• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회B
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• pp.2738-2743
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• 2008

We conducted a study by computational simulation about the effects of frost thickness on the pressure drop and heat transfer characteristics as whole heat exchanger configuration changes. In order to perform the analysis for validation, we assumed that frost properties have constant values and the frost layers that are formed on the fin and tube surfaces are uniform. In order to find the constant thermal conductivity of frost layer, a variety of frost thermal conductivities are performed in our work and compared with the results by Lee et al. [4] and Yang et al. [5] proposed many experimental data about the 2-rows and 2-columns finned tube heat exchanger. The numerical results agreed well with the experimental data when frost conductivity is 0.07W/mK. After the validation had performed, we applied this procedure to the finned tube heat exchanger of domestic refrigeration and investigated the thermo-hydraulic characteristic of the heat exchanger affected by frost thickness according to the inlet velocities and temperatures of air considering the configuration change such as fin pitch.

• Korean Chemical Engineering Research
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• 제50권2호
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• pp.371-378
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• 2012

3-Glycidoxypropyltrimethoxy silane(GPTMS)으로 친수성의 실리카 나노입자(SNPs)를 소수화하였으며, 소수화된 SNPs를 폴리우레탄-우레아(PUU) 에멀젼과 혼합하여 SNPs/PUU 나노복합체 필름을 제조하였다. 필름 제조 후 PUU 매트릭스 내 SNPs의 함량, SNPs 표면의 소수화 정도, 에폭시 그룹과의 열경화 반응 여부가 필름의 물성에 미치는 영향을 분석하였다. SNP 표면에 도입된 GPTMS의 최대 함량은 $1.99{\times}10^{-6}\;mol/m^2$로 SNP 표면적 기준으로 약 53% 수준이었다. GPTMS에 의한 소수화로 PUU 매트릭스 내 SNPs의 분산성이 향상되었으며, SNPs 함량이 5 wt.%에서 20 wt.%로 증가함에 따라 SNPs/PUU 나노복합체 필름의 유연성은 감소하였으나, 열 안정성은 증가하였다. 특히 Young's modulus와 tensile modulus는 에폭시의 열경화 반응 후에 크게 증가하였다.

• 한국산학기술학회논문지
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• 제18권10호
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• pp.817-822
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• 2017

제동 장치는 기계장치의 사용자나 시스템의 안전관점에서 가장 중요한 요소 중 하나이며, 작동 조건 내에서 신뢰성 있는 제동력이 유지 되어야 한다. 일반적으로 브레이크는 운동에너지를 마찰을 통해 열에너지로 변환하여 회전하는 기계장치를 제동한다. 운동에너지가 열에너지로 전환되는 과정에서 고온의 열이 발생하여 기계적 거동에 영향을 준다. 마찰열은 브레이크 시스템의 열팽창 및 마찰계수 변화 등에 영향을 주고 제어되지 않는 고온은 브레이크 성능을 저하시킨다. 따라서 브레이크의 발열을 예측하고 이를 제어하는 것은 중요하다. 마찰열을 예측하기 위한 다양한 수치해석 연구들이 수행되었지만, 계산의 효율 및 재원의 한계로 수치해석의 경계조건을 다양한 형태로 가정하여 마찰열 예측 연구를 수행하였다. 가정된 마찰열 거동은 실제 열전달 온도 분포 경황과 차이가 있고 이를 이용한 냉각 효과나 열응력 수치해석 결과의 신뢰성이 부족하다. 이러한 한계점을 극복하고 마찰열 예측 시뮬레이션 절차를 정립하기 위하여 본 연구에서는 열-구조 결합 요소를 사용하여 브레이크 시스템의 마찰열 발생을 직접적으로 모사하는 시뮬레이션을 수행하였다. 본 논문은 Finite Element Method(FEM)을 이용하여 브레이크 작동에 따른 마찰열 발생을 모사하고 열분포 특성을 분석하기 위해 브레이크 모델을 대상으로 열-구조 연성요소를 적용한 수치해석 연구를 수행하였다. 이 연구는 마찰열 직접 모사의 필요성을 제안하고 시뮬레이션에 필요한 정보를 제공할 수 있다 판단된다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국전산구조공학회논문집
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• 제21권1호
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• pp.13-20
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• 2008

기능경사 소재(FGM)에는 서로 다른 두 가지 구성입자들이 혼합되어 있는 경사층(graded layer)이 삽입되어, 소재 전 영역에 걸쳐 구성입자의 체적분율이 연속적이고 기능적으로 변화하도록 되어있다. 이러한 이상(dual-phase) 입자복합재의 열 기계적 거동을 해석함에 있어 필수적인 경사층의 물성치는 전통적으로 균질화 기법을 이용하여 예측되었다. 하지만, 이러한 균질화 기법은 구성입자의 형태, 분산구조 등과 같은 상세 형상을 반영하지 못하지 때문에 복합재의 총체적인 등가 물성치 예측에만 국한 되어왔다. 이러한 맥락에서 본 연구에서는 경사층을 미시역학적으로 이산화 모델링하고, 다양한 체적분율과 외부 하중조건에 대해 유한요소해석을 실시하여 이러한 균질화 기법들의 특성을 분석하였다.

• 플랜트 저널
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• 제12권1호
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• pp.29-36
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• 2016

최근 늘어가는 에너지 수요를 화석연료에만 의존 할 수 없게 되면서 대체 에너지의 중요성이 대두되고 있으며, 이러한 상황에서 유기랭킨 사이클(Organic Rankine Cycle, 이하 ORC)등 산업체 폐열, 태양열, 지열, 해수 온도차 등의 저등급 에너지를 효과적으로 활용하기 위한 많은 연구가 진행되고 있다. 본 연구에서는 지역난방 축열시 회수수를 혼합하지 않고 ORC를 이용하여 하부사이클을 구성하여 성능해석 상용프로그램으로 작동유체 및 운전특성을 예측하였다. 지역난방수 운전조건인 열원 온도 $120^{\circ}C$, 열원 유량 $163m^3/h$(회수수 유량을 고려한 값)로 하고 이 온도에 적합한 다수의 작동유체를 선정하여 성능해석을 수행하였으며, 최고의 성능이 나타난 R245fa의 경우 269.2kW출력과 6.37%효율을 얻을 수 있었다. 또한 ORC 시스템의 응축기 압력변화에 따라 지역난방 회수수 온도가 $57.3{\sim}85^{\circ}C$범위에 형성됨으로서 보일러 입구온도상승에 따른 연료 절감 효과가 예상되었다.

• 터널과지하공간
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• 제33권3호
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• pp.189-207
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• 2023

In the present study, the thermoshearing experiment on a rough rock fracture were modeled using a three-dimensional grain-based distinct element model (GBDEM). The experiment was conducted by the Korea Institute of Construction Technology to investigate the progressive shear failure of fracture under the influence of thermal stress in a critical stress state. The numerical model employs an assembly of multiple polyhedral grains and their interfaces to represent the rock sample, and calculates the coupled thermo-mechanical behavior of the grains (blocks) and the interfaces (contacts) using 3DEC, a DEM code. The primary focus was on simulating the temperature evolution, generation of thermal stress, and shear and normal displacements of the fracture. Two fracture models, namely the mated fracture model and the unmated fracture model, were constructed based on the degree of surface matedness, and their respective behaviors were compared and analyzed. By leveraging the advantage of the DEM, the contact area between the fracture surfaces was continuously monitored during the simulation, enabling an examination of its influence on shear behavior. The numerical results demonstrated distinct differences depending on the degree of the surface matedness at the initial stage. In the mated fracture model, where the surfaces were in almost full contact, the characteristic stages of peak stress and residual stress commonly observed in shear behavior of natural rock joints were reasonably replicated, despite exhibiting discrepancies with the experimental results. The analysis of contact area variation over time confirmed that our numerical model effectively simulated the abrupt normal dilation and shear slip, stress softening phenomenon, and transition to the residual state that occur during the peak stress stage. The unmated fracture model, which closely resembled the experimental specimen, showed qualitative agreement with the experimental observations, including heat transfer characteristics, the progressive shear failure process induced by heating, and the increase in thermal stress. However, there were some mismatches between the numerical and experimental results regarding the onset of fracture slip and the magnitudes of fracture stress and displacement. This research was conducted as part of DECOVALEX-2023 Task G, and we expect the numerical model to be enhanced through continued collaboration with other research teams and validated in further studies.