• 전기학회논문지
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• 제59권3호
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• pp.609-613
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• 2010

In this paper, we optimized and simulated the heatsink of 75W LED module for street lighting and evaluated the optical properties with the manufactured heatsink. the structure of LED package make simple as chip and heatslug and thermal flow is analyzed by using the FEM(Finite Element Method) with CFdesign V10. Also, we measured the temperature of heatsink and evaluated the optical properties with infrared thermal image camera and integrated sphere system for luminous flux in $1\;[m^3]$ box. As results, Heatsink optimized in 3 mm pin thickness, 6 mm base thickness and 16 number of pin count by using Heatsink-designer and got the results which is the temperature of $47.37\;[^{\circ}C]$ and thermal resistance of $0.48407\;[W/^{\circ}C]$. In thermal flow simulation, the temperature of heatsink decreased from $51.54\;[^{\circ}C]$ to $51.51\;[^{\circ}C]$ and the temperature of heatsink by the time in real measurement decreased from $47.03\;[^{\circ}C]$ to $46.87\;[^{\circ}C]$. Moreover, we improve 0.68 % in the decreased ratio of the luminous flux.

• 한국추진공학회:학술대회논문집
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• 한국추진공학회 2006년도 제26회 춘계학술대회논문집
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• pp.45-49
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• 2006

탄소/페놀릭 복합재료가 높은 온도에서 열분해 되는 현상을 연구하기 위하여 열중량분석기(TGA)가 이용되었다. 높은 온도와 다양한 하중조건에서 운용되는 고체 추진기관의 열방호 시스템으로 적합한 재료를 분석하고 개발하는데 연구목적이 있다. 실제 연소조건과 유사한 온도 상승속도를 고려하기 위하여 열분해 특성상수 값은 1000 K/min인 경우로 예측된 값을 FEM 해석코드 자료로 활용하였다. 온도 분포는 실험 결과 값과 같은 거동을 보였으며 열분해 깊이는 ${\pm}1mm$ 이내에서 해석 결과와 잘 일치 하였다.

• 한국원자력학회:학술대회논문집
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• 한국원자력학회 1996년도 춘계학술발표회논문집(2)
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• pp.95-101
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• 1996

In this paper, the steady 2-dimensional model for a long horizontal line with different end temperatures undergoing natural convection at very high Rayleigh number is proposed to numerically investigate the heat transfer and flow characteristics. The dimensionless governing equations are solved by using SIMPLE (Semi-Implicit Method for Pressure Linked Equations) algorithm which is developed using control volumes and staggered grids. The numerical results are verified by comparison with the operating PWR test data. The analysis focuses on the effects of variation of the heat transfer rates at the pipe surface, the thermal conductivities of the pipe material and the thickness of the pipe wall on the thermal stratification. The results show that the heat transfer rate at the pipe surface is the controlling parameter. A significant reduction and disappearance of thermal stratification phenomenon is observed at the Biot number of 5.0$\times$10$^{-2}$. The results also show that the increment of the thermal conductivity and thickness of the wall weakens the thermal stratification and somewhat reduces azimuthal temperature gradient in the pipe wall. Those effects are however minor, when compared with those due to the variation of the heat transfer rates at the surface of the pipe wall.

• 전기학회논문지
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• 제57권5호
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• pp.803-807
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• 2008

A making process of DSC(dye sensitized solar cell) was presented. In general, Photo electrodes of DSC was made by using colloid paste of nano $TiO_2$ and processing of Doctor-blade printing and high temperature sintering for porous structure. These methods lead to cracks on $TiO_2$ surface and ununiform of $TiO_2$ thickness. This phenomenon is one factor that makes low efficiency to cells. After $TiO_2$ printing on TCO glass, a physical vibration was adapted for reducing ununiform of $TiO_2$ thickness. And a thermal treatment at low temperature(under $75^{\circ}C$) was adapted for reducing cracks on $TiO_2$ surface. In this paper, we have designed and manufactured an ultrasonic circuit (100W, frequency and duty variable) and a thermal equipment. Then, we have optimized forcing time, frequency and duty of ultrasonic irradiation and thermal heating for surface treatment of photo-electrode of DSC. In I-V characteristic test of DSC, ultrasonic and thermal treated DSC shows 19% improved its efficiency against monolithic DSC. And it shows stability of light-harvesting from drastically change of light irradiation test.

• 비파괴검사학회지
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• 제34권1호
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• pp.10-17
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• 2014

A 3D model based on the finite element method (FEM) was built to simulate the infrared thermography (IRT) inspection process. Thermal contrast is an important parameter in IRT and was proven to be a function of defect parameters. Parametric studies were conducted on internal defects with different depths, thicknesses, and orientations. Thermal contrast evolution profiles with respect to the time of the defect and host material were obtained through numerical simulation. The thermal contrast decreased with defect depth and slightly increased with defect thickness. Different orientations of thin defects were detected with IRT, but doing so for thick defects was difficult. These thermal contrast variations with the defect depth, thickness, and orientation can help in optimizing the experimental process and interpretation of data from IRT.

• Journal of Welding and Joining
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• 제16권4호
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Transactions on Electrical and Electronic Materials
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• 제9권2호
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• pp.47-51
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• 2008

In this paper, thermal stability of Nickel silicide formed on p-type silicon wafer using Ni-V alloy film was studied. As compared with pure Ni, Ni-V shows better thermal stability. The addition of Vanadium suppresses the phase transition of NiSi to $NiSi_2$ effectively. Ni-V single structure shows the best thermal stability compared with the other Ni-silicide using TiN and Co/TiN capping layers. To enhance the thermal stability up to $650^{\circ}C$ and find out the optimal thickness of Ni silicide, different thickness of Ni-V was also investigated in this work.

• 한국추진공학회지
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• 제13권6호
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• pp.17-23
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• 2009

정확한 추력 및 비추력 특성을 파악하기 위하여 액체로켓엔진용 연소기에 추가적으로 임시 노즐확장부를 장착함에 있어, 그 열/구조적 건전성을 파악하였다. 이 열/구조적 건전성은 재질 및 차폐막(TBC)의 두께 효과를 살펴봄으로써 검토하였다. TBC가 없는 경우에는 열/구조적 건전성을 유지할 수 없음을 파악할 수 있었다. TBC의 두께에 따라서 노즐확장부 벽면에서의 최대온도는 많이 감소하였다. 노즐확장부를 steel로 제작하는 경우에는 TBC를 적용해야만 연소시험동안 확장부의 열/구조적 건전성이 보장될 것으로 예상된다.

• 한국의류학회지
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• 제15권4호
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• pp.367-372
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• 1991

In this study, we discussed about the factors effected upon the initial maximum value of heat flux ($q_{max}$). Thermal conductivity, thermal transmittance and surface air cavity of wool fabrics were examind and their correlation to the $q_{max}$ was studied. The factors were examined which had an effect upon the $q_{max}$ of an objective measure of warm/cool feeling. It was simulated by Thermo-Labo apparatures. We selected twenty sorts of pure wool woven fabrics for men's fall -winter cloth (all Wool). The conclusions are as follows; 1. There was not a certain correlation between the $q_{max}$ and the thermal conductivity of wool fabric. 2. When the fabrics touched on the copper plates, the thickness of wool fabric had a negative correlation to the $q_{max}$. The thermal transmittance had a positive correlation. Both of them had a good correlation to the $q_{max}$. 3. As a major factor, the thickness of fabric effected on the $q_{max}$.

• Advances in nano research
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• 제7권1호
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• pp.25-38
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• 2019

This research is aimed at studying the asymmetric thermal buckling of porous functionally graded (FG) annular nanoplates resting on an elastic substrate which are made of two different sets of porous distribution, based on nonlocal elasticity theory. Porosity-dependent properties of inhomogeneous nanoplates are supposed to vary through the thickness direction and are defined via a modified power law function in which the porosities with even and uneven type are approximated. In this model, three types of thermal loading, i.e., uniform temperature rise, linear temperature distribution and heat conduction across the thickness direction are considered. Based on Hamilton's principle and the adjacent equilibrium criterion, the stability equations of nanoporous annular plates on elastic substrate are obtained. Afterwards, an analytical solution procedure is established to achieve the critical buckling temperatures of annular nanoplates with porosities under different loading conditions. Detailed numerical studies are performed to demonstrate the influences of the porosity volume fraction, various thermal loading, material gradation, nonlocal parameter for higher modes, elastic substrate coefficients and geometrical dimensions on the critical buckling temperatures of a nanoporous annular plate. Also, it is discussed that because of present of thermal moment at the boundary conditions, porous nanoplate with simply supported boundary condition doesn't buckle.