• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.3
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• pp.307-313
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• 2010

In this study, alternative designs for the bends used in district heating pipes are investigated. The district heating pipes, which are subjected to temperatures of 10 to $120^{\circ}C$ and a water pressure of $16\;kgf/cm^2$, have to withstand thermomechanical cyclic loads when in use. These pipes comprise three concentric tubes: a steel pipe (internal), polyurethane (PUR) insulator (middle), and a high-density polyethylene (HDPE) case (external). In addition, the bends in the district heating pipe system are covered with foam pads that cause aging. In this study, an alternative bend design that does not involve the use of a foam pad is proposed to overcome the aging problem in the bends. In the proposed design, "shear rings" are added to the surface of a bend, and its dimensions are determined by a combination of the statistical (Taguchi) method and FEM. The geometrical parameters such as thickness, height, and number of the rings significantly affect the design optimization, and hence, they affect the results of the FEM.

• Polymer(Korea)
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• v.32 no.3
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• pp.256-262
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• 2008

Copolyimides containing pendant trifluoromethyl ($CF_3$) groups were synthesized from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and bis[4-(3-aminophenoxy)phenyl]sulfone (BAPS) with various concentrations of 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane(BAPP) to poly(amic acid)(PAA), followed by thermal imidization. These copolyimides were readily soluble in N,N'-dimethylacetamide (DMAc) and could be solution-cast into a flexible and tough film. The thermomechanical properties, morphology and an optical transparency of the copolyimide films were determined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), wide angle X-ray diffraction (XRD), scanning electron microscopy (SEM), universal tensile machine (UTM), and a UV-Vis spectrometer. The cast copolyimide films exhibited high optical transparency with a cut-off wavelength (${\lambda}_0$) of $275{\sim}319\;nm$ in UV-vis absorption and a low yellow index(YI) value of $3.65{\sim}10.37$. The thermo-mechanical properties of copolyimide films were enhanced linearly with increasing a BAPP content. In contrast, the optical transparency of the copolyimide films was found to get worse with increasing a BAPP content.

• Journal of the Korean Geotechnical Society
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• v.39 no.5
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• pp.51-63
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• 2023

Numerical analysis was conducted to determine the effect of soil behavior by thawing and freezing of seasonal frozen soil on pile foundations. The analysis was performed using the finite element method (FEM) to simulate soil-pile interaction based on the atmosphere temperature change. Thermomechanical coupled modeling using FEM was applied with the temperature-dependent nonlinear properties of the frozen soil. The analysis model cases were applied to the MCR and HDP models to simulate the elastoplastic behavior of soil. The numerical analysis results were analyzed and compared with various conditions having different length and width sizes of the pile. The results of the numerical analysis showed t hat t he HDP model was relat ively passive, and t he aspect and magnit ude of t he bearing capacit y and displacement of the pile head were similar depending on the length and width of the pile conditions. The vertical displacement of the pile head by thawing and freezing of the ground showed a large variation in displacement for shorter length conditions. In the MCR model, the vertical displacement appeared in the maximum thaw settlement and frost heaving of 0.0387 and 0.0277 m, respectively. In the HDP model, the vertical displacement appeared in the maximum thaw settlement and frost heaving of 0.0367 and 0.0264 m, respectively. The results of the pile bearing capacity for the two elastoplastic models showed a larger difference in the width condition than the length condition of the pile, with a maximum of about 14.7% for the width L condition, a maximum of about 5.4% for M condition, and a maximum of about 5.3% for S condition. The significance of the effect on the displacement of the pile head and the bearing capacity depended on the pile-soil contact area, and the difference depended on the presence or absence of an active layer in the soil and its thickness.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.