• International Journal of Quality Innovation
• /
• 제2권2호
• /
• pp.69-92
• /
• 2001

The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.79-84
• /
• 2002

The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.

• 한국군사과학기술학회지
• /
• 제13권4호
• /
• pp.542-550
• /
• 2010

Cooled infrared detector is widely used as the core part in a variety of the thermal imaging systems. For the selection of the highly reliable cooled infrared detector with good performance, it is necessary for us to possess the characterization methods of the well defined performance index of cooled infrared detector. In this paper, various performance index of the cooled infrared detector including reliability as well as the optical and cooling performance of cooled infrared detector are defined and their characterization methods will be investigated and implemented systematically.

• 한국전기전자재료학회논문지
• /
• 제33권2호
• /
• pp.88-92
• /
• 2020

Thermal effects in bulk and SOI FinFETs are briefly reviewed herein. Different techniques to measure these thermal effects are studied in detail. Self-heating effects show a strong dependency on geometrical parameters of the device, thereby affecting the reliability and performance of FinFETs. Mobility degradation leads to 7% higher current in bulk FinFETs than in SOI FinFETs. The lower thermal conductivity of SiO₂ and higher current densities due to a reduction in device dimensions are the potential reasons behind this degradation. A comparison of both bulk and SOI FinFETs shows that the thermal effects are more dominant in bulk FinFETs as they dissipate more heat because of their lower lattice temperature. However, these thermal effects can be minimized by integrating 2D materials along with high thermal conductive dielectrics into the FinFET device structure.

• 한국전산유체공학회:학술대회논문집
• /
• 한국전산유체공학회 2009년 추계학술대회논문집
• /
• pp.135-144
• /
• 2009

In this study, the heat transfer and fluid flow characteristics of a condenser for a refrigerator are analyzed with the numerical method. The main objective of the study is to obtain basic data in order to develop a new type of condenser focused on an influence of thermal resistance of air side and thermal contact resistance on the heat transfer performance. The CFD technique was used for whole study, and experiments were performed in order to verify the reliability of the numerical analysis and predict the thermal contact resistance. In this study, a heat exchanger sample was made of a part of condenser to make the experimental and numerical analysis simple and efficient. Water was used for the inner working fluid of the heat exchanger, and an experimental apparatus was composed concisely. A heat exchanger sample of tube type was used to verify the reliability of numerical analysis, and a heat exchanger of fin and tube type was used to predict the ratio of thermal contact resistance to the overall thermal resistance.

• 한국전산유체공학회지
• /
• 제15권1호
• /
• pp.46-55
• /
• 2010

In this study, the heat transfer and fluid flow characteristics of a condenser for a refrigerator are analyzed with the numerical method. The main objective of the study is to obtain basic data in order to develop a new type of condenser focused on an influence of thermal resistance of air side and thermal contact resistance on the heat transfer performance. The CFD technique was used for whole study, and experiments were performed in order to verify the reliability of the numerical analysis and predict the thermal contact resistance. In this study, a heat exchanger sample was made of a part of condenser to make the experimental and numerical analysis simple and efficient. Water was used for the inner working fluid of the heat exchanger, and an experimental apparatus was composed concisely. A heat exchanger sample of tube type was used to verify the reliability of numerical analysis, and a heat exchanger of fin and tube type was used to predict the ratio of thermal contact resistance to the overall thermal resistance.

• 품질경영학회지
• /
• 제43권3호
• /
• pp.253-272
• /
• 2015

Purpose: The purpose of this study is to enhance the reliability of quality inspection by standardize the fineness test method of the thermal insulator of military textiles Methods: We have measured the thermal insulator of military textiles by microscope with three different ways and the effectiveness of their difference were analyzed by one-way layout design. Results: We have suggest the standardized the fineness test method of the thermal insulator of military textiles through advanced research. As a result we have verified hollow ratio of heat insulating fiber affect fineness test methods. The fineness test method for the thermal insulator applied with different methods following hollow ratio. We have verified that when the hollow ratio over 90%, the fineness of the thermal insulator measured from fiber-length, if it has over 80%, the cross-section length of hollow and if it has less 80%, the cross-section area of hollow is applied, respectively. Conclusion: This study indicated that the test method of fineness shows high reliability. Heat insulating fibers which have high evenness shows narrow variations(5/% or less, only CV 25%) irrespectively under different testing equipment or institute. Based ons the results, we have suggest the standardization of test methods for fineness by microscope method and produced the registration of Group Standard in Korean Standards Association.

• 폴리머
• /
• 제33권5호
• /
• pp.446-451
• /
• 2009

신뢰성 평가 시험법인 RS M 0042에 따라, 열화시간 경과에 따른 선형저밀도 폴리에틸렌 파이프의 신뢰성 평가를 수행하였다. 열화시간이 증가함에 따라, 인장강도는 250일 열화시점까지 비례적으로 증가하였고, 경도는 비교적 미소한 증가를 보였으며, 연신율은 점진적으로 감소하는 경향을 보였다. 이러한 결과는 열화시간이 증가함에 따른, 결정화도의 증가와 열산화에 의한 가교밀도의 증가, 사슬 전단 및 사슬 운동성의 감소 등에 기인한 것으로 판단된다. 장기정수압시험 결과는 초기의 연성파괴에서 차후 취성파괴로 전환되는 시점이 존재함을 확인하였다. 산화유도시간 측정은 선형저밀도폴리에틸렌 파이프의 열산화 정도를 관찰하기 위해 도입되었다. 측정 결과는 250일 이후 선형저밀도폴리에틸렌 파이프에 첨가된 산화방지제가 거의 고갈되었음을 보여준다. $100^{\circ}C$ 열화 조건에서 산화방지제의 잔존량을 계산할 수 있는 실험식을 열화시간의 함수로 표현하여 제안하였다. 적외선분광분석 결과는 열화된 선형저밀도폴리에틸렌 파이프 표면상에 카르보닐 및 하드록실 관능기가 증가하였음을 보여준다. 이는 선형저밀도폴리에틸렌 표면의 탄화수소 그룹의 산화가 국부적으로 발생하였음을 나타낸다.

• 동력기계공학회지
• /
• 제19권5호
• /
• pp.93-98
• /
• 2015

Nuclear power plants has a number of valves, which are operating at a high temperature-high pressure and radiation environment conditions. Nevertheless, it is important to maintain the reliability of the valves to ensure safe operation of the nuclear power plant. However, the aging of the valves by increasing of years of plant operation and the system transients due to the sudden load change are working the failures of the reliability of the valve. In this paper, we evaluate experimentally the performance change according to the thermal aging of the valve. Results show that the valve stem and the actuator leakages were enlarged by the thermal aging.

• 한국산업융합학회 논문집
• /
• 제23권3호
• /
• pp.427-431
• /
• 2020

In this Study, as the structure of IT module for smart phone display becomes thin to catch up with slim product trend, the reliability of display module is on the rise as a issue for product design. Especially, almost part of cellular phone should undergo thermal dissipation test. thus many manufacturers have considered design guide line using CAE and simulation for more effective usage of limited resources on the market. This test simulates the case when cellular phone slips through user's fingers while he is talking on the phone. This paper studies a thermal simulation of display module in smart phone. This design for reliability improvements are suggested on the basis of the results of FVM Analysis and display of IT module and smart phone design.