• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1997.10a
• /
• pp.973-976
• /
• 1997

Process behavior in metal cutting results from the chip formation process which is not easily observable and measurable during machining. By means of the finite element method chip formation in orthogonal metal cutting is modeled. The reciprocal interaction between mechanical and thermal loads is taken into consideration by involving the thermo-viscoplastic flow behavior of workpiece material. Local and temporal distributions of stress and temperature in the cutting zone are calculated depending on the cutting parameters. The calculated cutting forces and temperatures are compared with the experimental results obtarned from orthogonal cutting of steel AISl 4140. The model can be applied in process design for selection of appropriate tool-workpiece combination and optimum cutting conditions in term of mechanical and thermal loads.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.2
• /
• pp.21-28
• /
• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.16 no.10
• /
• pp.1877-1889
• /
• 1992

Upsetting is performed in open-die press forging to deform metal in all directions in order to enhance soundness of a product and reduce directionality of properties caused by casting. It is necessary to ensure sufficient forging ratio for subsequent cogging operations and consolidate the void along the centerline. To obtain these benefits, the upper die shape (dome and dished shape) is considered as an upsetting parameter. Thermo-viscoplastic finite element analysis has been carried out so as to understand the influence of upper die shape on the effective strain, hydrostatic stress and temperature in the upset-forged ingots without internal defects. The analysis is focused on the investigation into internal void closure in ingots with pipe holes and circular voids. The computational results have shown that the volume fraction of the void is independent of the circular void size and the closure of internal voids is much more influenced by the effective strain than the hydrostatic stress around the void. It is finally suggested that the height reduction must be over 35% for consolidation of internal voids.

• Journal of the Korean Society for Precision Engineering
• /
• v.19 no.8
• /
• pp.126-133
• /
• 2002

The cutting thickness of ultra-precision machining is generally very small, only a few micrometer or even down to the order of a few nanometer. In such case, a basic understanding of the mechanism on the micro-machining process is is necessary to produce a high quality surface. When machining at very small depths of cut, metal flow near a rounded tool edge become important. In this paper a finite element analysis is presented to calculate the stagnation point on the tool edge or critical depth of cut below which no cutting occurs. From the simulation, the effects of the cutting speed on the critical depths of cut were calculated and discussed. Also the transition of the stagnation point according to the increase of the depths of cut was observed.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.17 no.12
• /
• pp.2970-2981
• /
• 1993

In hot closed-die forging the load increases rapidly near the final stage. Preforming operation is important to both the sound final forging and die-service life. In this study, the material flows during preforming and final forging are investigated. The physical modeling with Plasticine as a model material showed clear flow patterns. The forging process were numerically simulated by the finite element method with the isothermal and the non-isothermal models. The flow patten of the isothermal simulation showed good agreements with the experiments. Temperature changes and pressure distributions on the die surfaces during one cycle of the forging process were obtained from the non-isothermal simulation. High pressure and temperature were developed at certain areas of the die surfaces. It was concluded that those areas usually coincide with each other and should be distributed by the preforming operations to enhance the die life.

• Journal of the Korean Society of Safety
• /
• v.19 no.4 s.68
• /
• pp.135-140
• /
• 2004

Wear mechanisms may be briefly classified by mechanical, chemical and thermal wear. A plane strain finite element method is used with a new material stress and temperature fields to simulate orthogonal machining with continuous chip formation. Deformation of the workpiece material is healed as elastic-viscoplastic with isotropic strain hardening and the numerical solution accounts for coupling between plastic deformation and the temperature field, including treatment of temperature-dependent material properties. Effect of the uncertainty in the constitutive model on the distributions of strait stress and temperature around the shear zone are presented, and the model is validated by comparing average values of the predicted stress, strain, and temperature at the shear zone with experimental results.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.24 no.11
• /
• pp.2836-2844
• /
• 2000

Thickness control of hot-rolled strips has become an important issue in recent years because of the need for improving the quality of the hot-rolled strip. In this study, a modifying method of rolling force set-up with consideration of spread was developed to improve the thickness uniformity at the finishing rolling units in hot rolling. Through the analysis of real production data it was found that the accuracy of the rolling force determined from the finishing mill set-up (FSU) model dominantly governed the thickness uniformity in rolled plates at the front. Based on this analysis , several examples were selected to calculate the spread of rolled plate using three dimensional rigid thermo-viscoplastic finite element program. FE analysis results were used to train the neural network system that can predict the spread hot-rolled plate and the rolling force was modified based on the predicted value of spread. The modified rolling forces were closer to the measured rolling force so it can be expected that the accuracy of thickness uniformity of hot-rolled plate will be improved.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 1995.10a
• /
• pp.16-29
• /
• 1995

A full three-dimensional thermo-coupled rigid-viscoplastic finite element method and the currently developed microstructural evolution system which includes semi-empirical mathematical equations suggested by different research groups were used together to form an integrated system of process and microstructure simulation of hot rolling. The distribution and time history of thermomechanical variables such as temperature, strain, strain rate, and time during pass and between passes were obtained FEM analysis of multipass hot rolling processes. Then distribution of metallurgical variables were calculated successfully on the basis of instantaneous thermomechanical data. For the verification of this method the evolution of microstructure in plate rolling and shape rolling was simulated and their results were compared with the data available in literature. Consequently, this approach makes it passible to describe the realistic evolution of microstructure by avoiding the use of erroneous average value and can be used in CAE of multipass hot rolling.

• Journal of Advanced Marine Engineering and Technology
• /
• v.29 no.8
• /
• pp.938-945
• /
• 2005

The microstructure evolution in hot forging process is composed of dynamic recrystallization during deformation as well as grain growth during dwell time. Therefore, the control of forging parameters such as strain, strain rate. temperature and holding time is important because the microstructure change in hot working affects the mechanical properties. Modeling equations are developed to represent the flow curve. grain size. recrystallized volume fraction and grain growth phenomena by various tests. The developed modeling equations were combined with thermo-viscoplastic finite element modeling to predict the microstructure change evolution during hot forging process. The large exhaust valve spindle (head diameter of 512mm) was simulated by closed die forging with hydraulic press and cooled in air after forging. The preform was heated to each 1080 and 1150$^{\circ}C$. Numerical calculation was performed by DEFORM-2D. a commercial finite element code. Heat transfer can be coupled with the deformation analysis in a non-isothermal deformation analysis. In order to obtain the fine and homogeneous microstructure and good mechanical properties in forging. the FEM would become a useful tool in the simulation of the microstructure development. In forging, appropriate temperature, strain and strain rate and rapid cooling are required to obtain the fine grain microstructure The optimal forging temperature and effective strain range of Nimonic 80A for large exhaust valve spindle are about 1080$\∼$l120$^{\circ}C$ and 150$\∼$200$\%$.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.2
• /
• pp.17-28
• /
• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.