• Journal of the Korean Ceramic Society
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• v.39 no.7
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• pp.693-698
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• 2002

Reaction-Bonded Silicon Carbide (RBSC) Ceramics were fabricated which satisfies the maximum packing density of silicon carbide skeleton in the green compacts. Such a high packing density induced incomplete infiltration during reaction-sintering; forms linear void around the interface of large alpha silicon carbide powders. During reaction-sintering, the limited extraction and entrapped gas induced by residue oxide was considered to be a reason of linear void formation. In order to improve infiltration behavior in the highly packed preform, the pre-treatment methods for residue oxide removal were proposed.

• Elastomers and Composites
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• v.38 no.2
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• pp.167-174
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• 2003

Thermoplastic vulcanizates (TPV) or dynamic vulcanizates are thermoplastic elastomers produced by simultaneous mixing and crosslinking of a rubber and a thermoplastic. The objective of the present work is to investigate the effects of different types of peroxides as curing agents on the properties of PP/EPDM TPVs. The mechanical properties change significantly with the chemical nature of the peroxides and the extent of crosslinking at a fixed PP/EPDM blend ratio. The tensile strength of the TPVs obtained with the various peroxides can be related to the solubility parameters of the polymers and of the peroxides. The Young's modulus of the peroxide-cured TPVs can be correlated with the delta torque values of equivalent thermoset EPDM vulcanizates, corresponding to the crosslinking efficiencies of the peroxides.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.208-213
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• 2002

When a thermoset conductive adhesive joints are subjected to the thermal cycles, the thermal stresses are developed around the joints. Most of in-plane, hi-axial components of these residual stresses induces large tensile peel stresses and weakens adhesive joints. Also these stresses vary with thermal cycles, and result in thermal fatigue loading and debonding propagation. In this study, the thermal ratchetting effect in conductive adhesive joints are evaluated by the finite element analysis with the viscoelastic material model. In order to Investigate the relationship between thermal ratchetting and glass transition temperature, the mathematical material model has been developed experimentally by dynamic mechanical analysis. These material models are implemented to the finite element analysis with thermal loading cycles. And the stress profiles around the conductive adhesive joints are calculated. It has been observed that the thermal ratchetting occurs when the maximum temperature of thermal cycles is above the glass transition temperature. The peel and shear stress components increase as the thermal loading time increases. This will contributes to thermal fatigue fracture of the joints.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.495-497
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• 2017

Thermoplastic propellants using thermoplastic elastomer binders show moderate performance and mechanical properties compared to thermoset propellants, but these propellants are widely used in a variety of fields due to low cost of raw materials, simple manufacturing process and stable handling process. In order to utilize thermoplastic solid propellants in various fields, we will study properties depending on the content of oxidants, metal fuels and additives.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.235-238
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• 2003

Thermo-plastic has generally bad electrical characteristics at high temperature comparing to thermoset-plastics when the plastic apply to electrical power apparatus as an electrical insulator. To solve the problem, we study engineering plastics such as Polyamide and Polyphthalamide as a base resin. And filler of the engineering plastics is glass fiber. Electrical characteristics studied are permittivity, loss factor and breakdown strength according to temperature and frequency of measuring signal. Electrical characteristics of Polyphthalamide has good temperature and frequency dependency comparing to those of Polyamide.

• Design & Manufacturing
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• v.16 no.3
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• pp.44-49
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• 2022

In this study, the simulation of the resin transfer molding process method using MoldFlow has been investigated. This work explains the thermoset material model, fabric permeability model, the flow model and the cure model. It has been shown that the simulation result can predict filling and cure performances.

• Composites Research
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• v.12 no.5
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• pp.31-39
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• 1999

Glass-fiber reinforced polymeric composites provide the desitable properties of high stiffness and strength as well as specific weight. Hence, they have become some of the most important materials in several industries. These composites can be grouped into thermoplastic and thermoset composites, with thermoplastic composites having several advantages over thermoset composites in mechanical properties and processing. As a result, the study of the material behavior and forming techniques of such composites has attracted considerable attention in recent years. When the continuous fiber-reinforced polymeric composites are molded by flow molding, the molded parts leads to be nonhomogeneity and anisotropic because of the separation and orientation of fibers. As the characteristics of the products are greatly dependent on the separation, it is very important to clarify the separation in relarion to molding conditions, fiber mat structures and mold geometry. In this study, the effects of the mold geometry and the fiber mat structure on the compression moldability are studied using the cup-type molding.

• Korean Journal of Food Science and Technology
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• v.32 no.3
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• pp.570-577
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• 2000

A method was presented for determination of bisphenol F(BPF), bisphenol A(BPA), bisphenol F diglycidyl ether(BFDGE) and bisphenol A diglycidyl ether(BADGE) in 3 aqueous-based food simulants (water, 4% acetic acid, 20% ethanol) by reverse-phase high performance liquid chromatography(RP-HPLC)with fluorescence detection and gas chromatography with mass selective detection(GC/MSD). All the calibration lines in the range of $5{\sim}800\;{\mu}g/L$ had correlation coefficients greater than 0.9998 and detection limits of less than $1.2\;{\mu}g$ bisphenols/L. Precision at $200\;{\mu}g/L$ was under 3.1%. Recoveries of bisphenols simultaneously spiked to aqueous food simulants exceeded 95% for BPF and BPA but about 80% for BFDGE and BADGE. However, recoveris of BFDGE and BPADGE respectively spiked increased upto 95%. Detection limits in recovery test were less than $0.40\;{\mu}g$ bisphenols/L. In migration test bisphenols were determined by RP-HPLC coupled with confirmation by GC/MSD. Can coatings of epoxy phenol, modified epoxy, epoxy ester phenol and thermoset vinyl were exposed to the 3 aqueous food simulants. BPF, BFDGE and BADGE were not detected in all the can coatings but BPA was detected in 4% acetic acid and 20% ethanol in all the can coatings except modified epoxy.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.604-609
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• 2019

In this study, we fabricated a capacitive humidity sensor with interdigitated (IDT) electrodes using a thermosetting polyimide as a humidifying material. First, the number of electrodes, thickness, and spacing of the polyimide film were optimized, and a mask was designed and fabricated. The sensor was fabricated on a silicon substrate using semiconductor processing equipment. The area of the sensor was $1.56{\times}1.66mm^2$, and the width of the electrode and the gap between the electrodes were each $3{\mu}m$. The number of electrodes was 166, and the length of an electrode was 1.294 mm for the sensitivity of the sensor. The sensor was then packaged on a PCB for measurement. The sensor was inserted into a chamber environment with a temperature of $25^{\circ}C$ and connected to an LCR meter to measure the change in capacitance at relative humidity (RH) of 20% to 90%, 1 V, and 20 kHz. The results showed a sensitivity of 26fF/%RH, linearity of < ${\pm}2%RH$, and hysteresis of < ${\pm}2.5%RH$.

• Journal of the Korean Wood Science and Technology
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• v.34 no.2
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• pp.37-45
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• 2006

The viscoelastic properties of blends of melamine-formaldehyde (MF) resin and poly(vinyl acetate) (PVAc) for engineered flooring used on the Korean traditional ONDOL house floor heating system were investigated by dynamic mechanical thermal analysis (DMTA). Because MF resin is a thermosetting adhesive, the effect of MF rein was shown across all thermal behaviors. The addition of PVAc reduced the curing temperature. The DMTA thermogram of MF resin showed that the storage modulus (E') increased as the temperature was further increased as a result of the cross-linking induced by the curing reaction of the resin. The storage modulus (E') of MF resin increased both as a function of increasing temperature and with increasing heating rate. From isothermal DMTA results, peak $T_{tan{\delta}}$ values, maximum value of loss modulus (E") and the rigidities (${\Delta}E$) of MF/PVAc blends at room temperature as a function of open time, peak $T_{tan{\delta}}$ and maximum loss modulus (E") values were found to increase with blend MF content. Moreover, the rigidities of the 70:30 and 50:50 MF/PVAc blends were higher than those of the other blends, especially of 100% PVAc or MF. We concluded that blends the MF/PVAc blend ratios correlate during the adhesion process.