• 대한기계학회논문집B
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• 제34권12호
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• pp.1079-1085
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• 2010

평판형 증발부를 갖는 루프히트파이프(LHP)에 대한 정상상태 해석모델을 제시하였다. 관련문헌의 고찰에 기초하여 LHP 의 주요 부분인 증발부, 액체저장조(보상챔버), 증기이송관, 액체이송관 및 응축부에서 온도와 압력을 예측할 수 있도록 계산과정을 제시하였으며, LHP 에서 유일하게 모세관 구조물을 가지는 증발부의 해석에 중점을 두었다. 증발부에서 액체 -기체 경계면 부근에서 압력과 온도의 영향을 고려하기 위해 박막이론을 사용하였으며, 수정된 기체분자운동이론에서 응축경계면 온도를 산정하는데 있어서 독특한 방법을 도입하였다. 응축부에서는 상변화 경계면을 단순화하여 처리함으로써 응축부 형상 변화에 상대적인 융통성을 구비하도록 하였다. 본 연구의 LHP 정상상태 해석 모델은 문헌 상의 실험결과에 의해 타당성이 증명되었다. 해석모델에 의한 예측치는 실험치와 비교할 때 절대온도를 기준으로 최대 상대오차 3% 이내로서 합리적으로 잘 일치하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.700-702
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• 2005

A 5.0-inch transmissive type plastic TFT arrays were successfully fabricated on a plastic substrate at the resolution of $400{\times}3{\times}300$ lines (100ppi). All of the TFT processes were carried out below $150^{\circ}C$ on PES plastic films. After thin film deposition using PECVD, thin film failures such as film delamination and cracking often occurred. For successful growth of thin films (about 1um) without their failures, it is necessary to solve the critical problem related to the internal compressive stress (some GPa) leading to delamination at a threshold thickness value of the films. The Griffith's theory explains the failure process by looking at the excess of elastic energy inside the film, which overcomes the cohesive energy between film and substrate. To increase the above mentioned threshold thickness value there are two possibilities: (i) the improvement of the interface adhesion (for example, through surface micro-roughening and/or surface activation), and (ii) the reduction of the internal stress. In this work, reducing a-Si layer film thickness and optimizing a barrier SiNx layer have produced stable CVD films at 150oC, over PES substrates

• 한국자기학회지
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• 제22권1호
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• pp.6-10
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• 2012

본 연구에서는 인산 용액 하에서 2차 양극 산화 기법에 의해 제작된 양극 산화 알루미나 기판 상에 최대 13 nm 두께의 얇은 니켈 박막을 증착하며 증착 시 박막 두께에 따라 감소하는 박막의 저항 변화를 살펴보았다. 양극 산화 알루미나 막 표면에 존재하는 미세 기공 구조를 따라 증착된 니켈 박막 역시 다공 구조의 박막으로 성장하게 되며 증착된 박막의 두께 범위 내에서 박막의 저항은 $150k{\Omega}$ 이상의 값을 보이면서 박막 두께에 따른 저항의 감소가 매우 천천히 일어나는 것을 확인할 수 있었다. 측정된 저항 값은 기존에 보고된 균일한 기판 상에 증착된 동일 두께의 니켈 박막에 비해 매우 큼을 볼 수 있었으며 기판 표면에 존재하는 기공 구조에 의해 핵자가 형성될 수 있는 표면 면적 비가 박막 성장을 설명하는 스미기(percolation) 현상이론에서 예측하는 임계 값보다 매우 적어 미세 기공에 의해 박막의 성장과 함께 나타나는 전자 전도 채널의 형성이 저해됨으로 이해될 수 있다. 이와 함께 기존의 박막 두께에 따른 비저항 모델과 비교해 보았을 때 미세 기공의 경계에서 나타나는 전자 산란 현상 역시 박막저항의 증가에 기여함을 알 수 있다.

• International Journal of Quality Innovation
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• 제9권1호
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• pp.68-93
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• 2008

The steel bars account for a high percentage of material costs for the current construction projects. At the present time, most of the construction projects for the factories of thin-film transistor liquid crystal display (TFT-LCD) complete the transactions of steel bars when the suppliers ship the steel bars to the temporary storage/processing sites. This paper applies the buy-in concept in the Theory of Constraint (TOC) on the supply chain of steel bars. In this study, suppliers are required to establish warehouses at the construction sites and complete the transactions when the formed and processed steel bars are shipped into the factory sites. The aim is to find a win-win solution to meet with the expectations from constructors as they hope that there is no need to build up inventories but supply is ready at any time. Also, this paper compares and analyzes the traditional supply/inventory model of steel bars and the Demand-Pull (D-P) model under the TOC framework. It is proved that Vendor Management Inventory (VMI) in the D-P model is able to more effectively manage steel bars as a material.

• 한국재료학회지
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• 제21권8호
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• pp.456-460
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• 2011

Microelectromechanical systems (MEMS)-fabricated suspended devices were used to measure the in-plane electrical conductivity, Seebeck coefficient, and thermal conductivity of 304 nm and 516 nm thick InGaAlAs films with 0.3% ErAs nanoparticle inclusions by volume. The suspended device allows comprehensive thermoelectric property measurements from a single thin film or nanowire sample. Both thin film samples have identical material compositions and the sole difference is in the sample thickness. The measured Seebeck coefficient, electrical conductivity, and thermal conductivity were all larger in magnitude for the thicker sample. While the relative change in values was dependent on the temperature, the thermal conductivity demonstrated the largest decrease for the thinner sample in the measurement temperature range of 325 K to 425 K. This could be a result of the increased phonon scattering due to the surface defects and included ErAs nanoparticles. Similar to the results from other material systems, the combination of the measured data resulted in higher values of the thermoelectric figure of merit (ZT) for the thinner sample; this result supports the theory that the reduced dimensionality, such as in twodimensional thin films or one-dimensional nanowires, can enhance the thermoelectric figure of merit compared with bulk threedimensional materials. The results strengthen and provide a possible direction in locating and optimizing thermoelectric materials for energy applications.

• 한국자기학회지
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• 제19권4호
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• pp.147-151
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• 2009

전도성 저항특성이 우수한 비정질 CoFeHfO재료의 자화곡선 및 토오크 측정으로부터 포화자화량 및 일축이방성상수를 도출하였으며, 이들 결과를 Landau-Lifshitz-Gilbert(LLG) 이론에 적용하여 마이크로파대역의 복소투자율 특성을 분석하였다. LLG 분석 결과 CoFeHfO 박막 재료의 감쇠상수(damping factor)는 ${\alpha}$ = 0.014로 매우 작은 값을 보였다. 이는 CoFeHfO 재료 내에 존재하는 다양한 자성상(magnetic phase)들 중 감쇠상수가 현저히 작은 자성상들에 의하여 유발되었음을 자기장의 세기에 따른 FMR(ferromagnetic resonance) 신호의 선폭 분석을 통하여 알 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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• pp.732-734
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• 1998

Metal thin films such as aluminum have been used as interconnects in semiconductor device. Recently, these materials are applied to structural materials in microsensors and microactuators. In this study, we evaluate deformation and strength behavior of aluminum alloy film. Three layer model for thermal deformation of multilayered thin film material is introduced and applied to Si/Al(1%Si)/$SiO_2$ system. Based on beam bending theory and concept of bending strain. elastic and elastic/plastic thermal deformation behaviors of multilayered materials can be estimated. In the case of plastic deformation of ductile layer, strain rate equations based on deformation mechanism map are employed for describe the stress relaxation effect. To experimentally examine deformation of multilayered thin film materials, in-situ laser scanning method is used to measure curvature of specimens during heating and cooling. The thickness of $SiO_2$ layer is varied to estimate third-layer effect of thermal deformation of metal films, and its effect on deformation behavior are discussed.

• 정보저장시스템학회논문집
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• 제5권2호
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• pp.82-88
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• 2009

Understanding the adhesion behavior and characteristics of toner film is required to achieve image and text printing with high quality resolution. Toner can be considered as a thin film coating on a media such as paper or polymer film. Quantitative measurement of adhesion characteristics of the thin film is important to assess the reliability of the system. In this work the main objective was to investigate the adhesion characteristic between the toner and the media by ramp loading scratch test method. The scratch test may be used to obtain quantitative information about the adhesion of the film to the substrate. In the scratch test a diamond tip was used to scratch the surface of the toner film under an increasing normal load until the toner detached or fractured. The critical load (LC) was obtained from the experimental results. Also, the relationship between the critical load and the adhesive strength of the interface between the substrate and the toner was obtained by measuring the normal and tangential forces during the scratch test. Finally, theoretical analysis of the toner scratch characteristics was performed based on Benjamin and Weaver theory, Plowing model, and Laugier model.

• Current Applied Physics
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• 제18권12호
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• pp.1496-1506
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• 2018

Organic/inorganic ultraviolet photodetector was fabricated using thermal evaporation technique. Organic/inorganic heterojunction based on thermally evaporated copper (II) acetylacetonate thin film of thickness 200 nm deposited on an n-type silicon substrate is introduced. I-V characteristics of the fabricated heterojunction were investigated under UV illumination of intensity $65mW/cm^2$. The diode parameters such as ideality factor, n, barrier height, ${\Phi}_B$, and reverse saturation current, $I_s$, were determined using thermionic emission theory. The series resistance of the fabricated diode was determined using modified Nord's method. The estimated values of series resistance and barrier height of the diode were about $0.33K{\Omega}$ and 0.72 eV, respectively. The fabricated photodetector exhibited a responsivity and specific detectivity about 9 mA/W and $4.6{\times}10^9$ Jones, respectively. The response behavior of the fabricated photodetector was analyzed through ON-OFF switching behavior. The estimated values of rise and fall time of the present architecture under UV illumination were about 199 ms and 154 ms, respectively. Finally, enhancing the photoresponsivity of the fabricated photodetector, post-deposition plasma treatment process was employed. A remarkable modification of the device performance was noticed as a result of plasma treatment. These modifications are representative in a decrease of series resistance and an increase of photoresponsivity and specific detectivity. The process of plasma treatment achieved an increment of external quantum efficiency from 5.53% to 8.34% at -3.5 V under UV illumination.

• 한국전산유체공학회지
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• 제9권4호
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• pp.64-70
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• 2004

A kinetic theory analysis is used to study the ultra-thin gas flow field in a gas slider bearing. The Boltzmann equation simplified by a collision model is solved by means of a finite difference approximation with the discrete ordinate method. Calculations are made for a flow in a micro-channel between an inclined slider and a moving disk drive platter The results are compared well with those from the DSMC method. The present method does not suffer from statistical noise which is common in particle-based methods and requires much less computational effort.