrochemical Characteristics (바이어스 스퍼터링 법으로 제조된 LiCoO2박막 I. 전기화학적 특성)

  • Lee, Y.J.;Park, H.Y.;Cho, W.I.;Cho, B.W.;Kim, K.B.
    • Journal of the Korean Electrochemical Society
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    • v.6 no.4
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    • pp.261-265
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    • 2003
  • The heat treatment process of thin film microbatteries manufacturing processes has several Problems. This study, without heat treatment, considered the characteristics of $LiCoO_2$ thin films deposited by bais sputtering method inducing the structural change of the thin film. The properties of deposited $LiCoO_2$ thin films such as crystal structure, morphology, and discharge capacity were observed by various analysis methods. Among $LiCoO_2$ thin films deposited by substrate bias $voltage(V_b)$, the one deposited by substrate bias voltage of -50V had the highest initial discharge capacity of about $60{\mu}Ah/cm^2{\mu}m.$ We confirmed that $LiCoO_2$ thin film could be used as cathode material of lithium thin film microbatteries without annealing.

A Study on the Organic-Inorganic Multilayer Barrier Thin Films Using R2R Low-Temperature Atmospheric-Pressure Atomic Layer Deposition System (연속공정기반 저온 상압 원자층 증착 시스템을 이용한 유무기 멀티레이어 배리어 박막에 관한 연구)

  • Lee, Jae-Wook;Kim, Hyun-Bum;Choi, Kyung-Hyun
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.17 no.3
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    • pp.51-58
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    • 2018
  • In this paper, the organic material Poly(methyl methacrylate) PMMA is used with inorganic $Al_2O_3$ to fabricate organic-inorganic multilayer barrier thin films. The organic thin films are developed using a roll-to-roll electrohydrodynamic atomization system, whereas the inorganic are grown using a roll-to-roll low-temperature atmospheric pressure atomic layer deposition system. For the first time, these two technologies are used together to develop organic-inorganic multilayer barrier thin films in atmospheric condition. The films are grown under optimized parameters and classified into three classes based on the layer structures, when the total thickness of the barrier is maintained at ~ 160 nm. All classes of barriers show good morphological, optical and chemical properties. The $Al_2O_3$ films with a low average arithmetic roughness of 1.58 nm conceal the non-uniformity and irregularities in PMMA thin films with a roughness of 5.20 nm. All classes of barriers show a notably good optical transmission of ~ 85 %. The hybrid organic-inorganic barriers show water vapor and oxygen permeation in the range of ${\sim}3.2{\times}10^{-2}g/m^2/day$ and $0.015cc/m^2/day$ at $23^{\circ}C$ and 100% relative humidity. It has been confirmed that it can be mass-produced and used as a low-cost barrier thin film in various printing electronic devices.

What Is the Key Vacuum Technology for OLED Manufacturing Process?

  • Baek, Chung-Ryeol
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.95-95
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    • 2014
  • An OLED(Organic Light-Emitting Diode) device based on the emissive electroluminescent layer a film of organic materials. OLED is used for many electronic devices such as TV, mobile phones, handheld games consoles. ULVAC's mass production systems are indispensable to the manufacturing of OLED device. ULVAC is a manufacturer and worldwide supplier of equipment and vacuum systems for the OLED, LCD, Semiconductor, Electronics, Optical device and related high technology industries. The SMD Series are single-substrate sputtering systems for deposition of films such as metal films and TCO (Transparent Conductive Oxide) films. ULVAC has delivered a large number of these systems not only Organic Evaporating systems but also LTPS CVD systems. The most important technology of thin-film encapsulation (TFE) is preventing moisture($H_2O$) and oxygen permeation into flexible OLED devices. As a polymer substrate does not offer the same barrier performance as glass substrate, the TFE should be developed on both the bottom and top side of the device layers for sufficient lifetimes. This report provides a review of promising thin-film barrier technologies as well as the WVTR(Water Vapor Transmission Rate) properties. Multilayer thin-film deposition technology of organic and inorganic layer is very effective method for increasing barrier performance of OLED device. Gases and water in the organic evaporating system is having a strong influence as impurities to OLED device. CRYO pump is one of the very useful vacuum components to reduce above impurities. There for CRYO pump is faster than conventional TMP exhaust velocity of gases and water. So, we suggest new method to make a good vacuum condition which is CRYO Trap addition on OLED evaporator. Alignment accuracy is one of the key technologies to perform high resolution OLED device. In order to reduce vibration characteristic of CRYO pump, ULVAC has developed low vibration CRYO pumps to achieve high resolution alignment performance between Metal mask and substrate. This report also includes ULVAC's approach for these issues.

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