• International Journal of Naval Architecture and Ocean Engineering
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• v.10 no.2
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• pp.141-152
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• 2018

The heating process such as line heating, triangular heating and so on is widely used in plate forming of shell plates found in bow and stern area of outer shell in a ship. Local shrinkage during heating process is main physical phenomenon used in plate forming process. As it is well appreciated, the heated plate undergoes the change in material and mechanical properties around heated area due to the harsh thermal process. It is, therefore, important to investigate the changes of physical and mechanical properties due to heating process in order to use them plate the design stage of shell plates. This study is concerned with the development of formula of plastic hardening constitutive equation for steel plate on which line heating is applied. In this study the stress correction formula for the heated plate has been developed based on the numerical simulation of tension test with varying plate thickness and heating speed through the regression analysis of multiple variable case. It has been seen the developed formula shows very good agreement with results of numerical simulation. This paper ends with usefulness of the present formula in examining the structural characteristic of ship's hull.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.98-104
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• 2023

The feasibility of an efficient process proposed for Cu-Cu flip-chip bonding was evaluated by forming a porous Cu layer on Cu pillar and conducting thermo-compression sinter-bonding after the infiltration of a reducing agent. The porous Cu layers on Cu pillars were manufactured through a three-step process of Zn plating-heat treatment-Zn selective etching. The average thickness of the formed porous Cu layer was approximately 2.3 ㎛. The flip-chip bonding was accomplished after infiltrating reducing solvent into porous Cu layer and pre-heating, and the layers were finally conducted into sintered joints through thermo-compression. With reduction behavior of Cu oxides and suppression of additional oxidation by the solvent, the porous Cu layer densified to thickness of approximately 1.1 ㎛ during the thermo-compression, and the Cu-Cu flip-chip bonding was eventually completed. As a result, a shear strength of approximately 11.2 MPa could be achieved after the bonding for 5 min under a pressure of 10 MPa at 300 ℃ in air. Because that was a result of partial bonding by only about 50% of the pillars, it was anticipated that a shear strength of 20 MPa or more could easily be obtained if all the pillars were induced to bond through process optimization.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.6
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• pp.263-268
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• 2017

A hot forming process is required for Mg alloys to enhance the formability and plastic workability due to the insufficient formability at room temperature. Mg alloy undergoes dynamic recrystallization (DRX) during the hot working process, which is a restoration or softening mechanism that reduces the dislocation density and releases the accumulated energy to facilitate plastic deformation. The flow stress curve shows three stages of complicated strain hardening and softening phenomena. As the strain increases, the stress also increases due to work hardening, and it abruptly decreases work softening by dynamic recrystallization. It then maintains a steady-state region due to the equilibrium between the work hardening and softening. In this paper, an efficient optimization process is proposed for the material model of the dynamic recrystallization to improve the accuracy of the flow curve. A total of 18 variables of the constitutive equation of AZ80 alloy were systematically optimized at an elevated forming temperature($300^{\circ}C$) with various strain rates(0.001, 0.1, 1, 10/sec). The proposed method was validated by applying it to the constitutive equation of AZ61 alloy.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1997.03a
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• pp.159-164
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• 1997

The optimal conditions were investigated in order to manufacture the light automotive body parts using the semi-solid forging process by the finite element nalysis. Considering about macro-segregation cause to difference of relative velocity between solid phase and liquid phase, solidificational phenomenon cause to heat transfer from die and export of the latent heat, so solid fraction updating algorithm can be proposed. The rigid thermo-viscoplastic finite element analysis was carried out according to die temperature with proposed algorithm, so availability of forming part were understood. The finite element program can be used to the analysis of semi solid forging process.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.209-212
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• 2006

Line heating with water cooling is generally adapted process in the shipyards for the forming hull surface. The purpose of this paper is to develop a model of thermal deformation in water cooling process after the line heating. In order to simulate the cooling process, heat transfer analysis was performed by assuming the effects of water cooling as a negative heat-source. Experiment for the line heating with water cooling was performed for 9 models of plates in order to verify the cooling model. By using the suggested model for the water cooling process, it could be observed that the present method predict the plate deformations in the line heating more accurately.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.214-214
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• 2014

Computational analysis of aqueous solution stability of Fe-Cr-Ni system to find an electroplating condition of Fe-Cr-Ni layer. Aqueous sulfate solution with iron, chromium and nickel ions was selected by using a numerical S/W with which aqueous solution stability was analyzed. Several possible conditions to perform electro-forming of Fe-Cr-Ni were selected with thermo-dynamical data. The Fe-Cr-Ni system was electro-formed which composition and microstructure of the electroplated Fe-Cr-Ni significantly depended on the solution temperature and electro-potential. The final composition of Fe-3%Cr-48%Ni with less than $30{\mu}m$ thick was well electroplated.

• Journal of the Society of Naval Architects of Korea
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• v.29 no.1
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• pp.191-200
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• 1992

In order to simulate the line heating process which is a three-dimensional transient thermo elastic plastic state, a simple modified strip model is suggested. First attempt is made to verify the validity of the model using a finite element program, and the result gives good agreement with the plate theory where conventional two-dimensional model fails totally.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.24 no.2
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• pp.196-203
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• 2012

Energy foundations and other thermo-active ground structure, energy wells, energy-slab, and pavement heating and cooling represent an innovative technology that contributes to environmental protection and provides substantial long-term cost savings and minimized maintenance. This paper focuses on earth-contact concrete elements that are already required for structural reasons, but which simultaneously work as heat exchangers. Pipes, energy slabs, filled with a heat carrier fluid are installed under conventional structural elements, forming the primary circuit of a geothermal energy system. The natural ground temperature is used as a heat source in winter and a heat sink in summer. The geothermal heat pump system with energy-slab represented very high heating and cooling performance due to the stability of EWT from energy slab. However, the performance of it seemed to be affected by the atmospheric air temperature.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.10
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• pp.2211-2218
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• 2002

In this study, an optimal design study has been made to determine dimensions of die and multi stress rings for extrusion process. For this purpose, a thermo-rigid-viscoplastic finite element program, CAMPform, was used fur forming analysis of extrusion process and a developed elastic finite element program fur elastic stress analysis of the die set including stress rings. And an optimization program, DOT, was employed for the optimization analysis. From this investigation, it was found out that the amount of shrink fitting incurred by the order of assembly of the die set should be taken into account for optimization when the multi stress rings are used in practice. In addition, it is construed that the proposed design method can be beneficial fur improving the tool life of cold extrusion die set.

• Transactions of Materials Processing
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• v.17 no.8
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• pp.633-642
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• 2008

It's important to measure quantitative properties about thermal-nano behavior of polymer for producing high quality components using Nanoimprint lithography process. Nanoscale indents can be used to make the cells for molecular electronics and drug delivery, slots for integration into nanodevices, and defects for tailoring the structure and properties. In this study, formability of polymethylmetacrylate(PMMA) and polycarbonate(PC) were characterized Polymer has extreme variation in thermo mechanical variation during forming high temperature. Because of heating the polymer, it becomes softer than at room temperature. In this case it is particularly important to study high temperature-induced mechanical properties of polymer. Nanoindenter XP(MTS) was used to measure thermo mechanical properties of PMMA and PC. Polymer was heated by using the heating stage on NanoXP. At CSM(Continuous Stiffness Method) mode test, heating temperature was $110^{\circ}C,120^{\circ}C,130^{\circ}C,140^{\circ}C$ and $150^{\circ}C$ for PMMA, $140^{\circ}C,150^{\circ}C,160^{\circ}C,170^{\circ}C$ and $180^{\circ}C$ for PC, respectively. Maximum indentation depth was 2000nm. At basic mode test, heating temperature was $90^{\circ}C$ and $110^{\circ}C$ for PMMA, $140^{\circ}C,160^{\circ}C$ for PC. Maximum load was 10mN, 20mN and 40mN. Also indented pattern was observed by using SEM and AFM. Mechanical properties of PMMA and PC decreased when temperature increased. Decrease of mechanical properties from PMMA went down rapidly than that of PC.