• 제목/요약/키워드: Thermo-mechanical fatigue

검색결과 62건 처리시간 0.026초

후방복사 초음파를 이용한 TMCP강의 부식피로 손상평가 (Assessment of Degradation by Corrosion Fatigue of TMCP Steel using a Backward Radiated Ultrasound)

  • 김영환;배동호;박진형;유형주;권성덕;송성진
    • 비파괴검사학회지
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    • 제23권4호
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    • pp.349-355
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    • 2003
  • 후방복사 레일리 표면파를 사용하여 부식피로에 의한 재료손상을 평가하였다. $25^{\circ}C$, 3.5 wt.% NaCl 수용액에서 TMCP 강재에 대하여 하중의 크기를 변화시키면서 부식피로 시험을 수행하였다. 각각의 시험편에 대해서 입사각에 따른 후방복사 초음파의 진폭변화를 측정하였다. 후방복사 프로파일이 최대가 되는 입사각으로부터 레일리 표면 탄성파의 속도를 결정하였는데, 부식피로 시험에서 파손수명이 길었던 시험편에서의 표면탄성파의 속도가 더 느렸다. 이 사실은 시험편 표면에 발생한 부식손상이 주로 부식환경에 놓인 시간에 의존함을 의미한다 본 연구에서 얻어진 결과는 후방복사된 레일리 표면 탄성파가 노후 재료의 부식손상을 비파괴적으로 평가하는데 유용한 도구임을 보여주었다.

가속화 시험을 통한 플립칩 패키지의 열적 기계적 특성 평가 (Thermo-mechanical reliability evaluation of flip chip package using a accelerated test)

  • 김대곤;하상수;김종웅;신영의;정승부
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2006년도 춘계 학술대회 개요집
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    • pp.21-23
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    • 2006
  • The microstructural investigation and thermo-mechanical reliability evaluation of the Sn-3.0Ag-0.5Cu solder bumped flip chip package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between the solder and Cu mini bump of chip side was Cu6Sn5 layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and Ni-P layer of the package side. The cracks were occurred at the corner solder joints after the thermal shocks of 400 cycles. The primary failure mechanism of the solder joints in this type of package was confirmed to be thermally activated solder fatigue failure.

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LOW CYCLE THERMAL FATIGUE OF THE ENGINE EXHAUST MANIFOLD

  • Choi, B.L.;Chang, H.;Park, K.H.
    • International Journal of Automotive Technology
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    • 제5권4호
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    • pp.297-302
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    • 2004
  • This paper presents the low cycle thermal fatigue of the engine exhaust manifold subject to thermo-mechanical cyclic loading. As a failure of the exhaust manifold is mainly caused by geometric constraints of the less expanded inlet flange and cylinder head, the analysis is based on the exhaust system model with three-dimensional temperature distribution and temperature dependent material properties. The result show that large compressive plastic deformations are generated at an elevated temperature of the exhaust manifold and tensile stresses are remained in several critical zones at a cold condition. From the repetition of these thermal shock cycles, maximum plastic strain range (0.454%) could be estimated by the stabilized stress-strain hysteresis loops. It is used to predict the low cycle thermal fatigue life of the exhaust manifold for the thermal shock test.

화력발전소 증기터빈용 12Cr 강의 저주기 피로거동 (Low Cycle Fatigue Behavior of 12Cr Steel for Thermal Power Plant Steam Turbine)

  • 강명수
    • 한국정밀공학회지
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    • 제19권8호
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    • pp.71-76
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    • 2002
  • In this study low cycle fatigue (LCF) behavior of 12Cr steel at high temperature are described. Secondly, comparisons between predicted lives and experimental lives are made for the several sample life prediction models. Two minute hold period in either tension or compression reduce the number of cycles to failure by about a factor of two. Twenty minute hold periods in compression lead to shorter lives than 2 minute hold periods in compression. Experiments showed that life predictions from classical phenomenological models have limitations. More LCF experiments should be pursued to gain understanding of the physical damage mechanisms and to allow the development of physically-based models which can enhance the accuracy of the predictions of components. From a design point-of-view, life prediction has been judged acceptable for these particular loading conditions but extrapolations to thermo-mechanical fatigue loading, for example, require more sophisticated models including physical damage mechanisms.

NiTiCu 형상기억합금의 피로특성 (Fatigue Characterization of NiTiCu Shape Memory Alloys)

  • 한지원;박성범
    • 한국안전학회지
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    • 제29권4호
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    • pp.28-33
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    • 2014
  • Recently, the actuator worked by the driving recovery-force of the thermo elastic martensitic transformation of shape memory alloys(SMA) has been studied. This paper presents a study on the fatigue life of shape memory alloy (SMA) actuators undergoing thermally induced martensitic phase transformation under various stress levels. shape memory recoverable stress and strain of Ti-44.5at.%Ni-8at.%Cu alloys were by means of constant temperature tensile tests. Differential scanning calorimetry (DSC) was employed in order to investigate the transformation characteristics of the alloy before the tests. the results were summarized as follows. The martensite inducing stress incerased with the increasing of the Cu-contents. The fatigue life decreased with the increasing of the test load and the Cu-content. The data acquired will be very useful during the design process of an SMA NiTiCu element as a functional part of an actuator.

열 및 기계적 반복하중 하의 내열금속 표면 홀 주변 산화막의 변형 및 응력해석 (Cracking Near a Hole on a Heat- Resistant Alloy Subjected to Thermo-Mechanical Cycling)

  • 이봉훈;강기주
    • 대한기계학회논문집A
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    • 제34권9호
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    • pp.1227-1233
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    • 2010
  • 가스터빈엔진 내의 블레이드에서는 표면에 외부의 찬 공기를 흘려주는 작은 냉각 홀들을 가공하고 열 차단 코팅시스템을 코팅하는 방법으로 기지금속을 고온에서 보호한다. 열 차단 코팅은 열피로 과정에서 산화막의 성장 및 접합층과 산화막의 열팽창계수의 불일치로 산화막내부에 잔류응력이 발생하며 궁극적으로 코팅층의 분리를 유발한다. 본 연구에서는 내열합금 시편 표면에 작은 홀을 가공하여 여러 가지 고온 유지 조건에서 열 및 기계적 피로 시험을 수행하여 홀 주위의 산화막의 변형을 관찰하였다. 실험결과 기계적 피로가 홀 주위의 산화막의 변형에 중요한 영향을 미치며, 동일한 산화막 두께에서 고온 유지 시간이 짧을수록 변형이 쉽게 발생 하였다. 또한 본 연구에서는 홀 주위 산화막의 응력해석을 위한 이론적인 연구도 시도되었다.

Numerical Prediction of Solder Fatigue Life in a High Power IGBT Module Using Ribbon Bonding

  • Suh, Il-Woong;Jung, Hoon-Sun;Lee, Young-Ho;Choa, Sung-Hoon
    • Journal of Power Electronics
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    • 제16권5호
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    • pp.1843-1850
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    • 2016
  • This study focused on predicting the fatigue life of an insulated gate bipolar transistor (IGBT) power module for electric locomotives. The effects of different wiring technologies, including aluminum wires, copper wires, aluminum ribbons, and copper ribbons, on solder fatigue life were investigated to meet the high power requirement of the IGBT module. The module's temperature distribution and solder fatigue behavior were investigated through coupled electro-thermo-mechanical analysis based on the finite element method. The ribbons attained a chip junction temperature that was 30℃ lower than that attained with conventional round wires. The ribbons also exhibited a lower plastic strain in comparison with the wires. However, the difference in plastic strain and junction temperature among the different ribbon materials was relatively small. The ribbons also exhibited different crack propagation behaviors relative to the wires. For the wires, the cracks initiated at the outmost edge of the solder, whereas for the ribbons, the cracks grew in the solder layer beneath the ribbons. Comparison of fatigue failure areas indicated that ribbon bonding technology could substantially enhance the fatigue life of IGBT modules and be a potential candidate for high power modules.

화력 발전소 증기 터빈의 자동기동을 위한 주증기 제어 밸브 수명해석 (Service Life Analysis of Control Valve far Automatic Turbine Startup of Thermal Power Plant)

  • 김효진;강용호
    • 대한기계학회논문집A
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    • 제26권1호
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    • pp.1-6
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    • 2002
  • The automatic turbine startup system provides turbine control based on thermal stress. During the startup, control system monitors and evaluates main components of turbine using damage mechanism and life assessment. In case of valve chest, the temperature of inner/outer wall is measured by thermo-couples and the safety of these values are evaluated by using allowable △T limit currie during the startup. Because allowable ΔT limit curve includes life assessment, it is possible to apply this curve to turbine control system. In this paper, low cycle fatigue damage, combined rupture and low cycle fatigue damage criterion were proposed for yielding the allowable ΔTf limit curve of CV(control valve) chest. To calculate low cycle fatigue damage, the stress analysis of valve chest has been performed using FEM. Automatic turbine startup to assure service life of CV was achieved using allowable ΔT limit curve.

Effects of Temperature Amplitude and Loading Frequency on Alternating Current - Induced Damage in Cu Thin Films

  • Park Yeung-Bae
    • 마이크로전자및패키징학회지
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    • 제12권2호
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    • pp.135-140
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    • 2005
  • Although it was recently observed that severe fatigue damage was formed in Al or Cu interconnects due to the cyclic temperatures generated by Joule heating of the metal lines by the passage of alternating currents (AC), AC loading frequency effect on the damage evolution characteristics are not known so far. This work focused on the effect of AC loading frequency (100 Hz vs. 10 kHz) on the thermo-mechanical fatigue characteristics by using polycrystalline sputtered Cu lines with temperature cycles with amplitudes from 100 to $300^{\circ}C$. It was consistently observed that higher loading frequency accelerated damaged grain growth and led to earlier failure irrespective of Cu grain sizes. The frequency effect is believed to result from differences in the concentration of defects created by the deformation-induced motion of dislocations to the grain boundaries.

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