• Nuclear Engineering and Technology
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• v.54 no.5
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• pp.1541-1548
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• 2022

The thermal conductivity of uranium oxide (UO₂) containing pores and grain boundaries is investigated using continuum-level simulations based on the finite-difference method in two and three dimensions. Steady-state heat conduction is solved on microstructures generated from the phase-field model of the porous polycrystal to calculate the effective thermal conductivity of the domain. The effects of porosity, pore size, and grain size on the effective thermal conductivity of UO₂ are quantified. Using simulation results, a new empirical model is developed to predict the effective thermal conductivity of porous polycrystalline UO₂ fuel as a function of porosity and grain size.

• Journal of Astronomy and Space Sciences
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• v.16 no.2
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• pp.177-190
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• 1999

An absorbed heat-flux method for ground simulation of on-orbit thermal environment of satellite is addressed in this paper. For satellite ground test, high vacuum and extremely low temperature of deep space are achieved by space simulation chamber, while spatial environmental heating is simulated by employing the absorbed heat-flux method. The methodology is explained in detail with test requirement and setup implemented on a satellite. Developed heat-load control system is presented with an adjusted PID-control logic and the system schematic realized is shown. A practical and successful application of the heat simulation method to KOMPSAT(Korea Multi-purpose Satellite)thermal environmental test is demonstrated, finally.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.48-51
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• 1995

We have developed the three dimensional mesh generator for three dimensional process simulation using the FEM(Finite Element Method). Tetrahedron element construct the presented three dimensional mesh, which is suitable for the simulation of three dimensional behavior of the LOCOS. The simulation of thermal oxidation is one of the problem in scale downed semiconductor processes. As three dimensional simulators use the huge size of the memory, we use the efficient method that generates the new nodes inside the growing oxide and removes the nodes nearby the SiO2/Si interface in silicon. The resented three dimensional mesh generator was designed to be used in various process simulations, for instance thermal oxidation, silicidation, nitridation, ion implantation, diffusion, and so on.

• Transactions of Materials Processing
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• v.15 no.1 s.82
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• pp.15-20
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• 2006

The rapid thermal response (RTR) molding is a novel process developed to raise the temperature of mold surface rapidly to the polymer melt temperature prior to the injection stage and then cool rapidly to the ejection temperature. The resulting filling process is achieved inside a hot mold cavity by prohibiting formation of frozen layer so as to enable thin wall injection molding without filling difficulty. The present work covers flow simulation of thin wall injection molding using the RTR molding process. In order to take into account the effects of thermal boundary conditions of the RTR mold, coupled analysis with transient heat transfer simulation is suggested and compared with conventional isothermal analysis. The proposed coupled simulation approach based on solid elements provides reliable thin wall flow estimation for both the conventional molding and the RTR molding processes.

• Proceedings of the KIEE Conference
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• 1999.07c
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• pp.1114-1116
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• 1999

This paper presents a new algorithm which evaluates production cost and reliability indices under various constraints of the thermal generation system. In order to consider the operational constraints of thermal units effectively, the proposed algorithm is based on Monte Carlo techniques instead of analytical ones which have difficulty in modelling the units with additional constraints. At that point, generating units are modelled into two types, base load units and peaking units. These generating unit models are used in state duration sampling simulation for which approach can readily consider the peaking unit operating cycles and easily calculates frequency-duration indices. The proposed production simulation algorithm is applied to the IEEE Reliability Test System, and performs the production simulation under the given constraints. The results show that the proposed algorithm is accurate, reliable and useful.

• The Journal of Engineering Geology
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• v.11 no.3
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• pp.269-278
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• 2001

We describe the calculation of thermal expansion coefficients of $\alpha$-quartz, muscovite and albite using a MD simulation method. The selection of interatomic potentials is important for the MD calculation, and we used the 2-body interatomic potential function. The coefficients are calculated using a differential operation of the temperature dependence of the lattice constant obtained from the NPT-ensemble molecular dynamics simulation. Reasonable agreement is found between the analytical results and measured data.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.203-207
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• 2002

CSP(Chip Size Packaging) SAW Filter Package에 대해서, 유한요소해석(Finite Element Analysis) 컴퓨터 Simulation 프로그램인 ANSYS를 이용하여 Package의 온도 분포를 해석하였다. 신뢰성(reliability) Test 조건에서 Transient Thermal Simulation을 한 후, 조건을 변화시켜 가면서 Chip 내부 온도가 어떻게 변화하는지 알아보았다. Chip에 1.8 hour 동안 4W의 열원을 주고, 주위는 2$0^{\circ}C$ 자연대류로 놓고 Transient Thermal Simulation한 결과는 약 99$^{\circ}C$로, 허용 가능한 온도인 11$0^{\circ}C$보다 약 11$^{\circ}C$ 낮음을 알 수 있었다. 또한 이는 실험값인 약 95$^{\circ}C$와 유사한 값을 나타내었다.

• International Journal of Air-Conditioning and Refrigeration
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• v.12 no.2
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• pp.61-69
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• 2004

In this study, on-site performance test of an air source heat pump which has a rated capacity of 10 RT is carried out. Since indoor and outdoor air conditions can not be controlled to satisfy the standard test conditions, experiments are done with the inlet air conditions as they exist. To estimate the performance of the heat pump for other conditions, the heat pump is modeled with a small number of characteristic parameters. The values of the parameters are determined from the few measurements measured on-site during steady operation. A simulation program is developed to calculate cooling capacity and power consumption at any other arbitrary operating conditions. The simulation results are in good agreement with the experiment. This study provides a method of an on-site performance diagnosis of an air source heat pump.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.09a
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• pp.9-12
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• 2005

The rapid thermal response (RTR) molding is a novel process developed to raise the temperature of mold surface rapidly to the polymer melt temperature prior to the injection stage and then cool rapidly to the ejection temperature. The resulting filling process is achieved inside a hot mold cavity by prohibiting formation of frozen layer so as to enable thin wall injection molding without filing difficulty. The present work covers flow simulation of thin wall injection molding using the RTR molding process. In order to take into account the effects of thermal boundary conditions of the RTR mold, coupled analysis with transient heat transfer simulation is suggested and compared with conventional isothermal analysis. The proposed coupled simulation approach based on solid elements provides reliable thin wall flow estimation fur both the conventional molding and the RTR molding processes

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.3
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• pp.234-238
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• 2014

Multichip packaging was achieved the best solution to significantly reduce thermal resistance at the same time, to increase luminance intensity in LEDs packaging application. For the packaging, thermal spreading resistance is an important parameter to get influence the total thermal performance of LEDs. In this study, silicon-based multichip light emitting diodes (LEDs) packaged module has been examined for thermal characteristics in several parameters. Compared to the general conventional single LED packaged chip module, multichip LED packaged module has many advantages of low cost, low density, small size, and low thermal resistance. This analyzed module is comprised of multichip LED array, which consists of 32 LED packaged chips with supplement power of 0.2 W at every single chip. To realize the extent of thermal distribution, the computer-aided design model of 6.4 W Si-based multichip LED module was designed and was performed by the simulation basis of actual fabrication flow. The impact of thermal distribution is analyzed in alternative ways both optimizing numbers of fins and the thickness of that heatsink. In addition, a thermal resistance model was designed and derived from analytical theory. The optimum simulation results satisfies the expectations of the design goal and the measurement of IR camera results. tart after striking space key 2 times.