• 한국결정성장학회지
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• 제31권5호
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• pp.218-227
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• 2021

저온 동시 소성용 후막 NTC 서미스터를 Mn_1.5Ni_0.4Co_0.9Cu_0.4O₄ 조성의 NTC 분말과 lead free frit 및 RuO₂를 이용하여 제조한 페이스트를 96 % 알루미나 기판 위에 인쇄와 소결을 통해 제조한 후, 이 후막 NTC의 전기적 특성에 미치는 프릿트 및 RuO₂의 영향을 연구하였다. 후막 NTC 서미스터의 저항은 동일한 온도에서 소결한 벌크 상에 비해 높게 나타났으나 저항-온도 특성에서 부 저항 온도 특성은 더 명확하게 직선적으로 나타남을 알 수 있었다. 한편, 소결온도 증가에 따라 면적저항은 감소하였고 프릿트 첨가량이 많을수록 면적저항은 높게 나타났다. 후막 NTC 서미스터의 B 정수는 3000 K 이상의 값 나타냈는데 그 중 프릿트를 5 wt% 첨가한 페이스트로 만든 후막 NTC를 900℃에서 소결한 시편의 B 정수가 가장 높게 나타남을 알 수 있었다. 또한, RuO₂ 첨가에 따라 면적저항의 감소가 나타남을 알 수 있었으며 RuO₂를 5 wt% 첨가한 페이스트를 900℃에서 소결한 후막 NTC 서미스터의 면적저항 감소의 변화가 가장 뚜렷이 나타남을 알 수 있었다.

• 한국재료학회지
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• 제21권5호
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• pp.277-282
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• 2011

Negative temperature coefficient (NTC) materials have been widely studied for industrial applications, such as sensors and temperature compensation devices. NTC thermistor thick films of $Ni_{1+x}Mn_{2-x}O_{4+{\delta}}$ (x = 0.05, 0, -0.05) were fabricated on a glass substrate using the aerosol deposition method at room temperature. Resistance verse temperature (R-T) characteristics of the as-deposited films showed that the B constant ranged from 3900 to 4200 K between $25^{\circ}C$ and $85^{\circ}C$ without heat treatment. When the film was annealed at $600^{\circ}C$ 1h, the resistivity of the film gradually decreased due to crystallization and grain growth. The resistivity and the activation energy of films annealed at $600^{\circ}C$ for 1 h were 5.203, 5.95, and 4.772 $K{\Omega}{\cdot}cm$ and 351, 326, and 299 meV for $Ni_{0.95}Mn_{2.05}O_{4+{\delta}}$, $NiMn_2O_4$, and $Ni_{1.05}Mn_{1.95}O_{4+{\delta}}$, respectively. The annealing process induced insulating $Mn_2O_3$ in the Ni deficient $Ni_{0.95}Mn_{2.05}O_{4+{\delta}}$ composition resulting in large resistivity and activation energy. Meanwhile, excess Ni in $Ni_{1.05}Mn_{1.95}O_{4+{\delta}}$ suppressed the abnormal grain growth and changed $Mn^{3+}$ to $Mn^{4+}$, giving lower resistivity and activation energy.

• 한국세라믹학회지
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• 제50권1호
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• pp.63-69
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• 2013

Negative-temperature coefficient (NTC) thermistors based on nickel manganite spinel ($NiMn_2O_4$) are widely used for many applications, such as sensors and temperature compensators, due to their good thermistor characteristics and stabilities. However, to achieve thermistors with a high NTC B constant, which is an important figure of merit pertaining to the degree of temperature sensitivity, the activation energy should be high such that high resistivity at ambient temperatures results. To obtain a high B constant and low resistivity, Al and Si modified spinel structured $Ni_{0.6}Si_{0.2}Al_{0.6}Mn_{1.6}O_4$ hybrid thick films with the conducting metal oxide of $LaNiO_3$ were fabricated on a glass substrate by aerosol deposition at room temperature (RT). The NTC-$LaNiO_3$ hybrid thick films showed resistivity as low as < $100k{\Omega}\;cm$ at $90^{\circ}C$, which is one or two orders of magnitude lower than that of the monolithic NTC films, while retaining a high B constant of $NiMn_2O_4$ of over 5500 K when 20 wt% $LaNiO_3$ was added without a post-thermal treatment. These phenomena are explained by the percolation threshold mechanism.

• 한국전기전자재료학회논문지
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• 제25권8호
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• pp.584-592
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• 2012

Room temperature powder spray in vacuum process, so called Aerosol deposition (AD) is a room temperature (RT) process to fabricate thick and dense ceramic films, based on collision of solid ceramic particles. This technique can provide crack-free dense thin and thick films with thicknesses ranging from sub micrometer to several hundred micrometers with very fast deposition rates at RT. In addition, this technique is using solid particles to form the ceramic films at RT, thus there is few limitation of the substrate and easy to control the compositions of the films. In this article, we review the progress made in synthesis of piezoelectric thin/thick films, multi-layer structures, NTC thermistor thin/thick films, oxide electrode thin films for actuators or sensor applications by AD at Korea Institute of Materials Science (KIMS) during the last 4 years.