• Title/Summary/Keyword: Thin Wall

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Turbulent Flow over Thin Rectangular Riblets

  • El-Samni O. A.;Yoon Hyun Sik;Chun Ho Hwan
    • Journal of Mechanical Science and Technology
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    • v.19 no.9
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    • pp.1801-1810
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    • 2005
  • The effect of longitudinal thin rectangular riblets aligned with the flow direction on turbulent channel flow has been investigated using direct numerical simulation. The thin riblets have been modeled using the immersed boundary method (IBM) where the velocities at only one set of vertical nodes at the riblets positions are enforced to be zeros. Different spacings, ranging between 11 and 43 wall units, have been simulated aiming at getting the optimum spacing corresponding to the maximum drag reduction while keeping the height/spacing ratio at 0.5. Reynolds number based on the friction velocity ${\mu}_\tau$ and the channel half depth $\delta$ is set to 150. The flow is driven by adjusted pressure gradient so that the mass flow rate is kept constant in all the simulations. This study shows similar trend of the drag ratio to that of the experiments at the different spacings. Also, this research provides an optimum spacing of around 17 wall units leading to maximum drag reduction as experimental data. Explanation of drag increasing/decreasing mechanism is highlighted.

Injection Molding Technology for Thin Wall Plastic Part - II. Side Gate Removal Technology Using Cold Press Cutting Process (초정밀 박육 플라스틱 제품 성형기술- II. 냉간 절단 공정 활용 사이드 게이트 제거기술)

  • Heo, Young-Moo;Shin, Kwang-Ho;Choi, Bok-Seok;Kwon, Oh-Keun
    • Design & Manufacturing
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    • v.10 no.3
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    • pp.1-7
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    • 2016
  • In the semiconductor industry the memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. After injection molding process the side gates were needed to remove for further assembly process. ln this study, the cold press cutting process was applied to remove the gates. For design of punch and die, the cold press cutting analysis was implemented by$DEFORM-2D^{TM}$ ln consideration of the simulation results, an adequate punch and die was designed and made for the cutting unit. In order to verify the performance of cutting process, the roughness of cutting section of the part was measured and was satisfied in requirement.

Fabrication of Single Crystal Silicon Micro-Tensile Test Specimens and Thin Film Aluminum Markers for Measuring Tensile Strain Using MEMS Processes (MEMS 공정을 이용한 단결정 실리콘 미세 인장시편과 미세 변형 측정용 알루미늄 Marker의 제조)

  • 박준식;전창성;박광범;윤대원;이형욱;이낙규;이상목;나경환;최현석
    • Transactions of Materials Processing
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    • v.13 no.3
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    • pp.285-289
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    • 2004
  • Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

A study on the injection molding technology for thin wall plastic part (초정밀 박육 플라스틱 제품 성형기술에 관한 연구)

  • Heo, Young-Moo;Shin, Kwang-Ho
    • Design & Manufacturing
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    • v.10 no.2
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    • pp.50-54
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    • 2016
  • In the semiconductor industry the final products were checked for several environments before sell the products. The burning test of memory and chip was implemented in reliability for all of parts. The memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. In this study, injection molding process analysis was executed for 2 and 4 cavities moldings with runner, gate and sprue. The warpage analysis was also implemented for further gate removal process. Through the analyses the total deformations of the moldings were predicted within maximum 0.05mm deformation. Finally in consideration of these results, 2 and 4 cavities molds were designed and made and tested in injection molding process.

Growth and Photoconductive Characteristics of $ZnGa_2Se_4$ Epilayers by the Hot Wall Epitaxy

  • Park, Chang-Sun;Hong, Kwang-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07a
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    • pp.263-266
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    • 2004
  • The stochiometric mix of evaporating materials for the $ZnGa_2Se_4$ single crystal thin films were prepared from horizental furnace. The polycrystal structure obtaind from the power x-ray diffraction was defect chalcopyrite. The lattice costants $a_0\;and\;c_0\;were\;a_0=5.51\;A,\;c_0=10.98\;A$. To obtains the single crystal thin films, $ZnGa_2Se_4$ mixed crystal were deposited on throughly etched Si(100) by the Hot Wall Epitaxy (HWE) system. The temperates of the source and the substrate were $590^{\circ}C\;and\;450^{\circ}C$, respectively. The crystalline structure of single crystal thin films was investigated by the double crystal X-ray diffraction(DCXD). Hall effect on this sample was measured by the method of van der Pauw and studied on carrier density and mobility dependence on temperature. In order to explore the applicability as a photoconductive cell, we measured the sensitivity($\gamma$), the ratio of photocurrent to dark current(pc/dc), maximum allowable rower dissipation(MAPD), spectral response and response time.

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Three-Dimensional Analysis on Drying Process of a Cylindrical Thin Film Layer of Sludge under Uniform Heating (일정온도로 가열되는 원통 형상 슬러지 박막의 건조에 대한 3차원 해석)

  • Lee, Kong-Hoon;Kim, Ook-Joong
    • Proceedings of the SAREK Conference
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    • 2009.06a
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    • pp.1326-1331
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    • 2009
  • Drying process in the cylindrical thin film layer of sludge with the thickness less than a few millimeters has been investigated. Thin film drying is specially designed and used to dry the viscous materials like sewage sludge. The thin film layer of sludge is dried on the metallic cylindrical surface through which thermal energy is supplied to the layer during drying. The wall temperature is assumed to be constant during drying in the present study for the simplification. In order to solve the equations, the mass transfer rate on the drying surface should be determined. The mass flux of evaporated water vapor on the surface is estimated with the formulation given in the literature. The effect of some physical parameters on drying has been examined to figure out the drying characteristics of the sludge layer.

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