• Title/Summary/Keyword: Thin-Film Theory

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Analytical Modeling of a Loop Heat Pipe with a Flat Evaporator by Applying Thin-Film Theory (평판형 증발부를 갖는 루프히트파이프에 대해 박막이론을 적용한 해석적 모델링)

  • Jung, Eui-Guk;Boo, Joon-Hong
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.12
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    • pp.1079-1085
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    • 2010
  • A steady-state analytical model was presented for a loop heat pipe (LHP) with an evaporator that has a flat geometry. On the basis of a series of reviews of the relevant literature, a sequence of calculations was proposed to predict the temperatures and pressures at each important part of the LHP: the evaporator, liquid reservoir (compensation chamber), liquid line, vapor line, and condenser. The analysis of the evaporator, which is the only part in the LHP that has a capillary structure, was emphasized. Thin-film theory is applied to account for the pressure and temperature in the region adjacent to the liquid-vapor interface in the evaporator. The present study introduced a unique method to estimate the liquid temperature at the interface. Relative freedom was assumed in the configuration of a condenser with a simplified liquid-vapor interface. Our steady-state model was validated by experimental results available in the literature. The relative error was within 3% on the absolute temperature scale, and reasonable agreement was obtained.

Prevention of thin film failures for 5.0-inch TFT arrays on plastic substrates

  • Seo, Jong-Hyun;Jeon, Hyung-Il;Nikulin, Ivan;Lee, Woo-Jae;Rho, Soo-Guy;Hong, Wang-Su;Kim, Sang-Il;Hong, Munpyo;Chung, Kyuha
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.700-702
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    • 2005
  • A 5.0-inch transmissive type plastic TFT arrays were successfully fabricated on a plastic substrate at the resolution of $400{\times}3{\times}300$ lines (100ppi). All of the TFT processes were carried out below $150^{\circ}C$ on PES plastic films. After thin film deposition using PECVD, thin film failures such as film delamination and cracking often occurred. For successful growth of thin films (about 1um) without their failures, it is necessary to solve the critical problem related to the internal compressive stress (some GPa) leading to delamination at a threshold thickness value of the films. The Griffith's theory explains the failure process by looking at the excess of elastic energy inside the film, which overcomes the cohesive energy between film and substrate. To increase the above mentioned threshold thickness value there are two possibilities: (i) the improvement of the interface adhesion (for example, through surface micro-roughening and/or surface activation), and (ii) the reduction of the internal stress. In this work, reducing a-Si layer film thickness and optimizing a barrier SiNx layer have produced stable CVD films at 150oC, over PES substrates

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Thickness-dependent Film Resistance of Thin Porous Film (얇은 다공 구조 박막에서의 두께에 따른 박막 저항 변화)

  • Song, A-Ree;Kim, Chul-Sung;Kouh, Tae-Joon
    • Journal of the Korean Magnetics Society
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    • v.22 no.1
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    • pp.6-10
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    • 2012
  • We have observed the change in the film resistance of thin nickel film up to 13 nm, which is deposited on a porous anodic alumina substrate, prepared by two-step anodization technique under phosphoric acid. The resulting film grows as a porous film, following the pore structure on the surface of the alumina substrate, and the value of the resistance lies above $150k{\Omega}$ within the range of thickness studied here, decreasing very slowly with the film thickness. The observed resistance value is much higher than the reported value of a uniform film at the same thickness. Since the observed value of the surface coverage with the pores is smaller than the critical value, expected from the percolation theory, the pore structure limits the formation of conduction channel across the film. In addition, by comparing to the typical model of thickness-dependent resistivity, we expect that the scattering at the pore edge further increases the film resistance.

Applying Theory of Constraint on Logistic Management in Large Scale Construction Sites - A Case Study of Steel Bar in TFT-LCD Factory Build-Up

  • Huang, Chih-Yao;Chen, Ching-Piao;Li, Rong-Kwei;Tsai, Chih-Hung
    • International Journal of Quality Innovation
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    • v.9 no.1
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    • pp.68-93
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    • 2008
  • The steel bars account for a high percentage of material costs for the current construction projects. At the present time, most of the construction projects for the factories of thin-film transistor liquid crystal display (TFT-LCD) complete the transactions of steel bars when the suppliers ship the steel bars to the temporary storage/processing sites. This paper applies the buy-in concept in the Theory of Constraint (TOC) on the supply chain of steel bars. In this study, suppliers are required to establish warehouses at the construction sites and complete the transactions when the formed and processed steel bars are shipped into the factory sites. The aim is to find a win-win solution to meet with the expectations from constructors as they hope that there is no need to build up inventories but supply is ready at any time. Also, this paper compares and analyzes the traditional supply/inventory model of steel bars and the Demand-Pull (D-P) model under the TOC framework. It is proved that Vendor Management Inventory (VMI) in the D-P model is able to more effectively manage steel bars as a material.

In-Plane Thermoelectric Properties of InGaAlAs Thin Film with Embedded ErAs Nanoparticles (ErAs 나노입자가 첨가된 InGaAlAs 박막의 평면정렬방향으로의 열전특성)

  • Lee, Yong-Joong
    • Korean Journal of Materials Research
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    • v.21 no.8
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    • pp.456-460
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    • 2011
  • Microelectromechanical systems (MEMS)-fabricated suspended devices were used to measure the in-plane electrical conductivity, Seebeck coefficient, and thermal conductivity of 304 nm and 516 nm thick InGaAlAs films with 0.3% ErAs nanoparticle inclusions by volume. The suspended device allows comprehensive thermoelectric property measurements from a single thin film or nanowire sample. Both thin film samples have identical material compositions and the sole difference is in the sample thickness. The measured Seebeck coefficient, electrical conductivity, and thermal conductivity were all larger in magnitude for the thicker sample. While the relative change in values was dependent on the temperature, the thermal conductivity demonstrated the largest decrease for the thinner sample in the measurement temperature range of 325 K to 425 K. This could be a result of the increased phonon scattering due to the surface defects and included ErAs nanoparticles. Similar to the results from other material systems, the combination of the measured data resulted in higher values of the thermoelectric figure of merit (ZT) for the thinner sample; this result supports the theory that the reduced dimensionality, such as in twodimensional thin films or one-dimensional nanowires, can enhance the thermoelectric figure of merit compared with bulk threedimensional materials. The results strengthen and provide a possible direction in locating and optimizing thermoelectric materials for energy applications.

Analysis of Microwave Permeability and Damping Constant in Amorphous CoFeHfO Thin Film (비정질 CoFeHfO 박막 재료의 마이크로파 투자율 및 감쇠상수 분석)

  • Kim, Dong-Young;Yoon, Seok-Soo
    • Journal of the Korean Magnetics Society
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    • v.19 no.4
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    • pp.147-151
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    • 2009
  • The saturation magnetization and uniaxial anisotropy constant were obtained from magnetization and torque curves measurement in high resistive CoFeHfO thin film. The measured results were used for the analysis of the microwave complex permeability based on Landau-Lifshitz-Gilbert (LLG) theory. The high resistive CoFeHfO thin films showed very low damping constants of ${\alpha}$ = 0.014. The results are interpreted in terms of various magnetic phase with very low damping constant, which were existing inside the CoFeHfO thin film, through the linewidth analysis of the ferromagnetic resonance signal with magnetic field.

Effects of passivation layer on the thermal deformation behavior of metal film used in semiconductor devices (반도체용 박막재료의 열응력-변형 특성에 미치는 passivation 층의 영향 분석)

  • Choi, Ho-Seong;Lee, Kwang-Ryol;Kwon, Dong-Il
    • Proceedings of the KIEE Conference
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    • 1998.11c
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    • pp.732-734
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    • 1998
  • Metal thin films such as aluminum have been used as interconnects in semiconductor device. Recently, these materials are applied to structural materials in microsensors and microactuators. In this study, we evaluate deformation and strength behavior of aluminum alloy film. Three layer model for thermal deformation of multilayered thin film material is introduced and applied to Si/Al(1%Si)/$SiO_2$ system. Based on beam bending theory and concept of bending strain. elastic and elastic/plastic thermal deformation behaviors of multilayered materials can be estimated. In the case of plastic deformation of ductile layer, strain rate equations based on deformation mechanism map are employed for describe the stress relaxation effect. To experimentally examine deformation of multilayered thin film materials, in-situ laser scanning method is used to measure curvature of specimens during heating and cooling. The thickness of $SiO_2$ layer is varied to estimate third-layer effect of thermal deformation of metal films, and its effect on deformation behavior are discussed.

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Characteristics and Assessment of Printer Toner Adhesion (프린터 토너의 점착력 특성 및 평가 기법)

  • Lee, Jung-Eun;Kim, Kwang-Il;Kim, Hyun-Joon;Kim, Dae-Eun
    • Transactions of the Society of Information Storage Systems
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    • v.5 no.2
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    • pp.82-88
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    • 2009
  • Understanding the adhesion behavior and characteristics of toner film is required to achieve image and text printing with high quality resolution. Toner can be considered as a thin film coating on a media such as paper or polymer film. Quantitative measurement of adhesion characteristics of the thin film is important to assess the reliability of the system. In this work the main objective was to investigate the adhesion characteristic between the toner and the media by ramp loading scratch test method. The scratch test may be used to obtain quantitative information about the adhesion of the film to the substrate. In the scratch test a diamond tip was used to scratch the surface of the toner film under an increasing normal load until the toner detached or fractured. The critical load (LC) was obtained from the experimental results. Also, the relationship between the critical load and the adhesive strength of the interface between the substrate and the toner was obtained by measuring the normal and tangential forces during the scratch test. Finally, theoretical analysis of the toner scratch characteristics was performed based on Benjamin and Weaver theory, Plowing model, and Laugier model.

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Fabrication and performance evaluation of ultraviolet photodetector based on organic /inorganic heterojunction

  • Abdel-Khalek, H.;El-Samahi, M.I.;Salam, Mohamed Abd-El;El-Mahalawy, Ahmed M.
    • Current Applied Physics
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    • v.18 no.12
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    • pp.1496-1506
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    • 2018
  • Organic/inorganic ultraviolet photodetector was fabricated using thermal evaporation technique. Organic/inorganic heterojunction based on thermally evaporated copper (II) acetylacetonate thin film of thickness 200 nm deposited on an n-type silicon substrate is introduced. I-V characteristics of the fabricated heterojunction were investigated under UV illumination of intensity $65mW/cm^2$. The diode parameters such as ideality factor, n, barrier height, ${\Phi}_B$, and reverse saturation current, $I_s$, were determined using thermionic emission theory. The series resistance of the fabricated diode was determined using modified Nord's method. The estimated values of series resistance and barrier height of the diode were about $0.33K{\Omega}$ and 0.72 eV, respectively. The fabricated photodetector exhibited a responsivity and specific detectivity about 9 mA/W and $4.6{\times}10^9$ Jones, respectively. The response behavior of the fabricated photodetector was analyzed through ON-OFF switching behavior. The estimated values of rise and fall time of the present architecture under UV illumination were about 199 ms and 154 ms, respectively. Finally, enhancing the photoresponsivity of the fabricated photodetector, post-deposition plasma treatment process was employed. A remarkable modification of the device performance was noticed as a result of plasma treatment. These modifications are representative in a decrease of series resistance and an increase of photoresponsivity and specific detectivity. The process of plasma treatment achieved an increment of external quantum efficiency from 5.53% to 8.34% at -3.5 V under UV illumination.

Numerical Analysis of Ultra-Thin Gas Film Lubrication (초박막 기체윤활의 수치해석)

  • Chung C. H.
    • Journal of computational fluids engineering
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    • v.9 no.4
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    • pp.64-70
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    • 2004
  • A kinetic theory analysis is used to study the ultra-thin gas flow field in a gas slider bearing. The Boltzmann equation simplified by a collision model is solved by means of a finite difference approximation with the discrete ordinate method. Calculations are made for a flow in a micro-channel between an inclined slider and a moving disk drive platter The results are compared well with those from the DSMC method. The present method does not suffer from statistical noise which is common in particle-based methods and requires much less computational effort.