• Proceedings of the KSME Conference
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• 2008.11b
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• pp.2738-2743
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• 2008

We conducted a study by computational simulation about the effects of frost thickness on the pressure drop and heat transfer characteristics as whole heat exchanger configuration changes. In order to perform the analysis for validation, we assumed that frost properties have constant values and the frost layers that are formed on the fin and tube surfaces are uniform. In order to find the constant thermal conductivity of frost layer, a variety of frost thermal conductivities are performed in our work and compared with the results by Lee et al. [4] and Yang et al. [5] proposed many experimental data about the 2-rows and 2-columns finned tube heat exchanger. The numerical results agreed well with the experimental data when frost conductivity is 0.07W/mK. After the validation had performed, we applied this procedure to the finned tube heat exchanger of domestic refrigeration and investigated the thermo-hydraulic characteristic of the heat exchanger affected by frost thickness according to the inlet velocities and temperatures of air considering the configuration change such as fin pitch.

• Korean Chemical Engineering Research
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• v.50 no.2
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• pp.371-378
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• 2012

Hydrophilic silica nanoparticles (SNPs) were treated by using 3-glycidoxypropyltrimethoxy silane (GPTMS) and then they were blended with polyurethane-urea (PUU) emulsions to obtain SNPs/PUU nanocomposite films. Thermo-mechanical properties of the nanocomposite films were investigated by varying the grafted amount of GPTMS onto SNPs and the contents of SNPs in the PUU matrix. The thermo-mechanical properties of the nanocomposite films were also compared in terms of the dispersibility of SNPs in the PUU matrix and thermal curing of the GPTMS-grafted SNPs. The maximum amount of grafted GPTMS was $1.99{\times}10^{-6}\;mol/m^2$, and which covered ca. 53% of the total SNP surface area. $^{29}Si$ CP/MAS NMR analyses with the deconvolution of peaks revealed the details of polycondensation degree and patterns of GPTMS in the surface modification of SNPs. The surface modification did not significantly affect colloidal stability of the SNPs in aqueous medium; however, the hydrophobic modification of SNPs offered a favorable effect on the dispersibility of SNPs in the PUU matrix as well as better thermal stability. XRD patterns revealed that GPTMS-grafted SNPs broadened the reduced the characteristic peak of polyol in PUU matrix. The composite films became rigid and less flexible as the SNP content increased from 5 wt.% to 20 wt.%. Particularly, Young's modulus and tensile modulus significantly increased after the thermal curing reaction of the epoxy groups in the SNPs.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.10
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• pp.817-822
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• 2017

The braking system is one of the most important components in vehicles and machines. It must exert a reliable braking force when they are brought to a halt. Generally, frictional heat is generated by converting kinetic energy into heat energy through friction. As the kinetic energy is converted into heat energy, high temperature heat is generated which affects the mechanical behavior of the braking system. Frictional heat affects the thermal expansion and friction coefficient of the brake system. If the temperature is not controlled, the brake performance will be decreased. Therefore, it is important to predict and control the heat generation of the brake. Various numerical analysis studies have been carried out to predict the frictional heat, but they assumed the existence of boundary conditions in the numerical analysis to simulate the frictional heat, because the simulation of frictional heat is difficult and time consuming. The results were based on the assumption that the frictional heat is different from the actual temperature distribution in a rotating brake system. Therefore, the reliability of the cooling effect or thermal stress using the results of these studies is insufficient. In order to overcome these limitations and establish a simulation procedure to predict the frictional heat, this study directly simulates the frictional heat generation by using a thermal-structure coupling element. In this study, we analyzed the thermo-mechanical behavior of a brake model, in order to investigate the thermal characteristics of brake systems by using the Finite Element method (FEM). This study suggests the necessity to directly simulate the frictional heating and it is hoped that it can provide the necessary information for simulations.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.21 no.1
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• pp.13-20
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• 2008

Graded layers in which two different constituent particles are mixed are inserted into functionally graded material such that the volume fractions of constituent particles vary continuously and functionally over the entire material domain. The material properties of this dual-phase graded region, which is essential for the numerical analysis of the thermo-mechanical behavior of FGM, have been predicted by traditional homogenization methods. But, these methods are limited to predict the global equivalent material properties of FGMs because the detailed geometry information such as the particel shape and the dispersion structure is not considered. In this context, this study intends to investigate the characteristics of these homogenization methods through the finite element analysis utilizing the discrete micromechanics models of the graded layer, for various volume fractions and external loading conditions.

• Plant Journal
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• v.12 no.1
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• pp.29-36
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• 2016

It is becoming increasingly important to make use of alternative energy source. because It is not able to rely on only fossil fuel for the recent increasing demand of energy consumption. With this situation, lots of studies for utilizing low grade energy such as industrial waste heat, solar energy, and geothermal energy have been conducted. The aim of this study is to predict the operation characteristics of working fluid by using performance analysis program (ThermoFlex) through the system analysis which is not mixing district return water but using ORC(Organic Rankine Cycle, hereinafter ORC) as a downstream cycle when accumulating district heating (hereinafter DH). In this study, We conducted the performance analysis for the case which has the district heating water temperature($120^{\circ}C$) and Flow rate of $163m^3/h$ (including District Heating return water flow), and examined several working fluid which is proper to this temperature. The case using R245fa (which is the best-case) showed 269.2kW power output, 6.37% efficiency. Additionally, Cut down on fuel was expected because of the boiler inlet temperature increase by being Formed $57.3{\sim}85^{\circ}C$ in a temperature of district heating return water, depending on a pressure change of a condenser in ORC system.

• Tunnel and Underground Space
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• v.33 no.3
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• pp.189-207
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• 2023

In the present study, the thermoshearing experiment on a rough rock fracture were modeled using a three-dimensional grain-based distinct element model (GBDEM). The experiment was conducted by the Korea Institute of Construction Technology to investigate the progressive shear failure of fracture under the influence of thermal stress in a critical stress state. The numerical model employs an assembly of multiple polyhedral grains and their interfaces to represent the rock sample, and calculates the coupled thermo-mechanical behavior of the grains (blocks) and the interfaces (contacts) using 3DEC, a DEM code. The primary focus was on simulating the temperature evolution, generation of thermal stress, and shear and normal displacements of the fracture. Two fracture models, namely the mated fracture model and the unmated fracture model, were constructed based on the degree of surface matedness, and their respective behaviors were compared and analyzed. By leveraging the advantage of the DEM, the contact area between the fracture surfaces was continuously monitored during the simulation, enabling an examination of its influence on shear behavior. The numerical results demonstrated distinct differences depending on the degree of the surface matedness at the initial stage. In the mated fracture model, where the surfaces were in almost full contact, the characteristic stages of peak stress and residual stress commonly observed in shear behavior of natural rock joints were reasonably replicated, despite exhibiting discrepancies with the experimental results. The analysis of contact area variation over time confirmed that our numerical model effectively simulated the abrupt normal dilation and shear slip, stress softening phenomenon, and transition to the residual state that occur during the peak stress stage. The unmated fracture model, which closely resembled the experimental specimen, showed qualitative agreement with the experimental observations, including heat transfer characteristics, the progressive shear failure process induced by heating, and the increase in thermal stress. However, there were some mismatches between the numerical and experimental results regarding the onset of fracture slip and the magnitudes of fracture stress and displacement. This research was conducted as part of DECOVALEX-2023 Task G, and we expect the numerical model to be enhanced through continued collaboration with other research teams and validated in further studies.