• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.5
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• pp.14-20
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• 2006

In recent year, as the robot technology is developed, the researches on the artificial muscle actuator that enables robot to move dexterously like biological organ become active. Actuators are key technologies underpinning robotics. Breakthroughs in actuator technology, particular in terms of power-to-weight ratio, or energy-density, will have significant impacts upon the design and control of robotic system. In this paper, a new approach to design and control of shape memory alloy(SMA) actuator is presented to drive the robot hand. SMA wire is divided into many segments and their thermal states of the SMA are controlled individually in a binary manner. This control manner will reduce the hysteresis that the SMA material has and it becomes the fundamental technology to develop the anthropomorphic robot hand. In this paper, the mechanism In the digital step motor of the shape memory alloy that is driven by the segmented binary control, which is a new control technique, is studied. This SMA digital step actuator applies for the robot hand and the driving mechanism of the robot hand is investigated.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.7-12
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• 2010

We have developed a SPICE compatible model of thermoelectric devices, and a parameter extracting technique only by electrical and temperature measurement by using Harman method was proposed. The proposed model and parameter extraction technique do not require experimental data from thermal conductivity measurements. The maximum error between extracted parameters extracted by proposed method and conventional method was about 14%, which is not a severe mismatch for real application. The proposed model is applicable to design of both for thermoelectric coolers and thermo electric generators.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.140-151
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• 1996

In this paper, we analyze the variations of thermal characteristics of LD (laser diode) arrays packaged by a flip-chip bonding method. When we simulate the temperature distribution in LD arrays with a BEM (boundary element method) program coded in this paper, we find that thermal crosstalks in LD arrays packaged by the flip-chip bonding method increases by 250-340% compared to that in LD arrays packaged by previous methods. In the LD array module packaged by the flip-chip bonding technique without TEC (thermo-electric cooler), the important parameter is the absolute temperature of the active layer increased due cooler), the important parameter is the absolute temperature of th eactiv elayers of LD arrays to thermal crosstalk. And we find that the temperature of the active layers of LD arrays increases up to 125$^{\circ}C$ whenall four LDs, without a carefully designed heatsink, are turned on, assuming the power consumption of 100mW from each LD. In order to reduce thermal crosstalk we propose a heatsink sturcture which can decrease the temeprature at the active layer by 40%.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.3
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• pp.343-350
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• 2012

A planar solid oxide fuel cell (PSOFC) is studied in its application in a high-temperature stationary power plant. Even though PSOFCs with external reformers are designed for application from the distributed power source to the central power plant, such PSOFCs may sacrifice more system efficiency than internally reformed SOFCs. In this study, modeling of the PSOFC with an external reformer was developed to analyze the feasibility of thermal energy utilization for the external reformer. The PSOFC system model includes the stack, reformer, burner, heat exchanger, blower, pump, PID controller, 3-way valve, reactor, mixer, and steam separator. The model was developed under the Matlab/Simulink environment with Thermolib$^{(R)}$ modules. The model was used to study the system performance according to its configuration. Three configurations of the SOFC system were selected for the comparison of the system performance. The system configuration considered the cathode recirculation, thermal sources for the external reformer, heat-up of operating gases, and condensate anode off-gas for the enhancement of the fuel concentration. The simulation results show that the magnitude of the electric efficiency of the PSOFC system for Case 2 is 12.13% higher than that for Case 1 (reference case), and the thermal efficiency of the PSOFC system for Case 3 is 76.12%, which is the highest of all the cases investigated.