• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Smart Structures and Systems
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• v.22 no.5
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• pp.495-508
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• 2018

Shape memory alloys (SMAs) exhibit superelasticity given the ambient temperature is above the austenite finish temperature threshold, the magnitude of which significantly depends on the metal ingredients though. For the monocrystalline CuAlBe SMAs, their superelasticity was found being maintained even when the ambient temperature is down to $-40^{\circ}C$. Thus this makes such SMAs particularly favorable for outdoor seismic applications, such as the framed structures located in cold regions with substantial temperature oscillation. Due to the thermo-mechanical coupling mechanism, the hysteretic properties of SMAs vary with temperature change, primarily including altered material strength and different damping. Thus, this study adopted the monocrystalline CuAlBe SMAs as the kernel component of the SMA braces. To quantify the seismic response characteristics at various temperatures, a wide temperature range from -40 to $40^{\circ}C$ are considered. The middle temperature, $0^{\circ}C$, is artificially selected to be the reference temperature in the performance comparisons, as well the corresponding material properties are used in the seismic design procedure. Both single-degree-of-freedom systems and a six-story braced frame were numerically analyzed by subjecting them to a suite of earthquake ground motions corresponding to the design basis hazard level. To the frame structures, the analytical results show that temperature variation generates minor influence on deformation and energy demands, whereas low temperatures help to reduce acceleration demands. Further, attributed to the excellent superelasticity of the monocrystalline CuAlBe SMAs, the frames successfully maintain recentering capability without leaving residual deformation upon considered earthquakes, even when the temperature is down to $-40^{\circ}C$.

• Composites Research
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• v.18 no.6
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• pp.1-8
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• 2005

The fiber-reinforced composite materials have been advanced for various applications because of their excellent mechanical and electromagnetic properties. On their manufacturing processes, however, thermo-curing inherently produces the undesired thermal deformation mainly from temperature drop from the process temperature to the room temperature, so called spring-back. The spring-back must be understood especially in the hybrid composites in order to design and fabricate desired shape. In this research, (glass fiber / epoxy) + (carbon fiber / epoxy) unsymmetric hybrid composites were fabricated under various conditions such as cure cycle, laminate thickness, stacking sequence and curing sequence. Coupons were made and spring-back were measured using coordinate measuring machine (CMM). Using the Classical Lamination Theory (CLT) and finite element analysis (ANSYS), the behavior of spring-back were predicted and compared with the experimental data. The results from CLT and FEA agreed well with the experimental data. Although, the spring-back could be reduced by lowering curing temperature, at any case, the spring-back could not be removed completely.

• Journal of the Korean Geotechnical Society
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• v.29 no.8
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• pp.65-73
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• 2013

Ground-coupled heat pump system has attracted attention as a promising renewable energy technology due to its improving energy efficiency and eco-friendly mechanism for space cooling and heating. Pipes buried in the ground play a role of direct thermal interaction between circulating fluid inside the pipe and surrounding soils in the geothermal exchange system. However, both complexities of turbulent flow coupling thermal-hydraulic phenomena and very long aspect ratio of the pipe make it difficult to model the heat exchange system directly. Energy balance for fluid flow inside the pipe was derived to model thermal-hydraulic phenomena, and one-dimensional pipe element was proposed through Galerkin formation and time integration of the equation. Developed element is combined to pre-developed FEM code for THM phenomena in porous media. Numerical results of Thermal Response Test showed that line-source model overestimates equivalent thermal conductivity of surrounding soils due to thermal interaction between adjacent pipes and finite length of the pipe. Thus, inverse analysis for the TRT simulation was conducted to present optimal transformation matrix with utmost convergence.

• Journal of the Korean Ceramic Society
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• v.48 no.1
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• pp.63-68
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• 2011

The investigation is directed to lead free (Pb-free) frits that can be used for organic light emitting diode, plasma display screen devices and other sealing materials. $P_2O_5$-SnO system glasses have been prepared for Pb-free low temperature glass frit. Structure and properties of the glasses with the composition SnO-$xB_2O_3-(60-x)P_2O_5$ (x=0, 5, 10, 15, 20, 25, 30, 35, 40 mol%) were characterized by infrared spectra (IR), X-ray diffraction(XRD), Density, Molar volume, Thermo mechanical analysis(TMA) and weight loss after immersion test. Glass transition temperature($T_g$), dilatometric softening temperature($T_d$) and chemical durability increased, and coefficient of thermal expansion($\alpha$) decrease with the substitution of $B_2O_3$ for $P_2O_5$ in the range of 0~25 mol%.

• Nuclear Engineering and Technology
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• v.43 no.3
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• pp.279-286
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• 2011

The aging degradation and lifetime assessment of a domestic class 1E Ethylene-Propylene-Diene-Monomer (EPDM), which is a popular insulating elastomer for electrical cables in the nuclear power plants, were studied for equipment qualification verification under the Loss of Coolant Accident (LOCA) conditions. The specimens were acceleratively aged, underwent a LOCA environment, as well as tested mechanically, thermo-gravimetrically, and spectroscopically according to the American Society of the Testing of Materials (ASTM) procedures. The tensile test results revealed that the elongation at break gradually decreased with an increasing aging temperature. The lifetime of EPDM aged isothermally at $140^{\circ}C$ was 1,316 hours and reduced to 1,120 hours after experiencing the severe accident test. The activation energies of the elongation reduction were $1.10{\pm}0.196$ eV and $0.93{\pm}0.191$ eV before and after the LOCA condition, respectively. The TGA test results also showed that the activation energy of the aging decomposition decreased from 1.35 eV to 1.02 eV after undergoing the LOCA environment. Although the mechanical property changes were discernibly observed during the aging process, along with the LOCA simulation, the FT-IR analysis showed that the spectroscopic peaks and their intensities did not alter significantly. Therefore, it can be concluded that the degradation of the domestic class 1E EPDM due to aging can be tolerable, even in severe accident conditions such as LOCA, and thus it qualifies as a suitable insulating material for electrical cables in the nuclear power plants.

• The KSFM Journal of Fluid Machinery
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• v.20 no.1
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• pp.41-47
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• 2017

This study aimed to analyze organic Rankine cycle(ORC) which recovers discarded heat from a gas turbine based combined cycle cogeneration(CC-cogen) plant in terms of both performance and economics. The nominal electric power of the CC-cogen plant is around $120MW_e$, and heat for district heating is $153MW_{th}$. The major purpose of this study is to compare various options in selecting heat source of the ORC. Three heat sources were compared. Case 1 uses the exhaust gas from the HRSG, which is purely wasted to environment in normal plant operation without ORC. Case 2 also uses the exhaust gas from the HRSG. On the other hand, in this case, the DH economizer, which is located at the end of the HRSG, does not operate. Case 3 generates power using some of the district heating water which is supplied to consumers. The estimated ORC power generation ranges between 0.3 to 2.3% of the power generation capacity of the CC-cogen plant. Overall, Case 3 is evaluated to be better than other two options in terms of system design flexibility and power generation capacity.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• Macromolecular Research
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• v.16 no.6
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• pp.517-523
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• 2008

A RGD (Arg-Gly-Asp) conjugated chitosan hydrogel was used as a cell-supporting scaffold for articular cartilage regeneration. Thermosensitive chitosan-Pluronic (CP) has potential biomedical applications on account of its biocompatibility and injectability. A RGD-conjugated CP (RGD-CP) copolymer was prepared by coupling the carboxyl group in the peptide with the residual amine group in the CP copolymer. The chemical structure of RGD-CP was characterized by $^1H$ NMR and FT IR. The concentration of conjugated RGD was quantified by amino acid analysis (AAA) and rheology of the RGD-CP hydrogel was investigated. The amount of bound RGD was $0.135{\mu}g$ per 1 mg of CP copolymer. The viscoelastic parameters of RGD-CP hydrogel showed thermo-sensitivity and suitable mechanical strength at body temperature for cell scaffolds (a> 100 kPa storage modulus). The viability of the bovine chondrocyte and the amount of synthesized glycosaminoglycans (GAGs) on the RGD-CP hydrogels were evaluated together with the alginate hydrogels as a control over a 14 day period. Both results showed that the RGD-CP hydrogel was superior to the alginate hydrogel. These results show that conjugating RGD to CP hydro gels improves cell viability and proliferation, including extra cellular matrix (ECM) expression. Therefore, RGD conjugated CP hydrogels are quite suitable for a chondrocyte culture and have potential applications to the tissue engineering of articular cartilage tissue.

• Nuclear Engineering and Technology
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• v.55 no.11
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• pp.4066-4076
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• 2023

Pressure resistance welding is usually used to seal the connection between the cladding tube and the end plug made of zirconium alloy. The seal welded joint has a direct effect on the service performance of the fuel rod cladding structure. In this paper, the pressure resistance welded joints of zirconium alloy tube-plug structure were obtained by thermal-mechanical simulation experiments. The microstructure and microhardness of the joints were both analyzed. The effect of processing parameters on the microstructure was studied in detail. The results showed that there was no β-Zr phase observed in the joint, and no obvious element segregation. There were different types of Widmanstätten structure in the thermo-mechanically affected zone (TMAZ) and heat affected zone (HAZ) of the cladding tube and the end plug joint because of the low cooling rate. Some part of the grains in the joint grew up due to overheating. Its size was about 2.8 times that of the base metal grains. Due to the high dislocation density and texture evolution, the microhardnesses of TMAZ and HAZ were both significantly higher than that of the base metal, and the microhardness of the TMAZ was the highest. With the increasing of welding temperature, the proportion of recrystallization in TMAZ decreased, which was caused by the increasing of strain rate and dislocation annihilation.