• Title/Summary/Keyword: Thin film residual stress

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Mechanical Property Evaluation of Diamond-like Carbon Coated by PE-CVD (PE-CVD방법을 이용한 DLC 박막의 기계적특성 평가)

  • Kang Seog Ju;Yi Jin-Woo;Kim Seock Sam
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2003.11a
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    • pp.368-376
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    • 2003
  • In this research, DLC thin films are produced as several hundred nm thickness by PE-CVD method. And then these thin films are estimated tribological characteristics to find out useful possibilities as a protecting film for high-quality function and life extension at MEMs by mechanical properties observation . These are measured thickness and residual stress of DLC coating. Compared after measuring friction coefficient, adhesion force, hardness, cohesive force of coating films. As results all test, we can decide several conclusions. First, friction coefficient decreased, as the load increased. otherwise, friction coefficient increased, as thickness of coating film increased under low load$(1\~50mN)$. Secod, adhesion force increased as thickness of coating films. Third, hardness of coating film is affected by substrate coating film when it is less than thickness of 300nm and it has general hardness of DLC coating film when it is more than thickness of 500nm. Fourth, cohesive force of coating film is complexly affected by hardness, adhesion force, residual stress, etc.

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Analysis of Hygrothermal Stresses in a Viscoelastic Thin Film

  • Lee, Sang-Sun
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2003.12a
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    • pp.146-153
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    • 2003
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to the combined influence of temperature change and moisture absorption. A boundary element analysis is employed to investigate the behavior of interface stresses. The film is assumed to be thermorheologically simple. It is further assumed that moisture effects are analogous to thermal effects. Numerical results are presented for a given viscoelastic model, indicating the singular residual stresses induced during cooling down from the curing temperature, and how they can be altered by subsequent moisture absorption at room temperature.

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Effect of Cu2+ Concentration and Additives on Properties of Electrodeposited Cu Thin Films for FCCL from Sulfate Baths (황산염용액으로부터 전기도금 된 FCCL용 Cu 필름의 특성에 미치는 Cu 이온농도 및 첨가제의 영향)

  • Shin, Dong-Yul;Park, Doek-Yong;Koo, Bon-Keup
    • Journal of the Korean institute of surface engineering
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    • v.42 no.5
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    • pp.191-196
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    • 2009
  • Nanocrystalline Cu thin films were electrodeposited from sulfate baths and investigated systematically the influences of $Cu^{2+}$ concentration and additives on current efficiency, residual stress, surface morphology, and XRD patterns of electrodeposited Cu film. Current efficiency was nearly 100% at from 0.2M to 1.0 M $Cu^{2+}$ concentration. but it was linearly increased with $Cu^{2+}$ concentration at less than 0.2M. The residual stress was observed in range of 7.9 to 18.4 MPa and tensile stress mode. Dendritic and powdered form was obtained at below 0.1 M. As increased with $Cu^{2+}$ concentration in solution, the main peak in the XRD pattern shifted (111) and (220) from (200). In the other hand, all about 100% current efficiency observed in all additive concentration systems, and residual stress observed in range of 20.4 to 26.3 MPa tensile stress. The condition 5(Ultra make-up - 10 ml/l, Ulta A - 0.5ml/l, Ultr B - 0.5 ml/l) was good surface morphology, and fcc(111) peak in XRD patterns increased with increasing additive concentration.

Influence of Change of Ni Concentration in Baths Fabricated by Dissolving Metal Ni Powders on Properties of Electrodeposited Ni Film (금속 Ni 분말을 용해하여 제조된 용액에서 Ni 농도 변화가 전기도금 된 Ni 필름 특성에 미치는 영향)

  • Yoon, Pilgeun;Park, Deok-Yong
    • Journal of the Korean institute of surface engineering
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    • v.52 no.2
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    • pp.78-83
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    • 2019
  • Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion ($Ni^{2+}$) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing $Ni^{2+}$ concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing $Ni^{2+}$ concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M $Ni^{2+}$ concentration. Smooth surface morphologies were observed over 0.3 M $Ni^{2+}$ concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing $Ni^{2+}$ concentration. The average grain size was slightly increased at 0.3 M $Ni^{2+}$ concentration and then slightly decreased with increasing $Ni^{2+}$ concentration.

A Measurement of the Residual Stress and Young's Modulus of p+ Silicon (p+ 실리콘의 강성계수 및 잔류응력 측정)

  • Kim, Sang-Cheol;Jeong, Ok-Chan;Yang, Sang-Sik
    • Proceedings of the KIEE Conference
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    • 1998.07g
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    • pp.2524-2526
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    • 1998
  • In this paper, the residual stress and young's modulus of the p+ thin film have been estimated by using the electrostatic resonators. The electrostatic plate resonator with four corrugated bridges and another with four flat ones have been fabricated. The deflection of the plate has been calculated under the induced tension and the residual stress and compared with the dynamic test results. When the young's modulus of the p+ silicon is 125 GPa. The estimated residual stresses of the flat and the corrugated bridges are about 15 MPa and less than 5 MPa, respectively. It has been confirmed that the corrugated structure releases the residual tensile stress resulted from the heavy boron diffusion process.

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Characteristics of $CU(InGa)Se_2$Thin Film Solar Cells with Deposition Condition of Mo Electrode (몰리브덴 전극의 형성조건에 따른 $CU(InGa)Se_2$ 박막 태양전지의 특성)

  • Kim, Seok-Gi;Han, Sang-Ok
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.50 no.12
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    • pp.607-613
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    • 2001
  • Molybdenum thin films were deposited on the soda lime glass(SLG) substrates by direct-current planar magnetron sputtering, with a sputtering power density of $4.44W/cm^2$. The working pressure was varied from 0.5 mtorr to 20 mtorr to gain a better understanding of the effect of sputtering pressure on the morphology and microstructure of the Mo film. Thin films of $CU(InGa)Se_2$ (CIGS) were deposited on the Mo-coated glass by three stage co-evaporation process. The highest efficiency device was obtained at the maximum value of the tensive stress. The morphology of Mo-coated films were examined by using scanning electron microscopy The film's microstructure, such as the preferred orientation, the full width at half-maximum(FWHM), and the residual intrinsic stress were examined by X-ray diffraction.

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Structure & Fatigue Behavior of TiCN and TiN/TiCN Thin Films (TiCN 및 TiN/TiCN 박막의 구조와 피로거동)

  • Baeg, C.H.;Hong, J.W.;Wey, M.Y.;Kang, H.J.
    • Journal of the Korean Society for Heat Treatment
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    • v.13 no.5
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    • pp.324-329
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    • 2000
  • Microstructure, mechanical and fatigue behaviors of TiCN and TiN/TiCN thin films, deposited on quenched and tempered STD61 tool steel, were investigated by using XRD, XPS, hardness, adhesion and fatigue tests. The TiCN thin film is grown along the (100), (111) orientation, whereas the TiN/TiCN thin film is grown along the (111) orientation. The preferred orientation of TiN/TiCN thin film strongly depends on the TiN buffer layer whose orientation is (111), as is well-known. The TiN/TiCN thin film showed the higher adhesion compared with TiCN single layer because the TiN buffer layer, having good toughness, reduces the effects of the lower hardness of substrate. In the high cycle tension-tension fatigue test, the fatigue life of the TiCN and the TiN/TiCN coated steel increased approximately two to four times and five to nine times respectively compared with uncoated specimens. The TiN buffer layer in multilayer thin films plays an important role in reducing residual stress and fatigue crack initiation, and then in restraining the fatigue propagation.

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Control of Copper Thin Film Characteristics by using Pulsed DC Power Magnetron Sputter System (Pulsed DC Power Magnetron Sputter System을 사용한 Copper 박막 특성 조절)

  • Kim, Do-Han;Lee, Su-Jeong;Kim, Tae-Hyeong;Lee, Won-O;Yeom, Won-Gyun;Kim, Gyeong-Nam;Yeom, Geun-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.107-107
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    • 2017
  • 전자제품의 성능이 향상됨에 따라서 전자제품에 사용되는 부품의 고집적화가 필연적으로 요구되고 있으며, 고집적화 된 전자제품의 방열(heat dissipation)에 관한 문제점이 대두되고 있다. 방열은 전자기기의 성능과 수명을 유지하는데 있어서 중요한 문제 중 하나로서 방열 효과를 높이기 위해 다양한 연구 개발이 진행 중이다. 방열에 사용되는 소재로는 Cu가 있으며, 저렴한 가격과 상대적으로 높은 방열 효율을 가지는 장점이 있다. Cu는 전기 도금 증착 방법을 사용하여왔으나, 전기도금 방식으로 증착된 Cu 방열판은 제품에 열이 축적될 경우 Cu와 substrate 사이의 residual stress로 인해 박리나 뒤틀림 현상 등이 발생하여 high power를 사용하는 device의 방열 소재로 사용하기에는 개선해야 할 문제점이 있다. 이러한 문제점을 극복하기 위한 방법으로 magnetron sputter 증착 방법이 있으며, magnetron sputter은 대면적화가 용이하고, 다양한 물질의 증착이 가능한 장점으로 인해 hard coating 또는 thin film 증착과 같은 공정에 사용되고 있다. 특히 증착된 film의 특성을 조절하기 위해서 magnetron sputter에 pulse 또는 ICP (inductively coupled plasma) assisted 등을 적용하여 plasma 특성을 조절하는 방법 등에 관한 연구가 보고되고 있다. 본 연구에서는 pulsed magnetron sputtering 방식을 이용하여 증착된 Cu film 특성 변화를 확인하였다. 다양한 pulsing frequency와 pulsing duty ratio 조건에서, Si substrate 위에 증착된 Cu film과의 residual stress 변화를 측정하였다. Pulse duty ratio가 90% 에서 60%로 감소함에 따라서 Cu film의 residual stress가 감소하였고, pulsing frequency가 증가함에 따라 Cu film의 residual stress가 감소하는 것을 확인하였다. 증착 조건에 따른 plasma의 특성 분석을 위하여 oscilloscope를 이용하여 voltage와 current를 측정하였고, Plasma Sampling Mass spectrometer 를 이용하여 ion energy의 변화를 측정하였다. 이를 통해 plasma 특성 변화가 증착된 Cu film에 미치는 영향과 residual stress의 변화에 대한 연관성에 대하여 확인할 수 있었다.

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Property Changes of Ni-Co Film with the Change of Co Concentration in Sulfamate-chloride Bath (Sulfamate-Chloride Bath에서 Co 농도의 변화에 따른 Ni-Co 필름의 특성 변화)

  • Yoon, Pilgeun;Park, Deok-Yong
    • Journal of the Korean institute of surface engineering
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    • v.53 no.1
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    • pp.1-8
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    • 2020
  • Sulfamate-chloride baths were fabricated to study the properties of the electrodeposited Ni and NiCo thin films. The dependences of current efficiency, deposit composition of Ni and Co, residual stress, surface morphology and microstructure of electrodeposited Ni and NiCo thin films on CoCl2 concentration in sulfamate-chloride baths were investigated. The current efficiency was measured to be more than about 90%, independent of the changes of CoCl2 concentration in the baths. Residual stress of Ni and NiCo thin films was increased from about 45 to about 250 MPa with varying CoCl2 concentration from 0 to 0.210 M CoCl2 in the baths and then reached to a plateau, about 250 MPa above 0.420 M CoCl2 concentration. Nodular surface morphologies were observed at most CoCl2 concentrations in the baths except 0.210 M. NiCo thin film electrodeposited from the bath with 0.210 M CoCl2 concentration showed an acicular surface morphology. Pure Ni thin film consists of FCC(111), FCC(200), FCC(220), and FCC(311) peaks without any preferred orientation. On the other hand NiCo thin films make up of HCP(100), FCC(111), HCP(101), FCC(200), FCC(220) or HCP(110), FCC(311) or HCP(112) and FCC(222) peaks. It was revealed from the analysis of XRD result that FCC(111) peak at the NiCo thin film electrodeposited from the bath with 0.084 M CoCl2 concentration can be regarded as the preferred orientation. However the peak of the preferred orientation was changed to FCC(220) or HCP(110) above 0.084 M CoCl2 concentration in the baths. Then the intensity of FCC(220) or HCP(110) peak was gradually decreased with increasing CoCl2 concentration further. The crystalline size of pure Ni thin film was observed to be about 53 ㎛ and those of NiCo thin films were in the range of 35~45 ㎛.