• 한국농공학회논문집
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• 제46권4호
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• pp.39-46
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• 2004

This experiment was carried out to study on the effect of surface coating on thermal insulation of farm structures to improve thermal resistance and reflective effect of solar radiation. Nine different types of experimental specimen were compared in the temperature variations of inside and outside; A, B, C, D. E and F types are box container and G, H and I types are drum container. The size of these containers is $1,500{\times}2,000{\times}2,500$ mm and ${\varphi}$ $280{\times}330$ mm, respectively. Specimen of 3-type box(A, B, C) is galvanized steel sheet of thickness 0.45 mm. D, E and F types are sandwich panel of the thickness 50 mm inserted with urethane, glass wool and polystyrene form, respectively. G, H and I types are paint pot using in general. The surface of A. D, E, F and I types didn't any treatment, B, C and G types were treated with thermal insulation coating on the outside surface(B, G) or the inside and outside surface(C). And H type was treated with water paint coating on the only outside surface. In general, the experimental results showed the following tendencies; In case of A, B and C types. it was found that the thermal insulation effect of types coated with thermal insulation coating was improved remarkably than that of no treatment. And the thermal insulation effect between steel sheet and sandwich panel type was nearly similar There was not a significant difference of thermal insulation effect between thermal insulation coating and water paint coating. In time of drum container filled with rough rice, The difference of heat transfer tendency and temperature variation among surface treatments was nearly similar that of box types of galvanized steel sheet. And there was time lag about 6 hours between the temperature of middle part of rice and that of inside or outside surface.

• JSTS:Journal of Semiconductor Technology and Science
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• 제15권3호
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• pp.356-364
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• 2015

The transmission performance of TSV considering the effect of electronic-thermal coupling is an new challenge in three dimension integrated circuit. This paper presents the thermal equivalent circuit (TEC) model of the TSV, and discussed the thermal equivalent parameters for TSV. Si layer is equivalent to transmission line according to its thermal characteristic. Thermal transient response (TTR) of TSV considering electronic-thermal coupling effects are proposed, iteration flow electronic-thermal coupling for TSV is analyzed. Furthermore, the influences of TTR are investigated with the non-coupling and considering coupling for TSV. Finally, the relationship among temperature, thickness of $SiO_2$, radius of via and frequency of excitation source are addressed, which are verified by the simulation.

• 대한기계학회논문집B
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• 제25권6호
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• Journal of Welding and Joining
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• 제30권6호
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• pp.120-125
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• 2012

Because ships and offshore structures have very large dimensions and complicated shapes, it is difficult to determine the deformation or internal stress in the structure by simple lab tests. Thus, a rigorous analysis by using the computer simulation technology is essential for obtaining their distortions by considering the entire production process characteristics. The rapid development of computer technology made it possible to analyze the heat transfer phenomena, deformation and phase transformation in the welded joint. For large shell structures, shell elements modeling contributed primarily to this development. But if a welding is done by multi-pass, shell elements whose thickness are unchangeable can hard to describe the local situation. Recently, it was researched how to introduce the imaginary temperature for V grooved multi-layer butt welding in strain-boundary method (a kind of shrinkage methodologies). In the present study, we formulated the imaginary temperature for the double bevel and double V groove by considering the thickness change of each pass through the bead and the thickness directions simultaneously and also demonstrated the feasibility of the formula by applying it to the thermal distortion analysis of the erection process of crane pedestal.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.41-41
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• 2009

We utilized atomic layer deposition (ALD) for the growth of the ZnO channel layers in the oxide thin-film-transistors (TFTs) with a bottom-gate structure using a $SiO_2/p-Si$ substrate. For fundamental study, the effect of the channel thickness and thermal treatment on the TFT performance was investigated. The growth modes for the ALD grown ZnO layer changed from island growth to layer-by-layer growth at thicknesses of > 7.5 nm with highly resistive properties. A channel thickness of 17 nm resulted in the good TFT behavior with an onloff current ratio of > $10^6$ and a field effect mobility of 2.9 without the need for thermal annealing. However, further increases in the channel thickness resulted in a deterioration of the TFT performance or no saturation. The ALD grown ZnO layers showed reduced electrical resistivity and carrier density after thermal treatment in oxygen.

• 한국의류학회지
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• 제19권1호
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• pp.142-148
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• 1995

In this study, FVM (Finite Volume Method) which is one of the 2-dimensional numerical approach has been conducted to anticipate the temperature distribution between skin and clothes by the change of air temperature and fabric characteristics including fabric thickness. Several experimental works have been done to understand the thermal insulation effect (If fabrics on a human body by measuring the averaged temperature in the air layer between skin and clothes or by measuring the thermal resistance of fabrics. However, the formal method is inconvenient to measure the temperature distribution in the air layer to evaluate the insulation rate of the clothes on the skin because the real size of the clearance between skin and the clothes is too small to place the temperature sensor, and in the Tatter method the relationship between human body and the fabrics are ignored. However, the numerical method will be very effective and economical way to evaluate the insulation efficiency of clothes when the computational result is in the reliable range. As the result of this study, the temperature change in the sir layer between skin and clothes was linear to the fabric thickness and this result coincides with many previous experimental results. Moreover, it is possible to predict the optimum fabric thickness for the best thermal insulation in the air layer between skin and clothes.

• Steel and Composite Structures
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• 제23권3호
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• pp.251-261
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• 2017

In this paper, thermal effect on the vibration and stability of initially stressed sandwich plates with functionally graded material (FGM) face sheets is analyzed. Material properties of FGM face sheet are graded continuously in the thickness direction. The variation of FGM properties assumes a simple power law distribution in terms of the volume fractions of the constituents. The governing equations of arbitrarily initially-stressed sandwich plates including the effects of transverse shear deformation and rotary inertia are derived. The initial stress is taken to be a combination of a uniaxial extensional stress and a pure bending stress in the examples. The eigenvalue problems are formed to study the vibration and buckling characteristics of simple supported initially stressed FGM/metal/FGM plates. The effects of volume fraction index, temperature rise, initial stress and layer thickness of metal on the natural frequencies and buckling loads are investigated. The results reveal that the volume fraction index, initial stresses and layer thickness of metal have significant influence on the vibration and stability of sandwich plates with FGM face sheets.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1537-1540
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• 2003

MEMS technology with micro scale is complete system utilized as the sensor. micro electro device. The metallization of MEMS is very important to transfer the power operating the sensor and signal induced from sensor part. But in the MEMS structures local stress concentration and deformation is often happened by geometrical shape and different constraint on the metallization. Therefore. this paper studies the effect of supporting type and thickness ratio about thin film thickness of the substrate thickness for the residual stress variation caused by thermal load in the multi-layer thin film. Specimens were made from materials such as Al, Au and Cu and uniform thermal load was applied, repeatedly. The residual stress was measured by FEA and nano-indentation using AFM. Generally, the specimen made of Al induced the large residual stress and the 1st layer made of Al reduced the residual stress about half percent than 2nd layer. Specimen made of Cu and Au being the lower thermal expansion coefficient induce the minimum residual stress. Similarly the lowest indentation length was measured in the Au_Cu specimen by nano-indentation.

• Steel and Composite Structures
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• 제27권3호
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• pp.311-325
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• 2018

This article presents the bending analysis of FGM rectangular plates resting on non-uniform elastic foundations in thermal environment. Theoretical formulations are based on a recently developed refined shear deformation theory. The displacement field of the present theory is chosen based on nonlinear variations in the in-plane displacements through the thickness of the plate. The present theory satisfies the free transverse shear stress conditions on the top and bottom surfaces of the plate without using shear correction factor. Unlike the conventional trigonometric shear deformation theory, the present refined shear deformation theory contains only four unknowns as against five in case of other shear deformation theories. The material properties of the functionally graded plates are assumed to vary continuously through the thickness, according to a simple power law distribution of the volume fraction of the constituents. The elastic foundation is modeled as non-uniform foundation. The results of the shear deformation theories are compared together. Numerical examples cover the effects of the gradient index, plate aspect ratio, side-to-thickness ratio and elastic foundation parameters on the thermo-mechanical behavior of functionally graded plates. Numerical results show that the present theory can archive accuracy comparable to the existing higher order shear deformation theories that contain more number of unknowns.

• 한국염색가공학회지
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• 제26권4호
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• pp.347-352
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• 2014

Film thickness dependent nanostructure evolution by a post annealing was investigated in poly (3-hexylthiophene):phenyl-C61-butyric acid methyl ester(P3HT:PCBM) films for organic solar cells which were fabricated by dichlorobenzene(DCB) solvent. In case of a 70nm thin film, the thermal annealing process affected to slight increment of the P3HT crystals in the surface region. On the other hand, large number of small sized P3HT crystals near the surface region was formed in the 200nm thick film. The solar cell devices showed the 3% power conversion efficiency(PCE) in 1:0.65 and 1:1 ratio(by weight) of P3HT and PCBM in 70nm and 200nm thickness conditions, respectively. Despite to the similar PCE, the short circuit current Jsc was different in 70nm and 200nm devices, which was related to the different nanostructure of P3HT:PCBM after thermal annealing.