• 전기학회논문지
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• 제59권11호
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• pp.2038-2042
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• 2010

In this paper, we confirmed the thermal & optical properties for improving the heat transfer coefficient by changing the via hole size and in FR4 PCB with the same area. Osram 1W power LED Package (Golden Dragon) was used and the K-factor which is relative constant between LED junction temperature and forward bias was measured with power source meter(KEITHLEY 2430) to measure the thermal resistance from PCB configuration. As results, thermal resistance in metal PCB came out to the lowest as $26 [^{\circ}C/W]$ and thermal resistance in FR4 PCB without via-holes emerged as the highest as $69 [^{\circ}C/W]$. However thermal resistance of FR4 PCB could have decreased until $32[^{\circ}C/W]$ in 0.6 mm by using the via hole. Also, the luminous flux could have improved, too.

• 한국세라믹학회지
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• 제30권9호
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• pp.747-753
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• 1993

The investigation was carried out to study the behaviors of the pore size and porosity, the mechanical strength, the resistance to thermal spallings and slag attacks according to particle sizes of starting raw materials in porous high Alumina ceramics. This porous ceramics have been used in processing of the clean steel by the blowing of the inert gas. The required properties in the practice are the suitable pores size, the sharp pores distribution for a uniform blowing of the gas, the strong corrosion resistance to slags and molten metals and the resistance to thermal spalling. The optimized properties in porous high alumina ceramics of the specimen No. 3 was found to be the very low slag intrusion and the superior resistance to thermal spalling because of the suitable pore size of 2.5${\mu}{\textrm}{m}$, the porosity of 30% and the high sinterability.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2000년도 추계학술대회논문집B
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• pp.291-296
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• 2000

Usually the contact between fin collar and tube surface for fin-tube heat exchanger is secured by mechanical expansion of the tubes. The objective of the present study is to develop a method of measuring the thermal contact resistance between fin collar and tube surface for fin-tube heat exchanger. Also an experimental work has been performed to evaluate the thermal contact resistance, and a rigorous numerical analysis has been employed to calculate the contact resistance from the measured data. The experiments have been conducted fur the fin-tube heat exchangers with the tube of outer diameters 7 and 9.52 mm.

• 한국분말재료학회지
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• 제5권2호
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• pp.139-144
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• 1998

We have evaluated the role of Ag additions on the strength, fracture toughness, elastic modulus and resistance to thermal shock of $YBa_2Cu_3O_{7-x}$(YBCO) superconductor. Addition of 10 vol.% Ag improved strength and fracture toughness, whereas, decreased elastic modulus of YBCO. In addition, YBCO-Ag composites improved resistance to thermal shock probably due to enhanced strength, fracture toughness and thermal conductivity as a result of Ag addition. It is to be noted that YBCO-Ag made by mixing with $AgNO_3$ solution showed slightly higher strength, fracture toughness and resistance to thermal shock, compared to that made by mixing with metallic Ag powder. These improvements are believed to be due to the microstructure of more finely and uniformly distributed Ag particles.

• Corrosion Science and Technology
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• 제15권6호
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• pp.259-264
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• 2016

With a specially designed electrochemical cell, the changes in impedance behavior for Inconel 600 and aluminide diffusion coatings under molten sulfate film with thermal cycles (from $800^{\circ}C$ to $350^{\circ}C$) were monitored with electrochemical impedance measurements. It was found that corrosion resistance for both materials increased with lower temperatures. At the same time, the state of molten salt was also monitored successfully by measuring the changes in impedance at high frequency, which generally represents the resistance of molten salt itself. After two thermal cycles, both Inconel 600 and aluminide diffusion coatings showed excellent corrosion resistance. The results from SEM observation and EDS analysis correlated well with the results obtained by electrochemical impedance measurements. It is concluded that electrochemical impedance is very useful for monitoring the corrosion resistance of materials under molten salt film conditions even with thermal cycles.

• Steel and Composite Structures
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• 제29권5호
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• pp.591-602
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• 2018

This research presents an investigation on the thermal buckling resistance of FGM plates having parabolic-concave thickness variation exposed to uniform and gradient temperature change. An analytical formulation is derived and the governing differential equation of thermal stability is solved numerically using finite difference method. A specific function of thickness variation is introduced where it controls the parabolic variation intensity of the thickness without changing the original material volume. The results indicated that the loss ratio in buckling resistance is the same for any gradient temperature profile. Influencing geometrical and material parameters on the loss ratio in the thermal resistance buckling are investigated which may help in design guidelines of such complex structures.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.189-1-190-1
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• 2008

A high temperature superconducting(HTS) power cable is available for high capacity current in normal condition. But resistance was appeared to operate unbalance load by thermal current characteristic. This characteristic of HTS power cable used to design for unstated condition. And than, It used to understand and analyze characteristic of power cable thermal and critical current. This study appeared that quench resistance reason from shield and former current rise to superconductor(SC) current. The resistance of SC occurred that the cable temperature rise to fault current after decreased critical current. The quench resistance of SC increased in temperature or decreased in critical current. So the quench resistance of SC correlated with resistance of both shield and former current. It need to sufficiently influenced the parameters of HTS cable design.

• 조명전기설비학회논문지
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• 제25권12호
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• pp.34-41
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• 2011

In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

• International Journal of Internet, Broadcasting and Communication
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• 제7권2호
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• pp.161-167
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• 2015

The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.

• International Journal of Human Ecology
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• 제3권1호
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• pp.55-72
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• 2002

The purpose of this study was to evaluate the thermal resistance of pesticideprotective clothing and to investigate its subjective wear performance. Three different nonwoven fabrics, which provide barrier properties against water and pesticide, were used to manufacture the experimental clothing: spunbonded nonwoven (SB), spunbonded/meltblown/spunbonded nonwoven (SM), and spunlaced nonwoven (SL). The thermal insulation values of the experimental clothing were measured with a thermal manikin, and other wear trials were performed on human subjects in a climate chamber at $28^{\circ}C$, with 70% R.H. and air movement at less than 0.15m/s. Our results found that the thermal resistance was lower in the SB experimental clothing than in the others; that the mean skin temperature of subjects who wore the experimental clothing made with SL was significantly lower than that of subjects who wore the SB and SM clothing; and that the microclimate temperature and humidity with SB were significantly higher than that of the others. Overall, the experimental clothing made with SL was more comfortable than the others in terms of subjective wear sensations.