• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2007년도 추계 학술대회논문집
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• pp.39-44
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• 2007

A similarity solution of the Navier-Stokes equation for the axisymmetric stagnation flow near a plane wall coated with a magnetic fluid of uniform thickness is constructed. The shape functions representing the flow in two (magnetic and normal) fluid layer are determined from a third order boundary value problem, which is solved by the Runge-Kutta method with two shooting parameters. Features of the flow including streamline pattern and interface velocity are investigated for the varying values of density ratio, viscosity ratio, and Reynolds number. The results for the interface and wall shear stress, boundary layer and displacement thickness are also presented.

• 한국전산유체공학회지
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• 제13권4호
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• pp.126-134
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• 2008

We developed a three dimensional Navier-Stokes code based on the level set method to simulate two phase flows with high density ratio. The Navier-Stokes equations with consideration of the surface tension effects are solved by using SIMPLE algorithm on a non-staggered grid. The present code is validated by simulating two test problems. First one is to simulate a rising bubble inside a cube. The thickness of the interface of the bubble is shown to affect the pressure distribution around the interface. As the thickness decreases, the pressure field around the interface becomes more oscillatory. As the bubble rises, a ring vortex is shown to form around the interface and the bubble eventually develops into an ellipsoidal shape. Merge of two bubbles inside a container is secondly tested to show the robustness of the present code for two phase flow simulation. Numerical results show stable and reliable behavior during the process of merging of two bubbles. The velocity and pressure fields around the interface of bubbles are shown oscillation free during the merging of two bubbles.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.178-178
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• 1999

Low temperature Si epitaxy can provide flexibility for a device designer to tailor or optimize the device performance. It is better method for controlling the doping thickness, concentration and profile than ion implantation and diffusion. But there is a limited growth thickness in this method. At a given temperature, the film grows epitaxially for a certain limiting thickness(hepi) and becomes amorphous. The transition from crystalline Si to amorphous Si is abrupt. In this study, Si film was deposited by ion beam sputter deposition on Si (0001) above a limiting thickness and measure the strain in the interface between crystalline Si and amorphous Si. The strain was compressive and the maximum value was about 2%.

• 분석과학
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• 제21권6호
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• pp.495-501
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• 2008

GC-MS 의 기존 인터페이스와 새로운 인터페이스의 차이점과 유용성을 판단하기 위하여 Agilent 5973 GC-MS의 capillary direct interface를 떼어내고 GC와 질량분석기 사이에 실리콘 membrane을 장착하여 membrane interface GC-MS의 분석 유용성을 조사하였다. 최대 $4.7m{\ell}/min$ 까지 헬륨 운반기체유량을 올릴 때 질량분석기의 진공도는 거의 영향을 받지 않으며, 피이크끌림 현상이 줄어들고 머무른시간이 줄어드는 빠른 분석을 보였다. Membrane 의 두께를 $127{\mu}m$에서 $75{\mu}m$으로 줄일 때 분리능이 향상 되며, membrane interface의 온도를 올릴 때 분리능과 감도가 향상되었다. 그러나 membrane interface GCMS는 질량/전하 비 73, 147에서 바탕이온이 발생하는 것과 기존의 capillary direct insertion interface보다 낮은 감도와 peak tailing에 의한 낮은 분리능의 문제점을 갖는다.

• 한국재료학회지
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• 제17권8호
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• pp.402-407
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• 2007

In electronics manufacturing processes, soldering process has generally been used in surface mounting technology. Because of environmental restriction, lead free solders as like a SnAgCu ternary system are being used widely. After soldering process, the formation and growth of intermetalic compounds(IMCs) are formed in the interface between solder and Cu substrate as follows isothermal temperature and time. In this studies, therefore, we investigated the effects of the Cu substrate thickness on the IMC formation and growth of Sn-40Pb/Cu and Sn-3.0Ag-0.5Cu/Cu solder joints, respectively. The effect of the Cu thickness in PCB Cu pad and pure Cu plate was analyzed as measuring of thickness of each IMC. After solder was soldered on PCB and Cu plate which have different Cu thickness, we measured the IMC thickness in solder joints respectively. Also we compared with the effectiveness of Cu thickness on the IMC growth. From these results, we calculated the activation energy.

• 대한의용생체공학회:의공학회지
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• 제36권2호
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• pp.43-47
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• 2015

Osteoarthritis is the most common chronic joint disease in the world. With its progression, cartilage thickness tends to diminish, which causes severe pain to human being. One way to examine the stage of osteoarthritis is to measure the cartilage thickness. When it comes to inter-subject study, however, it is not easy task to compare cartilage thickness since every human being has different cartilage structure. In this paper, we propose a method to assess cartilage defect using MRI inter-subject thickness comparison. First, we used manual segmentation method to build accurate atlas images and each segmented image was labeled as articular surface and bone-cartilage interface in order to measure the thickness. Secondly, each point in the bone-cartilage interface was assigned the measured thickness so that the thickness does not change after registration. We used affine transformation and SyGN to get deformation fields which were then applied to thickness images to have cartilage thickness atlas. In this way, it is possible to investigate pixel-by-pixel thickness comparison. Lastly, the atlas images were made according to their osteoarthritis grade which indicates the degree of its progression. The result atlas images were compared using the analysis of variance in order to verify the validity of our method. The result shows that a significant difference is existed among them with p < 0.001.

• 마이크로전자및패키징학회지
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• 제7권2호
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• pp.13-19
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• 2000

금속간 화합물의 두께와 솔더와 금속간 화합물의 계면 거칠기가 Cu pad위의 BGA솔더 조인트의 전단강도에 미치는 영향을 Sn (0. 1.5, 2.5wt.% Cu)와 Sn-40Pb (0, 0.5wt.% Cu) 솔더를 사용하여 알아보았다. 각각의 조성의 솔더를 사용하여 솔더링 반응을 1, 2 ,4분 동안 한 후 전단강도를 측정하였다. Sn솔더에 Cu 첨가는 초기 금속간 화합물의 두께를 증가시키는 결과를 가져오는 반면 Sn-40Pb 솔더의 경우에는 주로 금속간 화합물/솔더의 계면거칠기의 감소를 가져오게 된다. 최대 전단 강도값을 나타내는 금속간 화합물의 임계두께는 솔더의 물질에 따라 변하게 되는데, 본 실험에서는 Sn-Cu솔더의 경우에는 ~2.3 $\mu\textrm{m}$, Sn-Pb-Cu에서는 ~ 1.2 $\mu\textrm{m}$ 정도로 측정되었다. 금속간 화합물의 임계두께는 금속간 화합물/솔더의 계면이 더욱 거칠어질수록 증가하는 것으로 나타났다. 이는 파단면 관찰에서 나타난 초기의 솔더내에서의 파괴가 금속간 화합물이 임계두께 이상으로 성장함에 금속간 화합물/솔더의 계면으로 이동하는 결과와 일치한다.

• 한국지반환경공학회 논문집
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• 제11권11호
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• pp.47-54
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• 2010

최근 쓰레기 매립장에 보강 및 보호 목적으로 토목섬유가 널리 사용되고 있다. 최근 연구결과, 토목섬유-흙 접촉면에서는 진행성 파괴가 발생할 수 있는데 이는 토목섬유-흙 접촉면에서 함수비, 연직응력, 화학적 요소의 영향 등 고유물성에 기인한다. 본 연구에서는 침출수 내의 산성 및 염기성과 같은 성분의 영향이 진동하중 상태에서 토목섬유-흙 접촉면의 전단강도 감소에 미치는 영향을 실내 시험을 통하여 분석하였다. 다기능 접촉면 시험기를 새로 구축하고 서로 다른 pH 조건에서 수침시킨 토목섬유와 흙시료를 이용하여 진동 직접전단시험을 수행하여 접촉면 전단두께와 화학적 요소에 의한 접촉면의 전단강도 감소를 확인하였다. 또한 접촉면 전단강도 감소를 정량적으로 표현하기 위하여 교란상태개념에 기초하여 동하중 하의 화학적 인자들에 의한 토목섬유-흙 접촉면의 정규화 교란도 함수를 파악하고 전단강도 감소 특성을 확인하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1794-1799
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• 2008

The effect of misfit on the indentation behaviour of silver coated copper multilayer was studied by molecular dynamics simulation. It was found that the misfit bands on interface formed by the mismatch of lattice structure between copper and silver in slip direction [110] and the dislocation band width depended on the mismatched lattice constants of materials. More dislocations were created and glided by indentation, which created a "four-wing flower" structure consisting of pile. up of dislocation at the interface. The size of "flower" depended on the thickness of silver layer. The critical thickness for "flower" was approximately 4nm above which the "flower" disappeared. As the result, deformation mechanisms such as dislocation pile-up, dislocation cross-slip and movement of misfit dislocation were revealed. Only silver atoms in the dislocation pile-up were involved in the creation of the "flower" while the dislocations in copper were glided in slip direction on interface.

• Structural Engineering and Mechanics
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• 제34권6호
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• pp.667-683
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• 2010

A mathematical model and its analytic solution for the analysis of stress-strain state of a linear elastic two-layer beam is presented. The model considers both slip and uplift at the interface. The solution is employed in assessing the effects of transverse and shear contact stiffnesses and the thickness of the interface layer on behaviour of nailed, two-layer timber beams. The analysis shows that the transverse contact stiffness and the thickness of the interface layer have only a minor influence on the stress-strain state in the beam and can safely be neglected in a serviceability limit state design.