• International Journal of Fluid Machinery and Systems
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• v.2 no.1
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• pp.55-60
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• 2009

The present study investigated temperature and thermal stress distributions in a film cooling system with normal injection cooling flow. 3D-numerical simulations using the FEM commercial code ANSYS were conducted to calculate distributions of temperature and thermal stresses. In the simulations, the surface boundary conditions used the surface heat transfer coefficients and adiabatic wall temperature which were converted from the Sherwood numbers and impermeable wall effectiveness obtained from previous mass transfer experiments. As a result, the temperature gradients, in contrast to the adiabatic wall temperature, were generated by conduction between the hot and cold regions in the film cooling system. The gradient magnitudes were about 10~20K in the y-axis (spanwise) direction and about 50~60K in the x-axis (streamwise) direction. The high thermal stresses resulting from this temperature distribution appeared in the side regions of holes. These locations were similar to those of thermal cracks in actual gas turbines. Thus, this thermal analysis can apply to a thermal design of film cooling holes to prevent or reduce thermal stresses.

• Structural Engineering and Mechanics
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• v.22 no.3
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• pp.331-349
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• 2006

The stresses and deflections in a laminated rectangular plate under thermal vibration are determined by using the moving least squares differential quadrature (MLSDQ) method based on the first order shear deformation theory. The weighting coefficients used in MLSDQ approximation are obtained through a fast computation of the MLS shape functions and their partial derivatives. By using this method, the governing differential equations are transformed into sets of linear homogeneous algebraic equations in terms of the displacement components at each discrete point. Boundary conditions are implemented through discrete grid points by constraining displacements, bending moments and rotations of the plate. Solving this set of algebraic equations yields the displacement components. Then substituting these displacements into the constitutive equation, we obtain the stresses. The approximate solutions for stress and deflection of laminated plate with cross layer under thermal load are obtained. Numerical results show that the MLSDQ method provides rapidly convergent and accurate solutions for calculating the stresses and deflections in a multi-layered plate of cross ply laminate subjected to thermal vibration of sinusoidal temperature including shear deformation with a few grid points.

• Journal of the Korea Concrete Institute
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• v.13 no.3
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• pp.228-236
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• 2001

Even though numerous researches have been performed for the prediction of thermal stresses in mass concrete structures by both analytical and experimental means, the limitations exist for both approaches. In analytical approach, the fundamental limitation is derived from the difficulty of predicting concrete properties such as modulus of elasticity, coefficient of thermal expansion, etc.. In experimental approach, there are many uncertainties related to in-situ conditions, because a majority of researches have focused on measuring thermal stresses in actual and simulated structures. In this research, an experimental device measuring thermal stresses directly in a laboratory setting is developed. The equipment is located in a temperature chamber that follows the temperature history previously obtained from temperature distribution analysis. Thermal strains are measured continuously by a strain gauge in the device and the corresponding thermal stresses are calculated simply by force equilibrium condition. For the verification of the developed device, a traditional experiment measuring thermal strains from embedded strain gauges is performed simultaneously. The results show that the thermal strain values measured by the newly developed device agree well with the results from the benchmark experiment.

• Progress in Superconductivity
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• v.11 no.1
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• pp.52-56
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• 2009

Temperature distributions and thermal stresses were calculated and analyzed to investigate the effect of the artificial holes to the transient behaviors of the superconductors which was cooled in liquid nitrogen. Three dimensional finite element method was used to calculated the transient temperature and thermal stresses in the superconductors. The cooling speed of the superconductors with holes is faster than those without holes. Because the thermal stresses calculated in the superconductors can be relaxed by the distributed holes, the volume of the peak tensile stress decreases during the cooling in liquid nitrogen. If optimal metal, which can maintain the relaxation of thermal stresses, is used to fill and reinforce the artificial holes, the probability of failure of the superconductors may be decreased by the decrease of volume of peak tensile stress.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.12 s.255
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• pp.1543-1550
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• 2006

Since the performance of joints usually determines the structural efficiency of composite structures, an extensive knowledge of the behavior of adhesive joints and the related effect on joint strength is essential for design purposes. In this study, the torque capacity of adhesive joints was predicted using the combined thermal and mechanical analyses when the adherend was a composite tube. A finite element analysis was performed to evaluate residual thermal stresses developed in the joint, and mechanical s stresses in the adhesive were calculated including both the nonlinear adhesive behavior and the behavior of composite tubes. Three different joint failure modes were considered to predict joint failure: interfacial failure, adhesive bulk failure, and adherend failure. The influence of the composite adherend stacking angle on the residual thermal stresses was investigated, and how the residual thermal stresses affect the joint strength was also discussed. Finally, the predicted results were compared with experimental results available in literature.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.4 s.235
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• pp.526-533
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• 2005

Reliability problem in inkjet printhead, one of MEMS devices, is also very important. To eject an ink drop, the temperature of heater must be high so that ink contacting with surface reaches above $280^{o}C$ on the instant. Its heater is embedded in the thin multi-layer in which several materials are deposited. MEMS processes are the main sources of residual stresses development. Residual stress is one of the factors reducing the reliability of MEMS devices. We measured residual stresses of single layers that consist of multilayer. FE analysis is performed using design of experiment(DOE). Transient analysis for heat transfer is performed to get a temperature distribution. And then static analysis is performed with the temperature distribution obtained by heat transfer analysis and the measured residual stresses to get a stress distribution in the structure. Although the residual stress is bigger than thermal stress, thermal stress is more influential on fatigue life.

• Journal of Power System Engineering
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• v.5 no.2
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• pp.36-42
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• 2001

This paper deals with finite element analyses of residual stresses causing popping up which are induced in micromachining processes of a microaccelerometer sensors. The paddle of the micro accelerometer sensor is designed symmetric with respect to the direction of the beam. After heating the tunnel gap up to 100 degree and get it through the cooling process and the additional beam up to 80 degree and get it through the cooling process. We learn the thermal internal stresses of each shape and compare the results with each other, after heating the tunnel gap up to 400 degree during the Pt deposition process. Finally we find the optimal shape which is able to minimize the internal stresses of microaccelerometer sensor. We want to seek after the real cause of this pop up phenomenon and diminish this by change manufacturing processes of microaccelerometer sensor by electrostatic force.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2007.04a
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• pp.265-270
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• 2007

According to previous research, welding-induced residual stresses in steel structures can significantly affect the fatigue behaviour. Usually, high tensile residual stresses up to the yield strength are conservatively assumed at the weld toes. This conservative assumption can result in misleading fatigue assessments. Thee welding-induced residual stresses need be known in advance for a reliable fatigue assessment, which becomes possible to an increasing extent by numerical welding simulation. In this study, a fatigue Analysis technique for steel structures with welding induced residual stress is presented. First, We calculate the history of temperature according with welding process. Secondly, residual stress with a welding thermal history was evaluated by non-linear thermal stress analysis and lastly, fatigue strength is estimated with modified Goodman equation which can consider the effect of mean stress level.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Proceedings of the Korea Concrete Institute Conference
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• 2001.11a
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• pp.363-368
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• 2001

Abutments in Kumdang bridge are massive concrete structures of which total height is l0m, length is 30m, and width is 7m. Therefore, there is every probability that early age thermal cracking such as hydration heat occur. We measure heat of hydration, strains of rebar, and stresses of concrete abutment during construction. Using analysis of measuring data, we examine thermal stresses, and make use of results as method which control thermal cracking. Finally, we develope thermal stress analysis program which have pre/post processor to be easy of accessing and the usefulness of that is estimated through comparison of results.