• Journal of the Korean Wood Science and Technology
• /
• v.30 no.3
• /
• pp.34-41
• /
• 2002

This study investigated the thermogravimetric analysis of two types of cured tannin-based adhesives from wattle and pine, with three hardeners of paraformaldehyde, hexamethylenetetramine and TN (tris(hydroxyl)nitromethan), at a temperature of 170℃ and a heating rate of 5, 10, 20 and 40℃/min for 10 minutes. The 5 minutes cured wattle tannin-based adhesive with each hardener at 170℃ was also tested to compare the degree of curing. It was found that thermogravimetric analysis could be used to measure the degree of curing of a thermosetting adhesive. The TG-DTG curves of all the adhesive systems were similar and showed three steps in a similar way to a phenolic resin. This means that each adhesive system is well cross-linked. However, a high thermal decomposition rate was shown at 150 to 400℃ in the case of the pine tannin sample with TN (tris(hydroxyl)nitromethan). The Flynn & Wall expression was used to evaluate the activation energy for thermal decomposition. As the level of conversion (𝛼) increased, the activation energy of each system increased. The activation energy of the wattle tannin-based adhesive with paraformaldehyde was higher than the others.

• Journal of the Korean Wood Science and Technology
• /
• v.50 no.5
• /
• pp.353-364
• /
• 2022

The crystalline domain of thermosetting urea-formaldehyde (UF) resins at low formaldehyde-to-urea (F/U) molar ratios (≤ 1.0) is known to be responsible for their poor performance as wood adhesives. Crystallization has been observed in 1.0 F/U UF resins during the addition reaction stage and at the end of the synthesis process (neat UF resins). The crystallinity and X-ray diffraction (XRD) spectra of the uncured neat UF resins, on the other hand, differed significantly from those of the cured neat UF resins, raising the possibility that their crystal structures were also different. This study demonstrates for the first time that the crystalline domains in 1.0 F/U UF resins generated from uncured and cured samples are identical. Despite having a lower crystallinity value, the synchrotron XRD patterns of purified neat UF resins were equivalent to the XRD patterns of cured neat UF resins. Transmission electron microscope images of the cured UF resins showed that the crystals were lamellar structures. This finding suggests that the crystal at low molar ratio UF resins are isotropic polycrystals with random orientation.

• Applied Chemistry for Engineering
• /
• v.20 no.3
• /
• pp.307-312
• /
• 2009

The block-co-polymer type thermosetting polysiloxane coordinated with metal oxide was synthesized to investigate the effect of metal oxide on the dispersity of metal powder in the polysiloxane/metal composite material. The metal powder in the polysiloxane/metal composite materials is better dispersed with metal oxide complex polysiloxane than the case without metal oxide. To understand the effect of quantities of metal oxide on the polysiloxane chain, the various polysiloxanes with different ratios of block unit were synthesized. Electrical conductivity was interpreted by percolation threshold theory to understand the dispersity of dense composite. The behavior of conductivity was in good agreement with theoretical value. The critical value was decreased as the quantities of metal oxide are increased. As a result, as the metal oxide increased on the polymer chain, the dispersity of metal filler was increased.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
• /
• 2004.05a
• /
• pp.326-330
• /
• 2004

Thermosetting matrix composites have disadvantages in terms of moulding time, repairability and manufacturing cost. Thus the high-performance thermoplastic composites to eliminate such disadvantages have been developed so far. As a result of environmental and economical concerns, there is a growing interest in the use of thermoplastic composites. However, since their mechanical properties are very sensitive to the environment such as moisture, temperature etc., those behaviors need to be studied. Particularly the temperature is a very important factor influencing the mechanical behavior of thermoplastic composites. The effect of temperature have not yet been fully quantified. Since engineering applications of reinforced composites necessitate their fracture mechanics characterization, work is in progress to investigate the fracture and related failure behavior. An approach which predicts the tensile strength was perpormed in the tensile test. The main goal of this work is to study the effect of temperature on the result of tensile test with respect to GF/PE composite. The tensile strength and failure mechanisms of GF/PE composites were investigated in the temperature range $60^{\circ}C\;to\;-50^{\circ}C$. The tensile strength increased as the fiber volume fraction ratio increased. The tensile strength showed the maximum at $-50^{\circ}C$, and it tended to decrease as the temperature increased from $-50^{\circ}C$. The major failure mechanisms was classified into the fiber matrix debonding, the fiber pull-out, the delamination and the matrix deformation.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.24 no.1 s.173
• /
• pp.1-6
• /
• 2000

As dies and molds have become more and more complicated in the recent years, the demand for lower cost and shorter production time is also growing stronger. Rapid prototyping and Tooling technologies are expected to be used for more rapid and lower cost tool fabrication. However the rapid tooling methods have not yet reached the level of application to the manufacturing of metallic dies and molds which require high dimensional accuracy. As the rapid tooling technology, there are the slurry casting, the powder casting, the direct laser sintering, and so on. Generally, in the slurry casting, the alumina powder and the water soluble phenol were mainly used. However, the mechanical properties of the phenol were not good enough to apply to molds directly. In this study, pure epoxy and two types of aluminium powder reinforced resin are applied to the slurry casting. The mechanical and thermal properties are better than phenol because the epoxy is the thermosetting resin. And mechanical characteristics such as shrinkage rate, hardness, surface roughness are measured for the sake of comparison. Metal powder reinforced resin molds are better than the resin tool form the viewpoint of shrinkage rate and hardness. Finally, it has been shown that the application possibility of this process is high, because the manufacturing time and cost savings are significant.

• Journal of the Korean Wood Science and Technology
• /
• v.35 no.2
• /
• pp.51-60
• /
• 2007

In this study, the possibility of using pyrolysis oil as wood adhesives was explored. Especially, adhesives were formulated by reacting pyrolysis oil and formaldehyde and also partially replacing phenol with pyrolysis oil in phenol-formaldehyde (PF) adhesive and soy hydrolizate/PF adhesive formulation. The pine wood was fast pyrolyized and the oils were obtained from a series of condensers in the pyrolysis system. The oils from each condenser were first reacted with formaldehyde to explore potential use of the oil itself as adhesive. The lap-shear bond strength test results indicated that the oil itself could be polymerized and form bonds between wood adherends. The oils from each condenser were then mixed together and used as partial replacement of phenol (25, 33, and 50% by weight) in phenol-formaldehyde adhesive. The bond strength of the oil containing PF adhesives was decreased as percent phenol replacement level increased. However, no significant difference was found between 25 and 33% of phenol replacement level. The oil-contained PF resins at 25, 33, and 50% phenol replacement level with different NaOH/Phenol (Pyrolysis oil) molar ratio were further formulated with soy hydrolizate to make soy hydrolizate/pyrolysis oil-phenol formaldehyde adhesive at 6:4 weight (wt) ratio and used for fiberboard manufacturing. Surface internal bond strength (IB) of the boards bonded with 33% replacement at 0.3 NaOH/Phenol (Pyrolysis oil) molar ratio performed better than other replacement levels and molar ratios. Thickness swelling after 24 hr cold water soaking and after 2 hr in boiling water was increased as % replacement of pyrolysis oil increased.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.380-380
• /
• 2013

본 논문에서는 외기 환경 요인 중에서 H2O와 O2의 영향으로 성능이 저하되는 유기박막트랜지스터(OTFT)의 수명시간 향상을 위하여 필요한 passivation layer의 효과에 대하여 알아 보았다. OTFT에 기존의 액상 공정이나 증착 공정으로 단일 passivation layer또는 다층 passivation layer를 형성하는 방식과는 다르게 향후에 산업 전반에 적용이 기대되는 것을 고려하여 제작 공정의 간편성을 위하여 film 형태로 되어 있는 열경화성 epoxy resin film으로 passivation layer를 구현하는 방법을 사용하여 OTFT의 storage stability를 평가하였다. passivation layer가 없는 OTFT와 열경화성 epoxy resin film으로 passivation된 OTFT의 전기적 특성이 서로 비교 평가되었으며 또한 30일 동안 온도 $25^{\circ}C$ 상대습도 40%의 환경을 갖는 Desicator 안에서 소자를 보관하여 시간에 따른 전기적 특성 변화를 검증하여 epoxy resin film의 passivation layer으로의 적용가능성을 검증하였다. 결과적으로 30일 후의 passivation layer가 없는 OTFT의 전기적 특성은 매우 낮게 떨어진 반면에 epoxy resin film으로 passivation layer가 구현된 OTFT의 mobility는 $0.060cm^2$/Vs, VT는 -0.18 V, on/off ratio는 $3.7{\times}10^3$으로 초기의 소자 특성이 잘 유지되는 결과를 얻었다. OTFT는 Flexible한 polyethersulfone (PES)기판에 게이트 전극이 하부에 있는 Bottom gate 구조로 제작되었고 채널 형성을 위한 유기반도체 재료로 6,13-bis (triisopropylsilylethynyl) (TIPS) pentacene이 사용되었고 spin coating된 Poly-4-vinylphenol (PVP)가 게이트 절연체로 사용되었다. 이때 Au전극은 Shadow mask를 이용하여 증착하였다. 또한 OTFT의 채널 길이 $100{\mu}m$, 채널 폭 $300{\mu}m$의 영역에 Drop casting법을 사용하여 채널을 형성하였다. 물리적 특성은 scanning electron microscopy (SEM), scanning probe microscopy (SPM), x-ray diffraction (XRD)를 사용하여 분석하였고, 전기적 특성은 Keithley-4200을 사용하여 추출하였다.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.66 no.5
• /
• pp.800-805
• /
• 2017

The accelerated thermal ageing of CSPE (chlorosulfonated polyethylene) was carried out for 16.82, 50.45, and 84.09 days at $110^{\circ}C$, equivalent to 20, 60, and 100 years of ageing at $50^{\circ}C$ in nuclear power plants, respectively. As the accelerated thermally aged years increase, the insulation resistance and resistivity of the CSPE decrease, and the capacitance, relative permittivity and dissipation factor of those increase at the measured frequency, respectively. As the accelerated thermally aged years and the measured frequency increase, the phase degree of response voltage vs excitation voltage of the CSPE increase but the phase degree of response current vs excitation voltage decrease, respectively. As the accelerated thermally aged years increase, the apparent density, glass transition temperature and the melting temperature of the CSPE increase but the percent elongation and % crystallinity decrease, respectively. The differential temperatures of those are $0.013-0.037^{\circ}C$ and, $0.034-0.061^{\circ}C$ after the AC and DC voltages are applied to CSPE-0y and CSPE-20y, respectively; the differential temperatures of those are $0.011-0.038^{\circ}C$ and $0.002-0.028^{\circ}C$ after the AC and DC voltages are applied to CSPE-60y and CSPE-100y, respectively. The variations in temperature for the AC voltage are higher than those for the DC voltage when an AC voltage is applied to CSPE. It is found that the dielectric loss owing to the dissipation factor($tan{\delta}$) is related to the electric dipole conduction current. It is ascertained that the ionic (electron or hole) leakage current is increased by the partial separation of the branch chain of CSPE polymer as a result of thermal stress due to accelerated thermal ageing.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.2 no.1
• /
• pp.75-82
• /
• 1988

Epoxy, noticed as a new insulation material tor electrical installation, may become an excellent cured material from the crosslink reaction with some curing agents. The characteristics of cured Epoxy is determined by the kind of the curing agents and the method of lattice formation. The purpose of this paper, varing the process of lattice formation by various surrounding temperatures during the curing process, is to obtain the optimum curing temperature for electrical insulation from the results of investigation on the properties of cured Epoxy. In the experiment, Epoxy was cured at various temperatures between $20[^{\circ}C] and 50^[{\circ}C]$ which differ by $5^[{\circ}C]$, and then examined on the electrical insulation haracteristics as well as the thermal and mechanical stability. As a result, it is concluded that the optimum electrical insulation characteristis and mechanical strength of cured Epoxy can be obtained when cured at a surrounding temperature at $30[^{\circ}C]$.

• Polymer(Korea)
• /
• v.38 no.4
• /
• pp.417-424
• /
• 2014

Reactivity and rheological behavior of highly concentrated polymer bonded explosives (PBX) simulant was studied. As a binder, thermosetting hydroxyl terminated polybutadiene (HTPB) was used. By using bimodal $CaCO_3$ (size ratio 10:1) and sugar particles (size ratio 25:1) as fillers, maximum 75 v% filling was possible during melt mixing. The relative viscosities of bimodal suspension were much lower than those of unimodal one and showed minimum values at 0.25 of fine particle fraction. In curing experiment, as curing temperature increased, the time of initiation and completeness of curing reaction became shortened, the torque kept low, and the change of internal temperature decreased.