• Journal of the Korean institute of surface engineering
• /
• v.46 no.1
• /
• pp.16-21
• /
• 2013

CIGS (Cu-In-Ga-Se) films were deposited on the Mo coated soda lime glass (Mo/SLG) by RF magnetron sputtering using a single sintered target with different chemical compositions. Heat treatment of the CIGS films were carried out under three different conditions, 1step ($350^{\circ}C$ for 2 hour and $550^{\circ}C$ for 2 hour) and 2step ($350^{\circ}C$ for 1 hour and $550^{\circ}C$ for 1 hour). In the case of CIGS films post-annealed on 2step method, grain size remarkably increased compared to other methods, indicating that chemical composition [Cu/(Ga+In) = 1] of CIGS films was same as CIGS target. After heat treatment by 2step method, band gap energy of the CIGS film deposited at RF 80 W showed 1.4 eV which is broadly similar to identical band gap energy (1.2 eV) of CIGS film prepared by evaporation method. Therefore, 2step heat treatment method could be expected to low temperature process.

• Proceedings of the KIEE Conference
• /
• 2006.07c
• /
• pp.1523-1524
• /
• 2006

There arc several important issues in AC PDP researches such as cost reduction, reliability, and good image quality. The properties of MgO layer is thought to be one of the most important (actors that affects the panel reliability through the firing voltage variation. The MgO thin film mainly has (111), (200) and (220) crystal orientation. It is reported that (111)-oriented film helps decreasing the discharge voltage, and (200)-oriented film improves the misfiring on high temperature and the image sticking. In this study, we investigated the relations between the crystal orientation and e-beam evaporation process parameters such asdeposition rate, temperature of substrate, and distance between the target(MgO tablet) and the substrate.

• Journal of the Korean Vacuum Society
• /
• v.4 no.S2
• /
• pp.131-138
• /
• 1995

The broad beam ion sources of hot filament plasma type have widely used for modifications of materials and thin films, and the new type intensive current broad beam metal ion source including reactive gaseous ion beams is needed for preparing the hard coating films such as DLC, $\beta-C_3N_4$ Carbides, Nitrides, Borides etc. Now a electorn beam evaporation(EBE) broad beam metal ion source has been developed for this purpose in our lab. CN film has been formed by the EBE ion source. Study of the CN film shows that it has high hardness(HK=5800kgf/$\textrm {mm}^2$)and good adhesion. This method can widely changes the ratio of C/N atom's concentrations from 0.14 to 0.6 and has high coating rate. The low energy pocket ion source which was specially designed for surface texturing of medical silicon rubber was also developed. It has high efficiency and large uniform working zone. Both nature texturing and mesh masked texturing of silicon rubbers were performed. The biocompatibility was tested by culture of monocytes, and the results showed improved biocompatibility for the treated silicon rubbers. In addition, the TiB2 film synthesized by IBED is being studied recently in our lab. In this paper, the results which include the hardness, thickness of the films and the AES, XRD analysis as well as the tests of the oxidation of high temperature and erosion will be presented.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.28 no.5
• /
• pp.285-290
• /
• 2015

The phase change memory material is an active element in phase change memory and exhibits reversible phase transition behavior by thermal energy input. The doping of the phase change memory material with Ga leads to the increase of its crystallization temperature and the improvement of its amorphous stability. In this study, we investigated the effect of GaGe sputtering power on the formation of the phase change memory material including Ga. The deposition rate linearly increased to a maximum of 127 nm and the surface roughness remained uniform as the GaGe sputtering power increased in the range from 0 to 75 W. The Ga concentration in the thin film material abruptly increased at the critical sputtering power of 60 W. This influence of GaGe sputtering power was confirmed to result from a combined sputtering-evaporation process of Ga occurring due to the low melting point of Ga ($29.77^{\circ}C$).

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.06a
• /
• pp.71.2-71.2
• /
• 2010

CIS(CuInSe2)계 화합물 태양전지는 높은 광흡수계수와 열적 안정성으로 고효율의 태양전지 제조가 가능하여 화합물 태양전지용 광흡수층으로서 매우 이상적이다. 또한 In 일부를 Ga으로 치환하여 밴드갭을 조절할 수 있는 장점이 있다. 미국 NREL에서는 Co-evaporation 방법을 이용해 20%의 에너지 변환 효율을 달성하였다고 보고된바가 있다. 본 연구에서는 미국의 NREL과 같은 3 stage 방식을 이용하여 광흡수층을 제조하고자 한다. 본 실험에서는 Se 증기압을 각각 $200^{\circ}C$, $230^{\circ}C$, $240^{\circ}C$, $245^{\circ}C$로 달리 하며 실험을 실시하였다. 이때 1st stage의 시간은 15분으로 고정하였으며 기판온도는 약 $250^{\circ}C$로 고정 하였다. 2nd stage는 실시간 온도 감지 장치를 이용하여 Cu와 In+Ga의 조성비가 1:1이 되는 시간을 기준으로 Cu의 조성을 30%더 높게 조절하였으며 기판 온도는 약 $520^{\circ}C$로 고정 후 실험을 실시하였다. 3rd stage의 경우 Cu poor 조성으로 조절하기 위해 모든 조건을 10분으로 고정 후 실험을 실시하였다. 각각의 Se 증기압에 따른 물리적, 전기적 특성을 알아보기 위해 FE-SEM, EDS, XRD 분석을 실시하였다. 본 연구에서 기판은 Na이 첨가되어있는 soda-lime glass를 사용 하였으며 후면 전극으로 약60nm 두께의 Mo를 DC Sputtering 방법을 이용해 증착 하였다.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.06a
• /
• pp.62.1-62.1
• /
• 2010

CIS(CuInSe2)계 화합물 태양전지는 높은 광흡수계수와 열적 안정성 및 조성 조절을 통한 밴드갭 조절이 용이해 고효율 박막 태양전지로 각광 받고 있다. 또한 CIGS 태양전지는 기존의 유리기판 대신 유연한 기판을 사용해 flexible 태양전지 제조가 가능하다. 이러한 유연기판은 보통 stainless steel과 같은 금속 기판이 많이 사용되는데 기존의 soda-lime glass 기판과는 달리 금속기판에는 Na이 첨가되어 있지 않아 별도의 Na첨가를 필요로 한다. Na은 CIGS 흡수층의 조성조절을 용이하게 하여 태양전지의 변환 효율을 향상시키는 역할을 한다. 본 연구에서 기판은 Na이 첨가되어있지 않은 corning glass를 사용 하였으며 NaF를 이용해 Mo가 증착된 기판에 NaF의 두께를 달리하며 증착해 CIGS 흡수층의 grain 사이즈를 비교 하였으며 그 후 태양전지 소자를 제조해 광전특성을 분석하였다. 후면 전극으로 약60nm 두께의 Mo를 DC Sputtering 방법을 이용해 증착 하였다. buffer층으로는 약 50nm의 CdS층을 CBD방법을 이용하여 제조 하였으며 TCO 층으로 약 50nm의 i-ZnO와 약 450nm의 Al-ZnO를 RF Sputtering방법으로 증착 하였다. 마지막으로 앞면 전극으로 약 $1{\mu}m$의 Al을 Thermal Evaporation방법으로 증착하였다. 태양전지 소자의 면적은 $0.49cm^2$로 효율을 비교 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.479-479
• /
• 2013

산화물 반도체 물질을 이용한 Thin film transistor (TFT) 소자는 기존의 비정질 Si TFT와 저온 다결정 Si TFT 소자가 가지지 못하는 장점들이 보고되면서 차세대 디스플레이용 소자로 주목을 받고 있다. 그 중 TFT의 채널 물질로 a-IGZO가 많이 활용되고 있다. a-IGZO의 활용이 더 많아지고 있는 이유는 저온공정이 가능하고 3.2 eV의 큰 밴드갭으로 투명하며 높은 균일도, 캐리어 이동도를 모두 가지고 있기 때문이다. 본 연구에서는 산화물 물질인 IGZO를 채널 층으로 사용한 TFT소자에서 IGZO의 캐리어인 전자의 이동경로를 금속을 통하여 이동하게 함으로써 전기적 특성의 변화를 관찰하였다. TFT는 다수 캐리어가 게이트 전압에 의하여 박막 아래쪽에 채널을 형성하여 동작한다. 이 때 IGZO박막과 SiO2 사이의 Al을 증착하여 다수 캐리어인 전자의 이동도를 향상시켰다. 전극으로 사용되어지는 Al은 IGZO박막과 ohmic contant이기 때문에 전자의 이동이 어렵지 않기 때문이다. 소자 제작은 게이트로 도핑된 P형 기판을 사용하였고 게이트 절연체로 SiO2 200 nm를 증착하였다. 채널층로 IGZO를 증착하기 전에 게이트 절연체 위에 evaporation으로 Al을 20 nm를 증착하였다. 이때 mask는 $2.4{\times}10^{-4}cm^2$ 크기의 dot 형태를 사용하였다. Al을 증착 후 RF sputtering으로 IGZO를 30 nm 증착하였으며 $350^{\circ}C$에서 90 min 동안 열처리하였다. 소스와 드레인은 evaporation으로 Al을 100 nm 증착하였다. HB 4145B 측정기로 I-V 그래프를 통하여 전기적 특성의 변화를 관찰하였다.

• Proceedings of the KSME Conference
• /
• 2003.04a
• /
• pp.1491-1498
• /
• 2003

Droplet evaporation can be used to transfer large amounts of energy since heat is transferred across a thin liquid film. Spreading the drop over a larger area can enhance this heat transfer. One method of accomplishing this is to dissolve gas into the liquid. When the drop strikes the surface, a gas bubble nucleates and can grow and merge within the liquid, resulting in an increase in the droplet diameter. In this study, time and space resolved heat transfer characteristics for a single droplet striking a heated surface were experimentally investigated. The local wall heat flux and temperature measurements were provided by a novel experimental technique in which 96 individually controlled heaters were used to map the heat transfer coefficient contour on the surface. A high-speed digital video camera was used to simultaneously record images of the drop from below. The measurements to date indicate that significantly smaller droplet evaporation times can be achieved. The splat diameter was observed to increase with time just after the initial transient dies out due to the growth of the bubble, in contrast to a monotonically decreasing splat diameter for the case of no bubbles. Bursting of the bubble corresponded to a sudden decrease in droplet heat transfer.

• Journal of the Korean Vacuum Society
• /
• v.22 no.1
• /
• pp.26-30
• /
• 2013

For the realization of high-k insulator, aluminum oxide ($Al_2O_3$) was deposited by using an oxygen ion beam assisted deposition (IBAD) during e-beam evaporation. From the thickness of the $Al_2O_3$ layer evaporated with IBAD process, it was possible to investigate the etching effect of ion beam at higher energies during e-beam evaporation. It was also possible to obtain a higher capacitance as a result of IBAD in spite of the reduced thickness of $Al_2O_3$.

• Korean Journal of Materials Research
• /
• v.4 no.3
• /
• pp.280-286
• /
• 1994

As-grown $YBa_2Cu_3O_{7-x}$ films on MgO(100)substrates were prepated by a reactive co-evaporation method, and effects of activated oxygen plasma on the crystallinity and superconductivity at substrate temperature ranging from $450^{\circ}C$ to $590^{\circ}C$ were investigated. The film deposited under the activated oxygen plasma at the substrate temperature of $590^{\circ}C$ had a single crystal phase. Whereas, when films were deposited under only oxygen gas, they were not in perfect single crystal phase but with slight polycrystalline nature. When the substrate temperature was $590^{\circ}C$, $Tc_{zero}$'s were 83K and 80K for films with and without activated oxygen plasma, respectively. The critical temperature, the crystal structure and the surface morphology of as-grown films were found to be insensitive to the activated oxygen plasma which is introduced during deposition instead of oxygen gas, but the crystalline quality was improved somewhat by the introduction by the introduction of actvated oxygen plasma.