• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2009년도 춘계학술대회 논문집
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• pp.255-258
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• 2009

Leading developed countries have studied energy self-sufficient houses such as zero or low energy buildings to reduce energy consumption for buildings since the early 1990s. Moreover, some developed countries have actually constructed self-sufficient houses and operated them for demonstration, expanding use of such houses. Korea has also established Zero Energy Solar House(ZeSH) and studied energy independence. Therefore, this study analyzed research result regarding ZeSH, self-sufficient energy house hold of Korea, found out technologies used for heating energy independence, used building interpretation program(ESP_r) to evaluate performance of each factors and analyzed energy reduction quantitatively. Results from the research are as follows: Reduction rate of actual detached house's heating load was also analyzed quantitatively depending on application of each technology. When each factor was applied step-by-step, annual reduction rate of heating load depending on increase in insulation thickness reached 6.6~22.2 %. Annual reduction rate of heating load depending on increase insulation thickness, and change in window heating performance and area ratio reached 31.5 %. Annual reduction rate of heating load through high-sealing and high-insulation depending on change in leakage rate reached 40.0~88.9 %. Annual reduction of heating load, when Mass Wall and attached sun space was applied were applied reached 28.5~39.2 %, respectively.

• 한국자동차공학회논문집
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• 제21권2호
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• pp.131-135
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• 2013

In this study, to develop a light weight duo type aluminum LPG tank in stead of a conventional steel tank optimization technology is used. Two types of optimization method are carried out for internal compression test simulation of a LPG tank. The first is the thickness only optimization of LPG tank components. The second is the thickness and shape optimization. For the case of the thickness only optimization the weight reduction rate of an optimized tank compare to that of the initial design is 42%. Also 48% weight reduction was achieved for the case of the thickness and shape optimization.

• 한국산학기술학회논문지
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• 제21권6호
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• pp.672-678
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• 2020

국내에서 생산중인 대구경 탄약은 대부분 Ogive 부를 제조하는 방법으로 Press Nosing 공법을 적용하고 있다. Press Nosing 공법은 프레스 공정 전 후 윤활처리 등의 추가적인 공정이 필요한 단점이 있다. 본 연구에서는 이러한 단점을 개선할 수 있는 점진성형 공법 중 하나인 Swaging 공법의 대구경 탄약 적용 가능성을 제시하고자 하였다. 대구경 탄약인 155MM K307 탄체는 Press Nosing 공정을 적용하는 대표적인 제품으로, 본 연구에서는 K307 탄체의 Sub-scale 시험품을 제작하여 Swaging 공정을 적용한 소성가공 실험을 실시하였다. 최종 성형 치수를 만족하는 단면감소율 75 % 까지 소성가공이 가능한지 여부 및 Swaging 성형으로 제작된 제품의 치수만족 여부, 제품 결함 발생 여부, 단면감소율에 따른 경도 변화, 두께의 증가 등을 고찰하였다. 시험을 통해 단면적 감소율에 따라 비례적으로 경도가 증가하여 단면적 감소율 75 %에서 경도는 HV 335 이상 증가하는 것을 확인하였다. 소재두께 변화량은 이론적 계산값과 유사한 경향을 보였으며 단면 감소율 75 %에서 두께 증가율은 65.4 %로 비례함을 확인하였다.

• 열처리공학회지
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• 제30권6호
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• pp.251-257
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• 2017

The effect of annealing temperature on the martensitic transformation behavior, tensile deformation chracteristics and shape recovery etc., has been studied in TiNi based shape memory ribbon fabricated by coldrolling of wire. TiNi based shape memory wire (${\phi}=500{\mu}m$) of which structure is intermetallic compound could be cold-rolled without process annealing up to the reduction rate in thickness of 50%, but a few cracks appear in cold-rolled ribbon in the reduction rate in thickness of 65%. The $B2{\rightarrow}R{\rightarrow}B19^{\prime}$ martensitic transformation or $B2{\rightarrow}B19^{\prime}$ martensitic transformation occurs in annealing conditions dissipating lattice defects introduced by coldrolling. However, in case of higher reduction rate or lower annealing temperature, martensitic transformation in cold-rolled and then annealed ribbons does not occur. The maximum shape recovery rate of cold-rolled ribbons with the reduction rate of 35 and 65% could be achieved at annealing temperatures of 250 and $350^{\circ}C$, respectively. The shape recovery rate seems to be related to the stress level of plateau region on stress-strain curve.

• 한국방사선학회논문지
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• 제12권3호
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• pp.373-379
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• 2018

본 논문에서는 척추측만증 환자의 진료를 위하여 필요한 Whole Spine Scanography 검사에서 촬영거리, 환자자세(전후 후전 방향), 흉부벽두께, 갈비뼈두께, 폐조직두께, 관전압, 고전압정류방식의 변화에 따른 유방의 입사선량의 차이에 대한 정량적인 자료를 제시하고자 하였다. 환자의 자세(전후방향과 후전방향)에 따른 유방 입사선량의 저감효과를 확인하기 위하여 관전압 90 kVp, 커마 0.1 mGy, 촬영거리 260 cm, 관전압의 리플율이 0인 인버터정류방식, 필터의 두께 3.5 mm, 환자의 흉벽의 두께 120 mm를 조건으로 Simulation of X-ray Spectra program을 이용하여 시뮬레이션 하였다. 그 결과 알루미늄 필터 두께 3.5 mm에서 2.6배, 흉벽의 두께 120 mm에서 25.7배, 고 관전압에서 1.43배, 관전압 리플율 0에서 1.14배의 선량 저감효과가 있었다. 각각의 입사 선량저감효과의 총합은 약 109배이었다. RANDO phantom의 자세(전후방향과 후전방향)에 따른 선량 저감효과를 확인하기 위하여 촬영거리 260 cm, 관전압 90 kVp, 관전류 270 mA, 촬영시간 0.31 sec, 관전압의 리플율이 0인 인버터정류방식, 필터의 두께 3.5 mm을 조건으로 측정한 결과 유방의 입사선량은 전후 방향에 비하여 후전방향이 평균 20.56배의 선량 저감효과가 있었다.

• 전기의세계
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• 제30권4호
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• pp.227-230
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• 1981

The variation of sheet resistance and the reduction of masking oxide thickness with the flow rate of nitrogen gas has been measured in Boron predeposition process with Planar Diffusion source, BN-975. At 900.deg. C, the sheet resistance varied as much as 75% when the nitrogen flow rate was changed from 0.4 liters/min to 2.0 liters/min. At 975.deg. C, however, only 12% of sheet resistance variation was observed under the same flow rate change. The reduction of masking oxide thickness at 975.deg. C for a 5 min predeposition was 600 nm when the nitrogen flow rate was 0.4 liters/min. When the flow rate incresased to 1.9 liters/min, however, only 100nm of masking oxide was consumed in a similar predeposition process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 한국분말재료학회지
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• 제4권2호
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• pp.106-112
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• 1997

$Cu-Al_20_3 $ composite powders were prepared by hydrogen reduction of $Cu^{2+}$ from ammoniacal copper sulfate solution on alumina core using autoclave. The copper reduction rate and the properties of copper layer were investigated using Scanning Electron Microscope(SEM), X-ray diffractometer, size and chemical analyzers. The reduction rate of $Cu^{2+}$ showed the maximum value when the molar ratio of [$NH_3$]/[$Cu^{2+}$] was 2. In order to prevent the agglomeration of Cu powder and ethane reduction rate, $Fe^{2+}$ and anthraquinone which act as catalysis were added in the solution. Catalysis was effectively chanced with the addition of two elemerts at a time. Optimum conditions obtained in this study were hydrogen reduction temperature of 205$^{\cire}C$, stirring speed of 500 rpm and hydrogen partial pressure of 300 psi. Obtained $Cu-Al_20_3 $ composite Powders were found to have the uniform and continuous copper coating layer of nodule shape with 3~5 $\mu$m thickness.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2006년도 제26회 춘계학술대회논문집
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• pp.387-390
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• 2006

스피닝은 가장적은 가공력과 간단한 도구를 이용하여 소재를 변형시키는 방법중의 하나이다. 그리고 소재의 소성변형으로 인해 기계적 특성의 향상을 가져오는 공법이다. 이러한 스피닝 공법은 자동차, 항공, 군사 분야에서 중요한 부품의 생산에 적용되는 기술이다. 본 연구에서는 발사체 연료탱크의 돔형상에 스피닝 공법을 적용하여 제작함에 있어 롤러의 이송속도와 소재의 두께감소에 따른 성형력의 경향을 유한요소 해석을 이용하여 분석하였다.