• Title/Summary/Keyword: Thermal stress

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A Study on the Analysis for Development of a Deflector Type Miniature Ball Screw (초소형 디플렉터 타입 볼스크류 개발을 위한 해석에 관한 연구)

  • Lee, Choon-Man;Moon, Sung-Ho;Lee, Young-Hun;Kim, Jun-Hwan
    • Journal of the Korean Society for Precision Engineering
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    • v.33 no.12
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    • pp.979-984
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    • 2016
  • Recently, ball screws have been used in machine tools, robot parts, and medical instruments. The demand for ball screws of high precision and reduced size is increasing because of the growth of high value-added industries. Three types of ball screws are typically used: deflector type, end-cap type, and tube type. They are also classified from C0 to C9 according to the precision level. A deflector type ball screw can reduce the variation of rotational torque and the size of the nut of the ball screw is minimized. To ensure the reliable design of ball screws, it is important to perform a structural analysis. The purpose of this study is to perform a stability evaluation through analysis of a deflector type miniature ball screw for weapon systems. The analysis is performed through Finite Elements Method (FEM) simulation to predict characteristics such as deformation, stress, and thermal effects. The interference between the shaft and the deflector for smooth rotation are also studied. Based on the results of the analysis, the development of the deflector type miniature ball screw for weapon systems is performed.

Variation of Rock Properties in Acidic Solution and Loading Condition (산성수 침수 및 하중 조건에서의 암석물성변화 연구)

  • Chung, Jae Hong;Park, Seung Hun;Lee, Seung Jun;Yu, Seungwon;Lee, Woo Hee;Kwon, Sangki
    • Tunnel and Underground Space
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    • v.26 no.3
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    • pp.154-165
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    • 2016
  • This paper presents experimental results to investigate the affects of acidic solution under loading condition on rock properties. In the experiment, the variations of various rock properties including effective porosity, thermal conductivity, and etc were investigated with different pHs of solution and magnitudes of loading. The results show that the rock property change was increased with low pH under loading. It was predicted that chemical reaction rate would be increased in low pH. Below the crack initiation stress of the rock specimen, the variation of rock property change was reduced with increased loading. It could be explained with the reduced chemical reaction area by the compressional loading if there is no crack generation.

Fabrication and Characterization of InGaN/GaN LED structures grown on selectively wet-etched porous GaN template layer

  • Beck, Seol;Cho, Yong-Hoon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.124-124
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    • 2010
  • Much interest has been focused on InGaN-based materials and their quantum structures due to their optoelectronics applications such as light emitting diode (LED) and photovoltaic devices, because of its high thermal conductivity, high optical efficiency, and direct wide band gap, in spite of their high density of threading dislocations. Build-in internal field-induced quantum-confined Stark effect in InGaN/GaN quantum well LED structures results in a spatial separation of electrons and holes, which leads to a reduction of radiative recombination rate. Therefore, many growth techniques have been developed by utilizing lateral over-growth mode or by inserting additional layers such as patterned layer and superlattices for reducing threading dislocations and internal fields. In this work, we investigated various characteristics of InGaN multiple quantum wells (MQWs) LED structures grown on selectively wet-etched porous (SWEP) GaN template layer and compared with those grown on non-porous GaN template layer over c-plane sapphire substrates. From the surface morphology measured by atomic force microscope, high resolution X-ray diffraction analysis, low temperature photoluminescence (PL) and PL excitation measurements, good structural and optical properties were observed on both LED structures. However, InGaN MQWs LED structures grown on SWEP GaN template layer show relatively low In composition, thin well width, and blue shift of PL spectra on MQW emission. These results were explained by rough surface of template layer, reduction of residual compressive stress, and less piezoelectric field on MQWs by utilizing SWEP GaN template layer. Better electrical properties were also observed for InGaN MQWs on SWEP GaN template layer, specially at reverse operating condition for I-V measurements.

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The Study for Cell Morphology with Gas Cocktail in Microcellular Foaming Process (초미세 발포 공법 시 가스 혼합에 따른 셀 형상 연구)

  • Cha Sung Woon;Yoon Jae Dong;Lee Yoon Sung;Kim Hak Bin
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.6 s.171
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    • pp.168-174
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    • 2005
  • Nowadays, the companies use polymer materials for many purposes fur they have many advantages. The costs of these materials take up too high a proportion of the overall cost of products that use these materials as their major material. It is advantage for polymer industries to reduce these costs. The microcellular foaming process was developed in the early 1980s to solve this problem and proved to be quite successful. Microcellular foaming process uses inert gases such as $CO_2,\;N_2$. As these gases solve into polymer matrices, many properties are changed. The microcellular foaming process makes the glass transition temperature of polymers to low, and diminish the residual stress of polymer matrices. Besides, the microcellular foaming process has several merits, impact strength elevation, thermal insulation, noise insulation, and raw material saving etc. In previous research, many facts of microcellular foaming process are founded its characteristics. But previous researcher found the characteristics of microcellular foaming process with pure gas, for example $CO_2,\;N_2$ and so on, they did not found the characteristics of microcellular foaming process with one more gases. If one more gases inlet the resin, the characteristics of microcellular foaming process is changed very amazingly. In this paper, discuss on the characteristics of microcellular foaming process wi th gas cocktail about cell morphology.

Electrochemical Combined-Stress Degradation Test and Failure Mechanisms of EPDM Rubber for Automotive Radiator Hoses (자동차 냉각기 호스용 EPDM 고무의 전기화학적 복합노화시험 및 고장메커니즘)

  • Kwak, Seung Bum;Choi, Nak Sam;Shin, Sei Moon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.37 no.1
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    • pp.1-8
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    • 2013
  • Coolant rubber hoses for automotive radiators can degrade under thermal and mechanical loadings and thus fail owing to the influences of locally formed electricity. In this study, an advanced test method was developed to simulate the failure of a rubber hose. The aging behavior of carbon-black-filled ethylene-propylene diene monomer (EPDM) rubber used as a radiator hose material under a combination of electrochemical stresses and tensile strain was analyzed. The changing behaviors of the current and the resistance as a function of the aging time were analyzed in consideration of the tensile strain, voltage, and aging temperature. Sectioned specimens clarified the failure mechanisms of the aged skin layer under the combined electrochemical stresses.

The effect of thermo-mechanical fatigue on the retentive force and dimensional changes in polyetheretherketone clasps with different thickness and undercut

  • Guleryuz, Aysegul;Korkmaz, Cumhur;Sener, Ayse;Tas, Mehmet Ozan
    • The Journal of Advanced Prosthodontics
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    • v.13 no.5
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    • pp.304-315
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    • 2021
  • PURPOSE. Esthetic expectations have increased the use of polyetheretherketone (PEEK) clasps as alternatives to Cr-Co in removable partial dentures (RPDs). The objective of this study was to evaluate the retentive force and dimensional change of clasps with different thickness and undercut made from PEEK by the thermo-mechanical fatigue. MATERIALS AND METHODS. PEEK clasps (N = 48) with thicknesses of 1 or 1.50 mm and 48 premolar monolithic zirconia crowns with undercuts of 0.25 mm or 0.50 mm were fabricated. Samples are divided into four groups (C1-C4) and were subjected to 7200 thermal aging cycles (at 5 - 55℃). The changes in the retentive force and dimensions of the clasps were measured by micro-stress testing and micro-CT devices from five measurement points (M1 - M5). One-way ANOVA, paired t-test, two-way repeated ANOVA, and post-hoc tests were used to analyze the data (P < .05). RESULTS. The retentive forces of C1, C2, C3, and C4 groups in initial and final test were found to be 4.389-3.388 N, 4.67 - 3.396 N, 5.161 - 4.096 N, 5.459 - 4.141 N, respectively. The effects of retentive force of all PEEK clasps groups were significant decreased. Thermo-mechanical cycles caused significant dimensional changes at points with M2, M4, and M5, and abraded the clasp corners and increased the distance between the ends of the clasp, resulting in reduced retentive forces (P* = .016, P* = .042, P < .001, respectively). CONCLUSION. Thermo-mechanical aging decreases the retentive forces in PEEK clasps. Increasing the thickness and undercut amount of clasps decreases the amount of dimensional change. The values measured after aging are within the clinically acceptable limits.

Evaluation of Bonding Properties of Epoxy Solder Joints by High Temperature Aging Test (고온 시효 시험에 따른 Epoxy 솔더 접합부의 접합 특성 평가)

  • Kang, Min-Soo;Kim, Do-Seok;Shin, Young-Eui
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.1
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    • pp.6-12
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    • 2019
  • Bonding properties of epoxy-containing solder joints were investigated by a high temperature aging test. Specimens were prepared by bonding an R3216 standard chip resistor to an OSP-finished PCB by a reflow process with two basic types of solder (SAC305 & Sn58Bi) pastes and two epoxy-solder (SAC305+epoxy & Sn58Bi+epoxy) pastes. In all epoxy solder joints, an epoxy fillet was formed in the hardened epoxy, lying around the outer edge of the solder joint, between the chip and the Cu pad. In order to analyze the bonding characteristics of solder joints at high temperatures, a high-temperature aging test at $150^{\circ}C$ was carried out for 14 days (336 h). After aging, the intermetallic compound $Cu_6Sn_5$ was found to have formed in the solder joint on the Cu pad, and the shear stress on the conventional solder joint was reduced by a significant amount. The reason that the shear force did not decrease much, even though in epoxy solder, was thatbecause epoxy hardened at the outer edge of the supported solder joints. Using epoxy solder, strong bonding behavior can be ensured due to this resistance to shear force, even in metallurgical changes such as those where intermetallic compounds form at solder joints.

Research Trends for Improvement of NBIS Instability in Amorphous In-Ga-ZnO Based Thin-Film Transistors (비정질 인듐-갈륨-아연 산화물 기반 박막 트랜지스터의 NBIS 불안정성 개선을 위한 연구동향)

  • Yoon, Geonju;Park, Jinsu;Kim, Jaemin;Cho, Jaehyun;Bae, Sangwoo;Kim, Jinseok;Kim, Hyun-Hoo;Yi, Junsin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.5
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    • pp.371-375
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    • 2019
  • Developing a thin-film transistor with characteristics such as a large area, high mobility, and high reliability are key elements required for the next generation on displays. In this paper, we have investigated the research trends related to improving the reliability of oxide-semiconductor-based thin-film transistors, which are the primary focus of study in the field of optical displays. It has been reported that thermal treatment in a high-pressure oxygen atmosphere reduces the threshold voltage shift from -7.1 V to -1.9 V under NBIS. Additionally, a device with a $SiO_2/Si_3N_4$ dual-structure has a lower threshold voltage (-0.82 V) under NBIS than a single-gate-insulator-based device (-11.6 V). The dual channel structure with different oxygen partial pressures was also confirmed to have a stable threshold voltage under NBIS. These can be considered for further study to improve the NBIS problem.

Thermal and light impacts on the early growth stages of the kelp Saccharina angustissima (Laminariales, Phaeophyceae)

  • Augyte, Simona;Yarish, Charles;Neefus, Christopher D.
    • ALGAE
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    • v.34 no.2
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    • pp.153-162
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    • 2019
  • Anthropogenic disturbances, including coastal habitat modification and climate change are threatening the stability of kelp beds, one of the most diverse and productive marine ecosystems. To test the effect of temperature and irradiance on the microscopic gametophyte and juvenile sporophyte stages of the rare kelp, Saccharina angustissima, from Casco Bay, Maine, USA, we carried out two sets of experiments using a temperature gradient table. The first set of experiments combined temperatures between $7-18^{\circ}C$ with irradiance at 20, 40, and $80{\mu}mol\;photons\;m^{-2}\;s^{-1}$. The second set combined temperatures of $3-13^{\circ}C$ with irradiance of 10, 100, and $200{\mu}mol\;photons\;m^{-2}\;s^{-1}$. Over two separate 4-week trials, in 2014 and again in 2015, we monitored gametogenesis, the early growth stages of the gametophytes, and early sporophyte development of this kelp. Gametophytes grew best at temperatures of $8-13^{\circ}C$ at the lowest irradiance of $10-{\mu}mol\;photons\;m^{-2}\;s^{-1}$. Light had a significant effect on both male and female gametophyte growth only at the higher temperatures. Temperatures of $8-15^{\circ}C$ and irradiance levels of $10-100{\mu}mol\;photons\;m^{-2}\;s^{-1}$ were conditions for the highest sporophyte growth. Sporophyte and male gametophyte growth was reduced at both temperature extremes-the hottest and coldest temperatures tested. S. angustissima is a unique kelp species known only from a very narrow geographic region along the coast of Maine, USA. The coupling of global warming with high light intensity effects might pose stress on the early life-history stages of this kelp, although, as an intertidal species, it could also be better adapted to temperature and light extremes than its subtidal counterpart, Saccharina latissima.

Study on the Degradaion Behavior of Acrylonitrile Rubber(NBR) O-ring by Intermittent CSR and Time-Temperature Superposition Principle (간헐 압축응력완화 시험법과 시간-온도 중첩 이론을 이용한 NBR 오링의 노화 거동 분석 연구)

  • Lee, Jin Hyok;Bae, Jong Woo;Choi, Myung Chan;Yun, Yu Mi;Kim, Wonho;Park, Sung Han;Jo, Nam-Ju
    • Journal of the Korean Society of Propulsion Engineers
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    • v.23 no.1
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    • pp.46-51
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    • 2019
  • Intermittent CSR testing was used to investigate the degradation of a NBR O-ring, and also the prediction of its life-time. An intermittent CSR jig was designed taking into consideration the O-ring's environment under use. Degradation of O-rings by thermal aging was observed between $40^{\circ}C$ and $120^{\circ}C$. O-rings showed non-linear degradation behavior under $80^{\circ}C$. At 20% of failure condition, predicted life-times were 32.5 years by Arrhenius plot and 22.6 years by WLF plot.