• 제목/요약/키워드: Thermorheologically Simple

검색결과 11건 처리시간 0.017초

열유동학적으로 단순한 점탄성체의 유한요소해석 (Finite Element Analysis of Thermorheologically Simple Viscoelastic Solids)

  • 심우진;박인규
    • 전산구조공학
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    • 제9권1호
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    • pp.101-113
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    • 1996
  • 준-정적 선형 2차원 열점탄성 문제들의 유한요소해석을 위하여 가상일의 원리를 근거로 하여 새로운 변분공식과 유한요소방정식을 유도한다. 이때 점탄성 재료는 열유동학적으로 단순한 물성을 갖는다. T=T(x)일 경우에 유전적 강성행렬들의 효율적이고 단순화된 계산과정을 소개한다. 몇몇 예제를 해석하고 기존의 발표된 수치결과들과 비교 검토하여 정확성 및 경제성을 입증한다.

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유한요소법에 의한 열점탄성 응력해석 (Thermoviscoelastic Stress Analysis by the Finite Element Method)

  • 심우진;박인규
    • 대한기계학회논문집A
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    • 제20권7호
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    • pp.2148-2158
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    • 1996
  • Uncoupled, quasi-static and linear thermoviscoelastic problems are analyzed in time domain by the finite element approximation which is developed using the principle of virtual work and viscoelasticity matrices instead of shear and bulk relaxation functions as in usual formulations. The material is assumed to be isotropic, homegeneous and thermorheologically simple, which means that the temperature-time equivalence postulate is effective. The stress-strain laws are expressed by relaxation-type hereditary integrals. In spatial and time discritizations, isoparametric quadratic quadrilateral finite elements and linear time variations are adopted. For explicit derivations, the viscoelastic material is assumed to behave standard linear solid in shear and elastically in dilatation. Two-dimensional examples are solved under general temperature distributions T = T(x, t), and compared with other opproximate solutions to show the versatility of the presented analysis.

경계요소법에 의한 점탄성재료의 과도열응력 해석 (Analysis of Transient Thermal Stresses in Viscoelastic Solids Using Boundary Element Method)

  • 이상순;김태형
    • 전산구조공학
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    • 제8권2호
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    • pp.141-145
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    • 1995
  • 이 논문은, 선형점탄성체가 과도온도상태에 있을때의 거동을 시간영역 경계요소법에 의해 해석하고 있다. 점탄성체에 대해서 '열유동단순'거동을 가정하였다. 경계요소 공식화과정을 설명한 후, 예제문제에 대한 수치해석 결과를 보여주었다.

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반도체 칩의 접착계면에 발생하는 열응력 해석 (Analysis of Thermal Stresses Developed in Bonding Interface of Semiconductor Chip)

  • 이상순
    • 한국전산구조공학회:학술대회논문집
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    • 한국전산구조공학회 1999년도 가을 학술발표회 논문집
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    • pp.437-443
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    • 1999
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to uniform temperature change. The viscoelastic film has been assumed to be thermorheologically simple. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The order of the free-edge singularity has been obtained numerically for a given viscoelastic model. It is shown that the free-edge stress intensity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

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Estimation of Thermal Stresses Induced in Polymeric Thin Film Using Boundary Element Methods

  • Lee, Sang-Soon
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2002년도 추계학술대회 발표 논문집
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    • pp.27-33
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    • 2002
  • The residual thermal stresses at the interface corner between the elastic substrate and the viscoelastic thin film due to cooling from cure temperature down to room temperature have been studied. The polymeric thin film was assumed to be thermorheologically simple. The boundary element method was employed to investigate the nature of stresses on the whole interface. Numerical results show that very large stress gradients are present at the interface comer and such stress singularity might lead to edge cracks or delamination.

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Boundary element analysis of singular thermal stresses in a unidirectional laminate

  • Lee, Sang Soon;Kim, Beom Shig
    • Structural Engineering and Mechanics
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    • 제5권6호
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    • pp.705-713
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    • 1997
  • The residual thermal stresses at the interface corner between the elastic fiber and the viscoelastic matrix of a two-dimensional unidirectional laminate due to cooling from cure temperature down to room temperature were studied. The matrix material was assumed to be thermorheologically simple. The time-domain boundary element method was employed to investigate the nature of stresses on the interface. Numerical results show that very large stress gradients are present at the interface corner and this stress singularity might lead to local yielding or fiber-matrix debonding.

온도변화에 대한 고분자 코팅 층에 발생하는 응력 해석 (Analysis of Stresses Induced in a Polymer Coating Layer due to Temperature Change)

  • 박명규;이상순;서창민
    • 한국해양공학회지
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    • 제17권6호
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    • pp.72-76
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    • 2003
  • This paper deals with the stress singularity developed in a polymer layer that is coated to a concrete surface, due to temperature change. The boundary element method is employed to investigate the behavior of interface stresses. The polymeric layer is assumed to be a linear viscoelastic material, and is thermorheologically simple. The order of the singularity is obtained, numerically, for a given viscoelastic model. Numerical results exhibit the relaxation of interface stresses, and large gradients are observed in the vicinity of the free surface. Results show that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model.

칩과 리드페임의 접착과정에서 발생하는 잔류 응력 해석 (Analysis of Residual Stresses Induced during Adhesion Process of Chip and Leadframe)

  • 이상순
    • 한국전산구조공학회논문집
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    • 제13권1호
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    • pp.97-103
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    • 2000
  • 이 논문에서는, 반도체 칩과 리드프레임을 결합하는 과정에서 점탄성 접착제층에 발생하는 잔류응력 문제를 다루고 있다. 접착제층은 “열유동단순”거동을 한다고 가정하였다. 접착제층에서의 응력들은 경계요소법을 사용하여 조사하였다. 매우 큰 응력 구배가 계면 모서리에서 발생하는데, 그러한 응력들은 국부 항복을 일으키거나, 칩과 리드프레임의 박리를 야기시킬 수 있음을 보여주고 있다.

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Analysis of Hygrothermal Stresses in a Viscoelastic Thin Film

  • Lee, Sang-Sun
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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    • pp.146-153
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    • 2003
  • This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to the combined influence of temperature change and moisture absorption. A boundary element analysis is employed to investigate the behavior of interface stresses. The film is assumed to be thermorheologically simple. It is further assumed that moisture effects are analogous to thermal effects. Numerical results are presented for a given viscoelastic model, indicating the singular residual stresses induced during cooling down from the curing temperature, and how they can be altered by subsequent moisture absorption at room temperature.

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Mesoscale modeling of the temperature-dependent viscoelastic behavior of a Bitumen-Bound Gravels

  • Sow, Libasse;Bernard, Fabrice;Kamali-Bernard, Siham;Kebe, Cheikh Mouhamed Fadel
    • Coupled systems mechanics
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    • 제7권5호
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    • pp.509-524
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    • 2018
  • A hierarchical multi-scale modeling strategy devoted to the study of a Bitumen-Bound Gravel (BBG) is presented in this paper. More precisely, the paper investigates the temperature-dependent linear viscoelastic of the material when submitted to low deformations levels and moderate number of cycles. In such a hierarchical approach, 3D digital Representative Elementary Volumes are built and the outcomes at a scale (here, the sub-mesoscale) are used as input data at the next higher scale (here, the mesoscale). The viscoelastic behavior of the bituminous phases at each scale is taken into account by means of a generalized Maxwell model: the bulk part of the behavior is separated from the deviatoric one and bulk and shear moduli are expanded into Prony series. Furthermore, the viscoelastic phases are considered to be thermorheologically simple: time and temperature are not independent. This behavior is reproduced by the Williams-Landel-Ferry law. By means of the FE simulations of stress relaxation tests, the parameters of the various features of this temperature-dependent viscoelastic behavior are identified.