• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.633-634
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• 2011

• Journal of the Korean Society for Precision Engineering
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• v.25 no.9
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• pp.38-44
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• 2008

Light guide plate is one of most important components which are composed of back light unit, affecting the quality and performance of LCD. Average brightness and uniformity are especially key factors for designing the light guide unit. These qualities are affected and controlled by the pattern being attached to the back of light guide unit. In order to obtain high brightness and uniformity the optimized pattern design is adopted for LGP. In this study, optimized molding condition for LGP with 0.4 mm thickness was obtained by using the Moldflow simulation software and the optimized pattern for better brightness uniformity was designed for the thickness of the 0.4 mm by trial and error method. The brightness was measured for the different LGP thicknesses and the residual stress analysis was performed for 0.4 mmthickness by the photoelasticity and the results are compared with 0.5 mm, 0.6 mm thickness.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.118-124
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• 2016

In this study, experiments are conducted to improve spray coating uniformity by using second and third electrodes based on the electrospray atomization mechanism. The uniformity of fabricated thin films can be improved by adjusting the design of the second electrode. The implementation of the second electrode with an elongated hole and a bending angle of $90^{\circ}$ results in highly uniform films. In addition, induced area to substrate is increased by lowering the applied voltage using the third electrode with a round rod shape. A linear correlation between applied voltage and induced area is confirmed. Thin film thickness and surface roughness are measured after the fabrication of thin films through the electrospray process. It is confirmed that a thin film is formed having an average thickness of 273.44 nm, a thickness uniformity of less than 10%, and a surface roughness of 3 nm.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2153-2155
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• 2005

SF6 &NF3 chemistry를 사용하여 W bitline process 조건에서 plasma confinement 및 gas & radical의 flow에 영향을 미치는 focus ring 재질과 두께변경을 하여 Rnit non uniformity 평가한다.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.8
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• pp.81-87
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• 1993

The growth thickness uniformity of epitaxial layers deposited using a moiecular beam epitaxy system is calculated from the arrangement of molecular beam source and the substrate and the geometric dimensions of the crucible in order to predict the optimum design conditions of the prototype MBE system. The thickness uniformity better than 5% over a 3-inch wafer can be obtained by keeping the distance between the substrate and the crucible's orifice longer than 20cm, the tapering angle of the crucible larger than 6$^{\circ}$, and the angle between the normal to the substrate at the center and the crucible axis as larger as possible. In addition, the growth yield decreases to below 51% as the distance between the substrate and the orifice becomes longer than 25cm.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.728-731
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• 2002

For the evaporation process, thickness uniformity is of great practical importance. And, it is commercially significant to improve the efficiency of material of the evaporant which is deposited on the substrate because of high price of organic materials. To achieve the better thickness uniformity and the higher evaporating efficiency, Samsung SDI has introduced the new concept of the asymmetric evaporation technology for depositing evener and cheaper organic layers. Based on the developed method, the uniformity of the organic layer thickness can be successfully controlled. Furthermore, the very high efficiency may allow the OLED displays be manufactured with the lower cost.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.7
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• pp.76-84
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• 1994

The characteristics of 3 inch wafer scale GaAs epitaxial wafer grown by molecular beam epitaxy for LSI process application were studied. The thickness and doping uniformity are characterized and discussed. The growth temperature and growth rate were $600^{\circ}C$ by pyrometer, and 1 $\mu$m/h, respectively. It was found that thickness and doping uniformity were 3.97% and 4.74% respectively across the full 3 inch diameter GaAs epitaxial layer. Also, ungated MESFETs have been fabricated and saturation current measurement showed 4.5% uniformity on 3 inch, epitaxial layer, but uniformity of threshold voltage increase up to 9.2% after recess process for MESFET device.

• Transactions of Materials Processing
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• v.18 no.2
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• pp.156-159
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• 2009

Slot coating has been wide spread in photo-resist coating on the glass for liquid crystal display. Die in slot coater consists of manifold and land. Material comes in inlet of the die and flow into the manifold and then flow out through the land. The coating thickness variations along the die length depend upon inside of die design such as manifold and die land. However the coating thickness variations along the moving direction(coating direction) of the coater depend upon the operational conditions of coater as well as die lip design. The coating behaviors including atmospheric air have been investigated in this study. Die geometries considered in this study were nozzle gap and length of the die lip. Coating gap and coating speed were the variables fur coating operational conditions. When the nozzle gap and length of die lip increased climbing effect of PR on the downstream die lip was reduced. Subsequently uniformity of coating thickness improved. Uniformity of coating thickness also enhanced as coating gap and coater speed increased. The uniformity of coating gap was related to the velocity vector distributions on the coating surface.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.11
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• pp.2836-2844
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• 2000

Thickness control of hot-rolled strips has become an important issue in recent years because of the need for improving the quality of the hot-rolled strip. In this study, a modifying method of rolling force set-up with consideration of spread was developed to improve the thickness uniformity at the finishing rolling units in hot rolling. Through the analysis of real production data it was found that the accuracy of the rolling force determined from the finishing mill set-up (FSU) model dominantly governed the thickness uniformity in rolled plates at the front. Based on this analysis , several examples were selected to calculate the spread of rolled plate using three dimensional rigid thermo-viscoplastic finite element program. FE analysis results were used to train the neural network system that can predict the spread hot-rolled plate and the rolling force was modified based on the predicted value of spread. The modified rolling forces were closer to the measured rolling force so it can be expected that the accuracy of thickness uniformity of hot-rolled plate will be improved.

• Journal of the Korean institute of surface engineering
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• v.18 no.3
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• pp.105-115
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• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.