• 제목/요약/키워드: Thermo-1Mechanical Fatigue

검색결과 22건 처리시간 0.025초

1.5Cr-0.67Mo-0.33V강의 열피로 크랙전파 거동 (Thermo-Mechanical Fatigue Crack Propagation Behaviors of 1.5Cr-0.67Mo-0.33V Alloy)

  • 송삼홍;강명수
    • 대한기계학회논문집
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    • 제19권9호
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    • pp.2133-2141
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    • 1995
  • The thermo-mechanical fatigue tests were performed on the specimens extracted from 1.5Cr-0. 67Mo-0.33V alloy. The characteristics of thermo-mechanical fatigue crack propagation were examined and reviewed in view of fracture mechanics. The results obtained from the present study are summarized as follows : (1) The propagation characteristics of isothermal low-cycle fatigue crack are dominated by .DELTA.J$_{f}$ in case of PP waveform, and .DELTA.J$_{c}$ in case of CP waveform. (II)The propagation characteristics of thermo-mechanical fatigue crack are dominated by .DELTA.J$_{c}$ for in-phase case, and by .DELTA.J$_{c}$ for out-of-phase. The present results were in good agreement with the equation of propagation law for isothermal low-cycle fatigue crack in case of thermo-mechanical fatigue.tigue.e.

가스터빈 블레이드용 IN738LC의 열기계피로수명에 관한 연구 (Thermo-Mechancal Fatigue of the Nickel Base Superalloy IN738LC for Gas Turbine Blades)

  • 에릭 플러리;하정수;현중섭;장석원;정훈
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2000년도 춘계학술대회논문집A
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    • pp.188-193
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    • 2000
  • A more accurate life prediction for gas turbine blade takes into account the material behavior under the complex thermo-mechanical fatigue(TMF) cycles normally encountered in turbine operation. An experimental program has been carried out to address the thermo-mechanical fatigue life of the IN738LC nickel-base superalloy. In the first phase of the study, out-of-phase and in-phase TMF experiments have been performed on uncoated and coated materials. In the temperature range investigated. the deposition of NiCrAlY air plasma sprayed coating did not affect the fatigue resistance. In the second phase of the study, a physically-base life prediction model that takes into account of the contribution of different damage mechanisms has been applied. This model was able to reflect the temperature and strain rate dependences of isothermal cycling fatigue lives, and the strain-temperature history effect on the thermo-mechanical fatigue lives.

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구리 TSV의 열기계적 신뢰성해석 (Thermo-mechanical Reliability Analysis of Copper TSV)

  • 좌성훈;송차규
    • Journal of Welding and Joining
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    • 제29권1호
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    • pp.46-51
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    • 2011
  • TSV technology raises several reliability concerns particularly caused by thermally induced stress. In traditional package, the thermo-mechanical failure mostly occurs as a result of the damage in the solder joint. In TSV technology, however, the driving failure may be TSV interconnects. In this study, the thermomechanical reliability of TSV technology is investigated using finite element method. Thermal stress and thermal fatigue phenomenon caused by repetitive temperature cycling are analyzed, and possible failure locations are discussed. In particular, the effects of via size, via pitch and bonding pad on thermo-mechanical reliability are investigated. The plastic strain generally increases with via size increases. Therefore, expected thermal fatigue life also increase as the via size decreases. However, the small via shows the higher von Mises stress. This means that smaller vias are not always safe despite their longer life expectancy. Therefore careful design consideration of via size and pitch is required for reliability improvement. Also the bonding pad design is important for enhancing the reliability of TSV structure.

The effect of thermo-mechanical fatigue on the retentive force and dimensional changes in polyetheretherketone clasps with different thickness and undercut

  • Guleryuz, Aysegul;Korkmaz, Cumhur;Sener, Ayse;Tas, Mehmet Ozan
    • The Journal of Advanced Prosthodontics
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    • 제13권5호
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    • pp.304-315
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    • 2021
  • PURPOSE. Esthetic expectations have increased the use of polyetheretherketone (PEEK) clasps as alternatives to Cr-Co in removable partial dentures (RPDs). The objective of this study was to evaluate the retentive force and dimensional change of clasps with different thickness and undercut made from PEEK by the thermo-mechanical fatigue. MATERIALS AND METHODS. PEEK clasps (N = 48) with thicknesses of 1 or 1.50 mm and 48 premolar monolithic zirconia crowns with undercuts of 0.25 mm or 0.50 mm were fabricated. Samples are divided into four groups (C1-C4) and were subjected to 7200 thermal aging cycles (at 5 - 55℃). The changes in the retentive force and dimensions of the clasps were measured by micro-stress testing and micro-CT devices from five measurement points (M1 - M5). One-way ANOVA, paired t-test, two-way repeated ANOVA, and post-hoc tests were used to analyze the data (P < .05). RESULTS. The retentive forces of C1, C2, C3, and C4 groups in initial and final test were found to be 4.389-3.388 N, 4.67 - 3.396 N, 5.161 - 4.096 N, 5.459 - 4.141 N, respectively. The effects of retentive force of all PEEK clasps groups were significant decreased. Thermo-mechanical cycles caused significant dimensional changes at points with M2, M4, and M5, and abraded the clasp corners and increased the distance between the ends of the clasp, resulting in reduced retentive forces (P* = .016, P* = .042, P < .001, respectively). CONCLUSION. Thermo-mechanical aging decreases the retentive forces in PEEK clasps. Increasing the thickness and undercut amount of clasps decreases the amount of dimensional change. The values measured after aging are within the clinically acceptable limits.

Experimental studies on the fatigue life of shape memory alloy bars

  • Casciati, Sara;Marzi, Alessandro
    • Smart Structures and Systems
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    • 제6권1호
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    • pp.73-85
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    • 2010
  • The potential offered by the thermo-mechanical properties of shape memory alloys (SMA) in structural engineering applications has been the topic of many research studies during the last two decades. The main issues concern the long-term predictability of the material behaviour and the fatigue lifetime of the macro structural elements (as different from the one of wire segments). The laboratory tests reported in this paper are carried out on bar specimens and they were planned in order to pursue two objectives. First, the creep phenomenon is investigated for two different alloys, a classical Ni-Ti alloy and a Cu-based alloy. The attention is then focused on the Cu-based alloy only and its fatigue characteristics at given temperatures are investigated. Stress and thermal cycles are alternated to detect any path dependency.

초음파-적외선 열화상 기법에 의한 피로균열 검출에 있어 발열 메커니즘 분석 (Analysis of Heat Generation Mechanism in Ultrasound Infrared Thermography)

  • 최만용;이승석;박정학;김원태;강기수
    • 비파괴검사학회지
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    • 제29권1호
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    • pp.10-14
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    • 2009
  • 초음파 적외선 비파괴 열화상 검사기술의 발열 메커니즘은 정확히 규명되지 않았으나, 열-기계 연성효과와 결함 계면 사이의 마찰효과가 주요한 원인인 것으로 추정되고 있다. 본 논문에서는 피로균열을 갖는 알루미늄 합금 시험편에서 결함을 검출하고, 실험조건으로부터 각각의 메커니즘에 따라 온도 변화를 수치 예측하였다. 시험결과와 수치예측 결과로부터 발열의 주요한 원인이 마찰이라는 것을 밝혔다.

PZT 세라믹 레조네이터 무연솔더 접합부의 열-기계적 피로 가속수명 (Accelerated Thermo-Mechanical Fatigue Life of Pb-Free Solder Joints for PZT Ceramic Resonator)

  • 홍원식;박노창;오철민
    • 한국재료학회지
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    • 제19권6호
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    • pp.337-343
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    • 2009
  • In this study, we optimized Pb-free Sn/Ni plating thickness and conditions were optimized to counteract the environmental regulations, such as RoHS and ELV(End-of Life Vehicles). The $B_{10}$ life verification method was also suggested to have been successful when used with the accelerated life test(ALT) for assessing Pb-free solder joint life of piezoelectric (PZT) ceramic resonator. In order to evaluate the solder joint life, a modified Norris-Landzberg equation and a Coffin-Manson equation were utilized. Test vehicles that were composed of 2520 PZT ceramic resonator on FR-4 PCB with Sn-3.0Ag-0.5Cu for ALT were manufactured as well. Thermal shock test was conducted with 1,500 cycles from $(-40{\pm}2)^{\circ}C$ to $(120{\pm}2)^{\circ}C$, and 30 minutes dwell time at each temperature, respectively. It was discovered that the thermal shock test is a very useful method in introducing the CTE mismatch caused by thermo-mechanical stress at the solder joints. The resonance frequency of test components was measured and observed the microsection views were also observed to confirm the crack generation of the solder joints.

화력 발전소 증기 터빈의 자동기동을 위한 주증기 제어 밸브 수명해석 (Service Life Analysis of Control Valve far Automatic Turbine Startup of Thermal Power Plant)

  • 김효진;강용호
    • 대한기계학회논문집A
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    • 제26권1호
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    • pp.1-6
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    • 2002
  • The automatic turbine startup system provides turbine control based on thermal stress. During the startup, control system monitors and evaluates main components of turbine using damage mechanism and life assessment. In case of valve chest, the temperature of inner/outer wall is measured by thermo-couples and the safety of these values are evaluated by using allowable △T limit currie during the startup. Because allowable ΔT limit curve includes life assessment, it is possible to apply this curve to turbine control system. In this paper, low cycle fatigue damage, combined rupture and low cycle fatigue damage criterion were proposed for yielding the allowable ΔTf limit curve of CV(control valve) chest. To calculate low cycle fatigue damage, the stress analysis of valve chest has been performed using FEM. Automatic turbine startup to assure service life of CV was achieved using allowable ΔT limit curve.

액체로켓엔진 연소기 열차폐코팅 내구성 시험 기술동향 (Thermal Barrier Coating Durability Testing Trends for Thrust Chamber of Liquid-propellant Rocket Engine)

  • 이금오;유철성;임병직;최환석
    • 한국추진공학회지
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    • 제17권1호
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    • pp.103-115
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    • 2013
  • 액체로켓 연소기에 사용되는 열차폐코팅(TBC)의 내구성 시험 기술동향을 조사하였다. 표면 접합력 측정을 위한 기계적 시험, 레이저나 가열로, 버너나 플라즈마 등을 이용한 열피로 시험, 분사기를 이용한 소형 연소시험, 열적 기계적 피로시험 등의 많은 내구성 시험들이 있었다. 연소기에 사용하기 위해 이러한 시편 수준의 시험을 통해 내구성이 확보된 TBC를 결정할 수 있으며, 실제 연소시험을 통해 내구성을 검증할 수 있다.

Lead-Free Solders and Processing Issues Relevant to Microelectronics Packaging

  • Kang, Sung K.
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2003년도 International Symposium
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    • pp.147-163
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    • 2003
  • European Union bans the usage of Pb in electronics from July 1 st, 2006. The Near-eutectic Sn-Ag-Cu alloys are the leading candidate Pb-free solders (for SMT card assembly). .The microstructure of Sn-Ag-Cu alloys is discussed in terms of solidification, composition and cooling rate. Methods of controlling Ag3Sn plates are discussed. .Thermo-mechanical fatigue behaviors of Sn-Ag-Cu solder joints are reviewed. Tin pest, whisker growth, electromigration of Pb-free solders are discussed.

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