• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 반도체재료
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• pp.50-53
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• 2001

The thermoelectric refrigeration technologies have no moving parts. compressor, or piping required. In this study, the basic capacity of thermoelectric devices and development on some thermoelectric refrigerator were reviewed and basic technical concepts related with many kinds of thermoelectric materials were discussed. Especially the result of performance test on thermoelectric refrigerator whose minimum temperature of $-2^{\circ}C$ was introduced briefly.

• 한국가시화정보학회지
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• 제19권1호
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• pp.94-99
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• 2021

In order to increase the efficiency of thermoelectric refrigerators using the Peltier effect, it is necessary to optimize the distribution of the flow of cold air from the fan. In this study, the flow flowing upwards and downwards while changing the area of the flow path was visualized using the PIV technique for the control of cold air in a thermoelectric refrigerator. From these results, the flow rate according to the change in the area of the flow path was confirmed, and design criteria for optimizing the distribution of cold air flowing to the top and bottom of the refrigerator were suggested.

• 대한기계학회논문집B
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• 제41권3호
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• pp.199-204
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• 2017

열전소자를 이용하여 고온의 표면을 능동적으로 냉각하여 적외선 방사량을 줄이는 기술을 소개한다. 공력가열이나 자체 발열 등에 의한 고온 표면 환경을 구현하였고, 여기에 열전소자를 설치하여 냉각하였을 때의 표면 온도와 적외선 방사량을 상용 수치해석 소프트웨어를 사용하여 계산하였다. 이를 통해 특정 환경에서 열전냉각소자를 이용하여 고온 표면에 있어 외부 환경과 비교했을 때의 적외선 방사량 대비를 이론적으로 완전히 제거할 수 있음을 확인하였다.

• 한국지열·수열에너지학회논문집
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• 제14권3호
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• pp.29-34
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• 2018

To present the design direction of the thermoelectric module (TEM) refrigerator, analysis of the effect of the design parameters on the energy efficiency and performance of the refrigerator is performed. The design parameters considered are the cooling capacity of the TEM and the heat transfer performance of the heating and cooling surface of the TEM. The heat transfer performance is the most effective design parameter for improving cooling power. The smaller ΔT and cooling capacity of the TEM make the higher efficiency of the refrigerator.

• E2M - 전기 전자와 첨단 소재
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• 제9권1호
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• pp.67-75
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• 1996

This paper has presented the characteristics of thermoelectric devices and the plots of thermoelectric cooling and heating as a function of currents for different temperatures. The maximum cooling and heating(.DELTA.T) for (BiSb)$\_$2/Te$\_$3/ and Bi$\_$2/(TeSe)$\_$3/ as a function of currents is about 75.deg. C, A solderable ceramic insulated thermoelectric module. Each module contains 31 thermoelectric devices. Thermoelectric material is a quaternary alloy of bismuth, tellurium, selenium, and antimony with small amounts of suitable dopants, carefully processed to produce an oriented polycrystalline ingot with superior anisotropic thermoelectric properties. Metallized ceramic plates afford maximum electrical insulation and thermal conduction. Operating temperature range is from -156.deg. C to +104.deg. C. The amount of Peltier cooling is directly proportional to the current through the sample, and the temperature gradient at the thermoelectric materials junctions will depend on the system geometry.

• 한국수소및신에너지학회논문집
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• 제15권4호
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• pp.341-347
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• 2004

An experimental study has been carried out on cooling perfonnance of a thennoelectric module. This problem is of particular interest in the design of the refrigeration systems using thermoelectric module, such as cosmetic refrigerator, wine cellar and air cooler. The effect of the input voltage and the hot side temperature on the cooling performance is studied in detail. The $\Delta$T, temperature difference between cold side and hot side surface of thermoelectric module, is described in terms of the input voltage and the hot side temperature. It is found that the cooling capacity can be improved by increasing the input voltage and by reducing the heat from the hot side of the thermoelectric module. However, COP is decreased with an increase in the input voltage, since power consumption is also increased. Thus, optimum input voltage can be selected based on cooling capacity and COP.

• 정보저장시스템학회논문집
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• 제10권2호
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• pp.32-38
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• 2014

Heat emission from the laser diode used in the optical disc drive and the defects from the increased temperature at the system have attracted attentions from the field of the information storage device. Thermoelectric refrigerator is one of the fine solutions to solve these thermal problems. The refrigeration performance of thermoelectric device is dependent on the thermoelectric material's figure-of-merit. Meanwhile, high electrical contact resistivity between metal electrode and p- and n-type thermoelectric materials in the device would lead increased total electrical resistance resulting in the degeneracy in performance. This paper represents the manufacturing process of the PbTe-based material which has one of the highest figure-of-merit at medium-high-temperature, ~ 600K to 900 K, and the nickel contact layer for reduced electrical contact resistance at once, and the results showing the decent contact structure and figure-of-merit even after the long-term operation environment.

• International Journal of Air-Conditioning and Refrigeration
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• 제14권3호
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• pp.94-101
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• 2006

A theoretical investigation to find thermodynamically optimum design conditions of conduction-cooled Peltier current leads is performed. A Peltier current lead (PCL) is composed of a thermoelectric element (TE), a metallic lead and a high temperature superconductor (HTS) lead in the order of decreasing temperature. Mathematical expressions for the minimum heat flow per unit current crossing the TE-metal interface and the minimum heat flow per unit current from the metal lead to the joint of the metal and the HTS leads are obtained. It is shown that the temperature at the TE -metal interface possesses a unique optimal value that minimizes the heat flow to the joint and that this optimal value depends on the material properties of the TE and the metallic lead but not the joint temperature nor electric current. It is also shown that there exists a unique optimal value for the joint temperature between the metal and the HTS leads that minimizes the sum of the power dissipated by ohmic heating in the current leads and the refrigerator power consumed to cool the lead, for a given length of the HTS.

• 설비공학논문집
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• 제17권8호
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• pp.764-771
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• 2005

A theoretical investigation for optimization of conduction-cooled Peltier current leads is undertaken. A Pottier current lead (PCL) is composed of a thermoelectric element (TE), a metallic lead and a high Tc superconductor (HTS) lead in the order of decreasing thermoelectric tempera ture. Mathematical expression for the minimum heat flow per unit current crossing the TE metal interface and that flowing from the metal lead to the joint of the metal and the HTS leads are obtained. It is shown that the temperature at the TE-metal interface possesses a unique optimal value that minimizes the heat flow to the joint and that this optimal value depends on the material properties of the 73 and the metallic lead but not the joint temperature nor electric current. It is also shown that there exists a unique optimal value for the joint temperature between the metal and the HTS leads that minimizes the sum of the power dissipated by ohmic heating in current leads and the refrigerator power consumed to cool the lead, for a given length of the HTS.

• 대한기계학회논문집B
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• 제23권7호
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• pp.928-936
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• 1999

The electronic refrigerating kimchi jar operates with a low noise because it contains no compressor but it consumes more energy than that of an refrigerator with compressor. In this paper, the heat flow characteristics and cooling performance of an electronic refrigerating kimchi jar are studied by means of experiments. When the storage temperature is kept in a range of $-5.7^{\circ}C$ to $4.1^{\circ}C$. in the case of three ambient temperatures; $12.7^{\circ}C$, $22.3^{\circ}C$ and $32.2^{\circ}C$, the cooling performance of $20{\ell}$ kimchi jar is investigated. The experiments show that the temperature difference that exists between kimchi jar and its ambient provides a measure of the coefficient of performance of kimchi jar. It is also found that ratio of net pumping heat to the heat pumping rate of thermoelectric module is independent of the temperature difference.