• Journal of the Korean Wood Science and Technology
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• 제30권3호
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• pp.34-41
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• 2002

This study investigated the thermogravimetric analysis of two types of cured tannin-based adhesives from wattle and pine, with three hardeners of paraformaldehyde, hexamethylenetetramine and TN (tris(hydroxyl)nitromethan), at a temperature of 170℃ and a heating rate of 5, 10, 20 and 40℃/min for 10 minutes. The 5 minutes cured wattle tannin-based adhesive with each hardener at 170℃ was also tested to compare the degree of curing. It was found that thermogravimetric analysis could be used to measure the degree of curing of a thermosetting adhesive. The TG-DTG curves of all the adhesive systems were similar and showed three steps in a similar way to a phenolic resin. This means that each adhesive system is well cross-linked. However, a high thermal decomposition rate was shown at 150 to 400℃ in the case of the pine tannin sample with TN (tris(hydroxyl)nitromethan). The Flynn & Wall expression was used to evaluate the activation energy for thermal decomposition. As the level of conversion (𝛼) increased, the activation energy of each system increased. The activation energy of the wattle tannin-based adhesive with paraformaldehyde was higher than the others.

• Journal of the Korean Wood Science and Technology
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• 제50권5호
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• pp.353-364
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• 2022

The crystalline domain of thermosetting urea-formaldehyde (UF) resins at low formaldehyde-to-urea (F/U) molar ratios (≤ 1.0) is known to be responsible for their poor performance as wood adhesives. Crystallization has been observed in 1.0 F/U UF resins during the addition reaction stage and at the end of the synthesis process (neat UF resins). The crystallinity and X-ray diffraction (XRD) spectra of the uncured neat UF resins, on the other hand, differed significantly from those of the cured neat UF resins, raising the possibility that their crystal structures were also different. This study demonstrates for the first time that the crystalline domains in 1.0 F/U UF resins generated from uncured and cured samples are identical. Despite having a lower crystallinity value, the synchrotron XRD patterns of purified neat UF resins were equivalent to the XRD patterns of cured neat UF resins. Transmission electron microscope images of the cured UF resins showed that the crystals were lamellar structures. This finding suggests that the crystal at low molar ratio UF resins are isotropic polycrystals with random orientation.

• 공업화학
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• 제20권3호
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• pp.307-312
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• 2009

폴리실록산/금속 복합체 내에서의 금속입자의 분산성에 영향을 파악하기 위하여 금속산화물을 배위결합으로 가지고 있는 불록공중합체 형태의 변성 폴리실록산을 합성하였다. 합성된 폴리실록산과 금속입자와의 복합체 제조를 통하여 금속입자의 고분자상 분산상태를 확인하였으며 그 결과 금속산화물의 도입이 복합체 내 금속입자의 분산성에 영향을 미침을 확인하였다. 입자의 분산성과 변성폴리실록산에 도입된 금속산화물의 양적 관계 해석을 위하여 다양한 몰분율을 가지는 변성폴리실록산을 합성하였으며 복합체를 제조하였으며, 몰분율 변화에 따른 복합체에서의 분산성 향상을 파악하기 위하여 복합체의 전기전도성을 측정하여 그 결과를 percolation threshold 이론에 따라 해석하였다. 그 결과 금속산화물의 도입된 양이 많을수록 전도성의 임계농도가 낮아짐을 확인할 수 있으며 이를 통해 변성실록산 내 금속산화물의 몰분율의 증가가 입자의 분산성에 미치는 영향을 해석하였다.

• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2004년도 학술대회지
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• pp.326-330
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• 2004

Thermosetting matrix composites have disadvantages in terms of moulding time, repairability and manufacturing cost. Thus the high-performance thermoplastic composites to eliminate such disadvantages have been developed so far. As a result of environmental and economical concerns, there is a growing interest in the use of thermoplastic composites. However, since their mechanical properties are very sensitive to the environment such as moisture, temperature etc., those behaviors need to be studied. Particularly the temperature is a very important factor influencing the mechanical behavior of thermoplastic composites. The effect of temperature have not yet been fully quantified. Since engineering applications of reinforced composites necessitate their fracture mechanics characterization, work is in progress to investigate the fracture and related failure behavior. An approach which predicts the tensile strength was perpormed in the tensile test. The main goal of this work is to study the effect of temperature on the result of tensile test with respect to GF/PE composite. The tensile strength and failure mechanisms of GF/PE composites were investigated in the temperature range $60^{\circ}C\;to\;-50^{\circ}C$. The tensile strength increased as the fiber volume fraction ratio increased. The tensile strength showed the maximum at $-50^{\circ}C$, and it tended to decrease as the temperature increased from $-50^{\circ}C$. The major failure mechanisms was classified into the fiber matrix debonding, the fiber pull-out, the delamination and the matrix deformation.

• 대한기계학회논문집A
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• 제24권1호
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• pp.1-6
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• 2000

As dies and molds have become more and more complicated in the recent years, the demand for lower cost and shorter production time is also growing stronger. Rapid prototyping and Tooling technologies are expected to be used for more rapid and lower cost tool fabrication. However the rapid tooling methods have not yet reached the level of application to the manufacturing of metallic dies and molds which require high dimensional accuracy. As the rapid tooling technology, there are the slurry casting, the powder casting, the direct laser sintering, and so on. Generally, in the slurry casting, the alumina powder and the water soluble phenol were mainly used. However, the mechanical properties of the phenol were not good enough to apply to molds directly. In this study, pure epoxy and two types of aluminium powder reinforced resin are applied to the slurry casting. The mechanical and thermal properties are better than phenol because the epoxy is the thermosetting resin. And mechanical characteristics such as shrinkage rate, hardness, surface roughness are measured for the sake of comparison. Metal powder reinforced resin molds are better than the resin tool form the viewpoint of shrinkage rate and hardness. Finally, it has been shown that the application possibility of this process is high, because the manufacturing time and cost savings are significant.

• Journal of the Korean Wood Science and Technology
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• 제35권2호
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• pp.51-60
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• 2007

In this study, the possibility of using pyrolysis oil as wood adhesives was explored. Especially, adhesives were formulated by reacting pyrolysis oil and formaldehyde and also partially replacing phenol with pyrolysis oil in phenol-formaldehyde (PF) adhesive and soy hydrolizate/PF adhesive formulation. The pine wood was fast pyrolyized and the oils were obtained from a series of condensers in the pyrolysis system. The oils from each condenser were first reacted with formaldehyde to explore potential use of the oil itself as adhesive. The lap-shear bond strength test results indicated that the oil itself could be polymerized and form bonds between wood adherends. The oils from each condenser were then mixed together and used as partial replacement of phenol (25, 33, and 50% by weight) in phenol-formaldehyde adhesive. The bond strength of the oil containing PF adhesives was decreased as percent phenol replacement level increased. However, no significant difference was found between 25 and 33% of phenol replacement level. The oil-contained PF resins at 25, 33, and 50% phenol replacement level with different NaOH/Phenol (Pyrolysis oil) molar ratio were further formulated with soy hydrolizate to make soy hydrolizate/pyrolysis oil-phenol formaldehyde adhesive at 6:4 weight (wt) ratio and used for fiberboard manufacturing. Surface internal bond strength (IB) of the boards bonded with 33% replacement at 0.3 NaOH/Phenol (Pyrolysis oil) molar ratio performed better than other replacement levels and molar ratios. Thickness swelling after 24 hr cold water soaking and after 2 hr in boiling water was increased as % replacement of pyrolysis oil increased.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.380-380
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• 2013

본 논문에서는 외기 환경 요인 중에서 H2O와 O2의 영향으로 성능이 저하되는 유기박막트랜지스터(OTFT)의 수명시간 향상을 위하여 필요한 passivation layer의 효과에 대하여 알아 보았다. OTFT에 기존의 액상 공정이나 증착 공정으로 단일 passivation layer또는 다층 passivation layer를 형성하는 방식과는 다르게 향후에 산업 전반에 적용이 기대되는 것을 고려하여 제작 공정의 간편성을 위하여 film 형태로 되어 있는 열경화성 epoxy resin film으로 passivation layer를 구현하는 방법을 사용하여 OTFT의 storage stability를 평가하였다. passivation layer가 없는 OTFT와 열경화성 epoxy resin film으로 passivation된 OTFT의 전기적 특성이 서로 비교 평가되었으며 또한 30일 동안 온도 $25^{\circ}C$ 상대습도 40%의 환경을 갖는 Desicator 안에서 소자를 보관하여 시간에 따른 전기적 특성 변화를 검증하여 epoxy resin film의 passivation layer으로의 적용가능성을 검증하였다. 결과적으로 30일 후의 passivation layer가 없는 OTFT의 전기적 특성은 매우 낮게 떨어진 반면에 epoxy resin film으로 passivation layer가 구현된 OTFT의 mobility는 $0.060cm^2$/Vs, VT는 -0.18 V, on/off ratio는 $3.7{\times}10^3$으로 초기의 소자 특성이 잘 유지되는 결과를 얻었다. OTFT는 Flexible한 polyethersulfone (PES)기판에 게이트 전극이 하부에 있는 Bottom gate 구조로 제작되었고 채널 형성을 위한 유기반도체 재료로 6,13-bis (triisopropylsilylethynyl) (TIPS) pentacene이 사용되었고 spin coating된 Poly-4-vinylphenol (PVP)가 게이트 절연체로 사용되었다. 이때 Au전극은 Shadow mask를 이용하여 증착하였다. 또한 OTFT의 채널 길이 $100{\mu}m$, 채널 폭 $300{\mu}m$의 영역에 Drop casting법을 사용하여 채널을 형성하였다. 물리적 특성은 scanning electron microscopy (SEM), scanning probe microscopy (SPM), x-ray diffraction (XRD)를 사용하여 분석하였고, 전기적 특성은 Keithley-4200을 사용하여 추출하였다.

• 전기학회논문지
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• 제66권5호
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• pp.800-805
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• 2017

The accelerated thermal ageing of CSPE (chlorosulfonated polyethylene) was carried out for 16.82, 50.45, and 84.09 days at $110^{\circ}C$, equivalent to 20, 60, and 100 years of ageing at $50^{\circ}C$ in nuclear power plants, respectively. As the accelerated thermally aged years increase, the insulation resistance and resistivity of the CSPE decrease, and the capacitance, relative permittivity and dissipation factor of those increase at the measured frequency, respectively. As the accelerated thermally aged years and the measured frequency increase, the phase degree of response voltage vs excitation voltage of the CSPE increase but the phase degree of response current vs excitation voltage decrease, respectively. As the accelerated thermally aged years increase, the apparent density, glass transition temperature and the melting temperature of the CSPE increase but the percent elongation and % crystallinity decrease, respectively. The differential temperatures of those are $0.013-0.037^{\circ}C$ and, $0.034-0.061^{\circ}C$ after the AC and DC voltages are applied to CSPE-0y and CSPE-20y, respectively; the differential temperatures of those are $0.011-0.038^{\circ}C$ and $0.002-0.028^{\circ}C$ after the AC and DC voltages are applied to CSPE-60y and CSPE-100y, respectively. The variations in temperature for the AC voltage are higher than those for the DC voltage when an AC voltage is applied to CSPE. It is found that the dielectric loss owing to the dissipation factor($tan{\delta}$) is related to the electric dipole conduction current. It is ascertained that the ionic (electron or hole) leakage current is increased by the partial separation of the branch chain of CSPE polymer as a result of thermal stress due to accelerated thermal ageing.

• 한국조명전기설비학회지:조명전기설비
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• 제2권1호
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• pp.75-82
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• 1988

각종 전기설비용 절연재료로 주목받는 Epoxy는 경화제와의 가교반응으로 전기절연특성이 우수한 경화물질을 얻을 수 있으며, 경화제의 종류와 격자 형성에 형태에 따라 경화된 Epoxy의 특성이 결정된다. 본 연구는 Epoxy의 경화시 분위기의 온도를 변화시켜 격자형성의 진행형태를 변화시키고, 경화된 Epoxy의 제반특성을 조사하여 전기절연특성이 가장 우수하게 되는 경화온도를 얻고자 한다. Epoxy를 분위기 온도 $20~50[^{\circ}C]$사이에서 $5^[{\circ}C]$ 간격으로 변화하면서 경화시킨 결과, 분위기 온도 $30[^{\circ}C]$에서 경화된 Epoxy의 전기절연특성 및 기계적 강도가 가장 우수하다고 판명되었다.

• 폴리머
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• 제38권4호
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• pp.417-424
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• 2014

결합제로 열경화성의 hydroxyl terminated polybutadiene(HTPB)을 사용한 고농축 복합화약 시뮬란트의 조성 및 공정조건에 따른 반응성과 유변학적 거동을 연구하였다. 충전제로서 평균입도비가 각각 10:1과 25:1인 bimodal의 탄산칼슘과 설탕을 사용하여 용융혼련기 내에서 최대 75 v%까지 충전하였다. 평판-평판 레오미터를 사용하여 유변물성을 관찰한 바 bimodal 현탁계를 구성할 경우 unimodal 현탁계보다 훨씬 낮은 상대점도 값을 나타내었으며 총 충전제 양 중 작은 입자 분율이 0.25에서 최저 값을 보였다. 경화 온도가 높을수록 경화 개시 및 완료가 빨랐으며 토크가 낮게 유지되었고 경화로 인한 온도 상승 폭이 작았다.