• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.416-423
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• 2004

This paper presents the thermal characteristic analysis of a high-speed horizontal machining center with spindle speed of 50,000rpm and feedrate of 120m/fin. The spindle system is designed based on the built-in motor, angular contact ceramic ball bearings, oil-air lubrication and oil-jacket cooling method. The X-axis and Y-axis feeding systems are composed of the linear motors and linear motion guides, and the Z-axis feeding system is composed of the servo-motor, ball screw and linear motion guides. The thermal characteristics such as the temperature distribution, temperature rise, thermal deformation and step response, are estimated based on the finite element model of machining center and the heat generation rates of heat sources related to the machine operation conditions. Especially, the thermal time constant assessed from the step response function is introduced as an index of thermal response characteristics.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.5
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• pp.30-37
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• 2004

This paper presents the thermal characteristic analysis of a high-speed horizontal machining center with spindle speed of 50,000rpm and feedrate of 120m／min. The spindle system is designed based on the built-in motor, angular contact ceramic ball bearings, oil-air lubrication and oil-jacket cooling method. The X-axis and Y-axis feeding systems are composed of the linear motors and linear motion guides, and the Z-axis feeding system is composed of the servo-motor, ball screw and linear motion guides. The thermal characteristics such as the temperature distribution, temperature rise, thermal deformation and step response, are estimated based on the finite element model of machining center and the heat generation rates of heat sources related to the machine operation conditions. Especially, the thermal time constant assessed from the step response function is introduced as an index of thermal response characteristics.

• 한국전기화학회:학술대회논문집
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• 2001.11a
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• pp.145-161
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• 2001

Novel characterization of thermal properties of a battery has been introduced by defining its frequency-dependent thermal impedance function. Thermal impedance function can be approximated as a thermal impedance spectrum by analyzing experimental temperature transient which is related to the thermal impedance function through Laplace transformation. In order to obtain temperature transient, a process has been devised to generate external heat pulse with heating wire and to measure the response of battery. This process is used to study several commercial Li-ion batteries of cylindrical type. The thermal impedance measurements have been performed using potentionstat/galvanostate controlled digital signal processor, which is more commonly available than flow-meter usually applied for thermal property measurements. Thermal impedance spectra obtained for batteries produced by different manufactures are found to differ considerably. Comparison of spectra at different states of charge indicates independence of thermal impedance on charging state of battery. It is shown that thermal impedance spectrum can be used to obtain simultaneously thermal capacity and thermal conductivity of battery by non-linear complex least-square fit of the spectrum to thermal impedance model. Obtained data is used to simulate a response of the battery to internal heating during discharge. It is found that temperature inside the battery is by one-third larger that on its surface. This observation has to be considered to prevent damage by overheating.

• Journal of Welding and Joining
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• v.21 no.6
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• pp.46-54
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• 2003

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

• Journal of Welding and Joining
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• v.15 no.6
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• pp.105-115
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• 1997

A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

• Journal of computational fluids engineering
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• v.20 no.3
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• pp.87-93
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• 2015

In this study, a numerical analysis was performed to simulate the thermal-hydraulic response of the secondary side of a steam generator(SG) model equipped with an orifice-type SG outlet flow restrictor to a main steam line break(MSLB) at a pressurized water reactor(PWR) plant. The SG analysis model includes the SG upper steam space and the part of the main steam pipe between the SG outlet and the broken pipe end. By comparing the numerical calculation results for the present SG model to those obtained for a simple SG model having no flow restrictor, the effects of the flow restrictor on the thermal-hydraulic response of SG to the MSLB were investigated.

• Journal of the Korean Ceramic Society
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• v.47 no.5
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• pp.365-372
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• 2010

This paper was to evaluate the influence of kiln process parameter(kiln angle, kiln rotating speed) of lightweight aggregate using waste glass and bottom ash with industrial by-products on thermal conductivity, density, water absorption, fracture load and porosity by response surface analysis. In the results of surface plot and contour plot, it has verified that kiln residence time of lightweight aggregate increase as kiln angle and rotating speed decreases. For this reason, pore size and quantity tend to increase by active reaction of forming agent. It seems to be that increase in pore size and quantity have caused decreasing density, fracture load and thermal conductivity, and increasing water absorption. In conclusion, optimization of kiln process parameter on thermal conductivity, density, water absorption, fracture load and porosity by response surface analysis are kiln angle 2.4646%, kiln rotating speed 40.7089 rpm.

• Geomechanics and Engineering
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• v.6 no.1
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• pp.79-98
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• 2014

This paper presents an experimental and numerical study on the evaluation of a thermal response test using a precast high-strength concrete (PHC) energy pile and a closed vertical system with W-type ground heat exchangers (GHEs). Field thermal response tests (TRTs) were conducted on a PHC energy pile and on a general vertical GHE installed in a multiple layered soil ground. The equivalent ground thermal conductivity was determined by using the results from TRTs. A simple analytical solution is suggested in this research to derive an equivalent ground thermal conductivity of the multilayered soils for vertically buried GHEs. The PHC energy pile and general vertical system were numerically modeled using a three dimensional finite element method to compare the results with TRTs'. Borehole thermal resistance values were also obtained from the numerical results, and they were compared with various analytical solutions. Additionally, the effect of ground thermal conductivity on the borehole thermal resistance was analyzed.

• Proceedings of the SAREK Conference
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• 2008.06a
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• pp.776-781
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• 2008

A ground heat exchanger in a GSHP system is an important unit that determines the thermal performance of a system and its initial cost. The Size and performance of this heat exchanger is highly dependent on the thermal properties. A proper design requires certain site-specific parameters, most importantly the ground effective thermal conductivity, the borehole thermal resistance and the undisturbed ground temperature. This paper is part of a research project aiming at constructing a database of these site-specific properties, especially ground effective thermal conductivity. The objective was to develop and evaluation method, and to provide this knowledge to design engineers. To achieve these goals, thermal response tests were conducted using a testing device at nearly 150 locations in Korea. The in-situ thermal response is the temperature development over time when a known heating load imposed, e.g. by circulating a heat carrier fluid through the test exchangers. The line-source model was then applied to the response test data because of its simplicity. From the data analysis, the range of ground effective thermal conductivity at various sites is $1.5{\sim}4.0\;W$/mK. The results also show that the ground effective thermal conductivity varies with grouting materials as well as regional geological conditions and groundwater flow.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.14 no.1
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• pp.1-9
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• 2002

The thermal response of electronic components during infrared reflow soldering is studied by a two-dimensional numerical model. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated. Parametric study is also performed to determine the thermal response of electronic components to various conditions such as conveyor velocities, exhaust velocities and emissivities. The results of this study can be used in selecting the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly stresses.