• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of Welding and Joining
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• v.34 no.1
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• pp.41-46
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• 2016

With the recent increase in size of ships and offshore structures, there are more demand for thicker plates. As the thickness increases, it is known that fatigue life of the structures decrease. To improve the fatigue life, post weld treatments techniques, such as toe grinding, TIG dressing and hammer peening, are typically employed. However, these techniques require additional construction time and production cost. Therefore, it is of crucial interest steels with longer fatigue crack growth life compared to conventional steels. This study investigates fatigue crack growth rate (FCGR) behaviours of conventional EH36 steel and Ferrite-Bainite dual phase EH36 steel (F-B steel). F-B steel is known to have improved fatigue performance associated with the existence of two different phases. Ferrite-Bainite dual phase microstructures are obtained by special thermo mechanical control process (TMCP). FCGR behaviours are investigated by a series of constant stress-controlled FCGR tests. Considering all test conditions (ambient, low temperature, high stress ratio), it is shown that FCGR of F-B steel is slower than that of conventional EH36 steel. From the tensile tests and impact tests, F-B steel exhibits higher values of strength and impact energy leading to slower FCGR.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.04a
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• pp.193-197
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• 2003

As one of the core technologies in the field of the optical communication with WDM, the optical cross connector with movements of micro mirrors is getting important day by day. The packaging structure of 2-dimensional NxN MOEMS switch should be determined by the harmonization of the following items such as the geometrical compatability between optical and structural components, the characteristics of optical input and output parts with device, and the electrical performance for the operation of micro mirrors. Therefore, the packaging process could be defined as the integrated technology completed by the optical and electrical science and the material science for the understanding of its thermo-mechanical properties with packaging materials. In the present study, the harmonization between the optical and structural components as well as the optical characteristics of lens system used will be investigated.

• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2465-2470
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• 2008

A new surface shape of an internal cooling passage which largely reduces the pressure drop and enhances the surface heat transfer is proposed in the present study. The surface shape of the cooling passage is consisted of the concave dimple and the riblet inside the dimple which is protruded along the stream-wise direction. Direct Numerical Simulation (DNS) for the fully developed turbulent flow and thermal fields in the cooling passage is conducted. The Numerical simulations for the 5 different surface shapes are conducted at the Reynolds number of 2800 based on the mean bulk velocity and channel height and Prandtl number of 0.71. The driving pressure gradient is adjusted to keep a constant mass flow rate in the x direction. The thermo-aerodynamic performance for the 5 different cases used in the present study was assessed in terms of the drag, Nusselt number, Fanning friction factor, Volume and Area goodness factor in the cooling passage. The value of maximum ratio of drag reduction is -22.86 [%], and the value of maximum ratio of Nusselt number augmentation is 7.05 [%] when the riblet angle is $60^{\circ}$ (Case5). The remarkable point is that the ratio of Nusselt number augmentation has the positive value for the surface shapes which have over $45^{\circ}$ of the riblet angle. The maximum Volume and Area goodness factor are obtained when the riblet angle is $60^{\circ}$ (Case5).

• Composites Research
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• v.22 no.2
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• pp.37-42
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• 2009

This paper presents an experimental approach to design a bending-type actuator by using a shape memory alloy wire (SMA), composite strip, and spring. The SMA wire is attached to two edges of the bent strip to apply pre-stress to the SMA wire. The spring is used to provide recovery force right after actuation of the SMA wire. To investigate thermo-mechanical characteristics of the SMA wire, a series of DSC tests have been conducted and tensile tests under various levels of pre-stress and input power have been performed. Based on the measured properties of the SMA wire, bending-type actuators are designed and tested for different combination of strip, number of springs, and input power. It has been found that a bending-type actuator with a proper combination shows fast actuation performance and low power consumption.

• Nuclear Engineering and Technology
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• v.55 no.11
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• pp.4066-4076
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• 2023

Pressure resistance welding is usually used to seal the connection between the cladding tube and the end plug made of zirconium alloy. The seal welded joint has a direct effect on the service performance of the fuel rod cladding structure. In this paper, the pressure resistance welded joints of zirconium alloy tube-plug structure were obtained by thermal-mechanical simulation experiments. The microstructure and microhardness of the joints were both analyzed. The effect of processing parameters on the microstructure was studied in detail. The results showed that there was no β-Zr phase observed in the joint, and no obvious element segregation. There were different types of Widmanstätten structure in the thermo-mechanically affected zone (TMAZ) and heat affected zone (HAZ) of the cladding tube and the end plug joint because of the low cooling rate. Some part of the grains in the joint grew up due to overheating. Its size was about 2.8 times that of the base metal grains. Due to the high dislocation density and texture evolution, the microhardnesses of TMAZ and HAZ were both significantly higher than that of the base metal, and the microhardness of the TMAZ was the highest. With the increasing of welding temperature, the proportion of recrystallization in TMAZ decreased, which was caused by the increasing of strain rate and dislocation annihilation.

• Plant Journal
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• v.12 no.1
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• pp.29-36
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• 2016

It is becoming increasingly important to make use of alternative energy source. because It is not able to rely on only fossil fuel for the recent increasing demand of energy consumption. With this situation, lots of studies for utilizing low grade energy such as industrial waste heat, solar energy, and geothermal energy have been conducted. The aim of this study is to predict the operation characteristics of working fluid by using performance analysis program (ThermoFlex) through the system analysis which is not mixing district return water but using ORC(Organic Rankine Cycle, hereinafter ORC) as a downstream cycle when accumulating district heating (hereinafter DH). In this study, We conducted the performance analysis for the case which has the district heating water temperature($120^{\circ}C$) and Flow rate of $163m^3/h$ (including District Heating return water flow), and examined several working fluid which is proper to this temperature. The case using R245fa (which is the best-case) showed 269.2kW power output, 6.37% efficiency. Additionally, Cut down on fuel was expected because of the boiler inlet temperature increase by being Formed $57.3{\sim}85^{\circ}C$ in a temperature of district heating return water, depending on a pressure change of a condenser in ORC system.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.5
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• pp.27-34
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• 2018

Recently, liquid desiccant systems have received attention for the dehumidification of air. LiCl and LiBr are widely used in liquid desiccant systems due to their excellent thermo-physical properties. In this study, dehumidification tests were conducted with Celdek elements using LiCl and LiBr. During the tests, the dry and wet-bulb air temperatures were maintained at $35^{\circ}C$ and $28^{\circ}C$, respectively. The solution temperature was $20^{\circ}C$, the solution concentration was 50%, the solution circulation rate was 50 kg/h, and the frontal air velocity was varied from 2.0 to 4.0 m/s. The results show that the amount of dehumidification increased as the frontal velocity increased. On average, LiCl showed 27% higher dehumidification performance than LiBr, which was probably due to the lower saturation of the absolute humidity of LiCl compared with that of LiBr. On the other hand, LiBr yielded 12% larger pressure drop than LiCl. In general, the Sherwood numbers of LiCl and LiBr were approximately the same, showing that the effect of the desiccant on the Sherwood number was insignificant. Existing correlations highly overpredicted the present Sherwood numbers.