• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.35 no.2
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• pp.190-193
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• 2022

In this work, the effect of sputtering working pressure for the tellurium film and its thin-film transistor was investigated. The transfer characteristics of tellurium thin-film transistors were improved by increasing the working pressure during sputtering process. As increasing working pressure, physical and optical properties of Te films such as crystallinity, transmittance, and surface roughness were improved. Therefore, the improved transfer characteristics of Te thin-film transistors may originate from both improved interface properties between the silicon oxide gate dielectric layer and the tellurium active layer with an improved quality of Te film. In conclusion, the control of working pressure during sputtering would be important for obtaining high-performance tellurium-based thin film transistor

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.9
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• pp.856-862
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• 2005

A flux-lock type SFCL consists of two coils, which are wound in parallel each other through an iron core, and a HTSC thin film connected in series with coil 2. If the current of the HTSC thin film exceeds its critical current by the fault accident, the resistance generated of the HTSC thin film, and thereby the fault current can be limited by the impedance of the flux-lock type SFCL. The amplitude of fault current can be set by the impedance of the flux-lock type SFCL. In this paper, we investigated the variance of the limiting current due to the ratio of inductances between coil 1 and coil 2 in the flux-lock type SFCL through the computer simulations and short circuit tests. In addition, both the simulation results and experimental ones were compared each other. From the comparison of both the results, the simulation results agreed well with the experimental ones.

• Proceedings of the KIEE Conference
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• 2004.04a
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• pp.83-85
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• 2004

We proposed the bridge type fault current limiter(FCL) using switching operation of high-Tc superconducting(HTSC) thin film. The proposed bridge type FCL consists of HTSC thin film, a diode bridge and a dc reactor. The controller for the operation of an interrupter is required in the conventional bridge type FCL to prevent the continuous increase of fault current after a fault happens. On the other hand, the proposed bridge type FCL can limit the fault current without the interrupter and the controller for its operation by the resistance generated when the gradually increased fault current exceeds HTSC thin film's critical current. We calculated the time when the gradually increased fault current started to be limited by the resistance generated in HTSC thin film after a fault happened and confirmed that it could be dependent on the amplitude of source voltage. The experimental results well agreed with the calculated ones from simulation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.289-289
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• 2008

We investigated the operational characteristics of the separated three-phase flux-lock type superconducting fault current limiter (SFCL). The single-phase lock type SFCL consist of two coils, which are wound in parallel through an iron core. The high-$T_c$ superconducting(HSTC) thin film connected in series with secondary coil. The separated three-phase flux-lock type SFCL consist of three single-phase flux-lock type SFCL. In a normal condition, the SFCL is not operate. When a fault occurs, the current of a HSTC thin film exceeds its critical current by fault current, the resistance of the HSTC thin film generated. Therefore fault current was limited by SFCL. The separated three-phase flux-lock type SFCL are operated in fault condition such as the the single line-to-ground fault, the double line-to-ground fault and the triple line-to-ground fault. The experimental results, the SFCL operational characteristics was dependent on fault condition.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.145.1-145.1
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• 2013

A prerequisite for the development of graphene-based field effect transistors (FETs) is reliable control of the type and concentration of carriers in graphene. These parameters can be manipulated via the deposition of atoms, molecules, and polymers onto graphene as a result of charge transfer that takes place between the graphene and adsorbates. In this work, we demonstrate a unique and facile methodology for the homogenous and stable p-type doping of graphene by hybridization with ZnO thin films fabricated by MeV electron beam irradiation (MEBI) under ambient conditions. The formation of the ZnO/graphene hybrid nanostructure was attributed to MEBI-stimulated dissociation of zinc acetate dihydrate and a subsequent oxidation process. A ZnO thin film with an ultra-flat surface and uniform thickness was formed on graphene. We found that homogeneous and stable p-type doping was achieved by charge transfer from the graphene to the ZnO film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.532-534
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• 2000

Si thin films on p-type (100) Si substrate have been fabricated by pulsed laser deposition technique using a Nd:YAG laser. The pressure of the environmental gas during deposition was varied from 1 to 3 Torr. After deposition, Si thin film has been annealed again at nitrogen ambient. Strong violet-indigo photoluminescence have been observed from Si thin film annealed in nitrogen ambient gas. As increasing environmental gas pressure, weak green and red emissions from annealed Si thin films also observed by photoluminescence.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.888-891
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• 2003

This paper describes on the fabrication and characteristics of micro ceramic thin-film type pressure sensors based on Ta-N strain-gauges for high-temperature applications. The Ta-N thin-film strain-gauges are deposited onto thermally oxidized Si diaphragms by RF sputtering in an argon-nitrogen atmosphere($N_2$ gas ratio: 8 %, annealing condition: $900^{\circ}C$, 1 hr.), Patterned on a wheatstone bridge configuration, and use as pressure sensing elements with a high stability and a high gauge factor. The sensitivity is $1.097{\sim}1.21mV/V.kgf/cm^2$ in the temperature range of $25{\sim}200^{\circ}C$ and the maximum non-linearity is 0.43 %FS. The fabricated pressure sensor presents a lower TCR, non-linearity than existing Si piezoresistive pressure sensors. The fabricated micro ceramic thin-film type pressure sensor is expected to be usefully applied as pressure and load sensors that is operable under high-temperature environments.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05a
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• pp.198-201
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• 2004

We studied the nematic liquid crystal (NLC) aligning capabilities using the new alignment material of a SiO thin film. The homogenous alignment can be obtain어 using ion beam (IB) exposure on the SIO thin film, when positive type NLC ($Delta\varepsilon$>0) was injected However, the homeotropic alignment can be obtained using ion beam (IB) exposure on the SiO thin film, when negative type NLC ($\Delta\varepsilon$>0) was injected The LC aligning ability on the SiO thin film depends on the dielectric anisotropy type of LC. It will be discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.248-249
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• 2005

The tungsten bronze type of strontium barium niobate(SBN) thin film was synthesized by metal organic decomposion method for SBN stock solution and the SBN thin film process were deposited by spin-coating process on Pt-deposited si-wafer(100) by magnetron sputtering system. The thickness of SBN thin film was 150$\sim$200 nm and were optimized for rpm of spin-coater system. The structural variation of SBN thin film was studied by TG-DTA and XRD. The deposited SBN stock solution on annealing at $400\sim800^{\circ}C$ a pure tungsten bronze SBN phase and the corresponding average grain size about 500$\sim$1000 nm influenced by annealing temperature.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.5
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• pp.443-447
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• 2009

Bismuth-antimony-telluride based thermoelectric thin film materials were prepared by metal organic vapor phase deposition using trimethylbismuth, triethylantimony and diisopropyltelluride as metal organic sources. A planar type thermoelectric device has been fabricated using p-type $Bi_{0.4}Sb_{1.6}Te_3$ and n-type $Bi_{2}Te_{3}$ thin films. Firstly, the p-type thermoelectric element was patterned after growth of $5{\mu}m$ thickness of $Bi_{0.4}Sb_{1.6}Te_3$ layer. Again n-type $Bi_{2}Te_{3}$ film was grown onto the patterned p-type thermoelectric film and n-type strips are formed by using selective chemical etchant for $Bi_{2}Te_{3}$. The top electrical connector was formed by thermally deposited metal film. The generator consists of 20 pairs of p- and n-type legs. We demonstrate complex structures of different conduction types of thermoelectric element on same substrate by two separate runs of MOCVD with etch-stop layer and selective etchant for n-type thermoelectric material. Device performance was evaluated on a number of thermoelectric devices. To demonstrate power generation, one side of the device was heated by heating block and the voltage output was measured. The highest estimated power of 1.3 ${\mu}m$ is obtained at the temperature difference of 45 K.