• Proceedings of the KSME Conference
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• 2001.06a
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• pp.90-95
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• 2001

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) are characterized by high sensitive $moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed at several various bending loads and temperature steps. At the temperature higher that $100^{\circ}C$, the inelastic deformation in solder balls became more dominant. As a result the bending of the molding compound decreased while temperature increased. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder. The results also show that $moir{\acute{e}}$ interferometry is a powerful and effective tool in experimental studies of electronic packaging.

• Elastomers and Composites
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• v.42 no.4
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• pp.217-223
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• 2007

Thermomechanical and shape memory properties of dicumyl peroxide(DCP) cured semicrystalline EPDM($Nordel^{(R)}$ IP) were investigated. From gel content analysis, it can be seen that Nordel can be crosslinked by small amount of DCP and the degree of crosslinking increased with the increase of DCP content. DSC analysis revealed that the melting temperature and degree of crystallinity of the crosslinked rubber decreased with the increase of DCP. Tensile test showed that tensile modulus increased and elongation at break of the rubber decreased with an increase in the degree of cross linking. The chemically crosslinked semi-crystalline EPDM exhibited excellent shape memory behavior, i.e. the sample was easily deformed to have an arbitrary secondary shape above its melting temperature and was fixed well in its deformed state when it is cooled, and then the fixed shape was recovered to its original shape very fast upon heating above its melting temperature.

• Journal of the Korean Geotechnical Society
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• v.40 no.1
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• pp.55-63
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• 2024

In this study, a thermomechanical numerical model was developed to evaluate the stability of energy slabs. First, a wall-type energy slab was installed in a residential underground parking lot, and thermal performance tests were conducted. Based on the tests, a numerical thermohydraulics model of the energy slab was developed to accurately simulate the thermal behavior in thermal performance tests. Finally, utilizing the temperature data acquired using the developed model, a thermomechanical numerical model of the energy slab was established. The thermomechanical model was then used to simulate the thermal stresses induced by operating the energy slab. The results demonstrated a maximum thermal stress of 5,300 kPa, which highlights the need to utilize cement mortar with sufficient tensile strength to realize stable operation of the energy slab.

• Advances in aircraft and spacecraft science
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• v.10 no.1
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• pp.83-106
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• 2023

In this work, the static behavior of FGM macro and nano-plates under thermomechanical loading. Equilibrium equations are determined by using virtual work principle and local and non-local theory. The novelty of the current model is using a new displacement field with four variables and a warping function considering the effect of shear. Through this analysis, the considered sandwich FGM macro and nanoplates are a homogeneous core and P-FGM faces, homogeneous faces and an E-FGM core and finally P-FGM faces and an E-FGM core. The analytical solution is obtained by using Navier method. The model is verified with previous published works by other models and very close results are obtained within maximum 1% deviation. The numerical results are performed to present the influence of the various parameters such as, geometric ratios, material index as well as the scale parameters are investigated. The present model can be applicable for sandwich FG plates used in nuclear, aero-space, marine, civil and mechanical applications.

• Tribology and Lubricants
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• v.18 no.3
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• pp.219-227
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• 2002

A linear elastic fracture mechanics analysis of double subsurface cracks propagation in a half-space subjected to moving thermomechanical surface traction was performed using the finite element method. The effect of frictional heat at the sliding surface on the crack growth behavior is analyzed in terms of the thermal load and peclet number. The crack propagation direction is predicted in light of the magnitudes of the maximum shear and tensile stress intensity factor ranges. When moving thermomechanical surface traction exists, subsurface horizontal cracks are propagation in-plane crack growth rate at the beginning but they are propagation out-of-plane crack growth rate by the frictional heat which is occurrence by the repeated sliding contact.

• Structural Engineering and Mechanics
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• v.56 no.1
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• pp.85-106
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• 2015

Postbuckling of thick plates made of functionally graded material (FGM) subjected to in-plane compressive, thermal and thermomechanical loads is investigated in this work. It is assumed that the plate is in contact with a Pasternak-type elastic foundation during deformation. Thermomechanical non-homogeneous properties are considered to be temperature independent, and graded smoothly by the distribution of power law across the thickness in the thickness in terms of the volume fractions of constituents. By employing the higher order shear deformation plate theory together the non-linear von-Karman strain-displacement relations, the equilibrium and compatibility equations of imperfect FGM plates are derived. The Galerkin technique is used to determine the buckling loads and postbuckling equilibrium paths for simply supported plates. Numerical examples are presented to show the influences of power law index, foundation stiffness and imperfection on the buckling and postbuckling loading capacity of the plates.

• Journal of the Korean Ceramic Society
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• v.32 no.9
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• pp.977-988
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• 1995

Several oxide (ZrO2, Al2TiO5, reactive Al2O3) and nonoxide (SiC, Si3N4, "ALON" (5AlN.9Al2O3)) additives were used as a microfiller for alumina based LCC (Low-Cement-Castable). High temperature prooperties (HMOR, softening under load) and the phase changes of developed LCC on various sintering temperatures were examined. In addition, thermal shock test and corrosion test were accomplished. Based on these data the effects of each microfiller on the properties of LCC were established comparing to those of the commercial LCC with amorphous silica as a microfiller. The castables, containing reactive alumina, ZrO2 and "ALON" (5AlN.9Al2O3) as a first portion, exhibited considerably higher HMOR-values over 100$0^{\circ}C$, better creep behavior, and thermal shock resistance than those of castables with amorphous silica. The LCC with 5% Al2TiO5 showed no corrosion against molten aluminum.nst molten aluminum.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2000.11a
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• pp.50-58
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• 2000

A linear elastic fracture mechanics analysis of multiful subsurface cracks propagation in a half-space subjected to moving thermomechanical surface traction was peformed using the finite element method. The effect of frictional heat at the sliding surface on the crack growth behavior is analyzed in terms of the thermal load and peclet number. The crack propagation direction is predicted in light of the magnitudes of the maximum shear and tensile stress intensity factor ranges. When moving thermomechanical surface traction exists, subsurface horizontal cracks are propagation in-plane crack growth rate at the beginning but they are propagation out-of-plane crack growth rate by the frictional heat which is occurrence by the repeated sliding contact.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1436-1441
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• 2006

Each type of optical sheets in a LCD module experiences a characteristic behavior for thermal loading and unloading. During thermal cycling, a polymeric behavior is reversible and recyclable, depending on a material stiffness critically affected by temperature and time. Some critical issues on temperature- and time-dependent themomechanical deformation of the polymeric sheet are addressed by finite-element thermal results, followed by structural simulation results in this study.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1407-1412
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• 2003

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temparature change is investigated using high-sensitivity $Moir{\acute{e}}$ interferometry. Using the real-time $Moir{\acute{e}}$ setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compond and the PCB.