• 마이크로전자및패키징학회지
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• 제15권2호
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• pp.7-15
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• 2008

본 논문에서는 ACF를 이용한 CCM용 COF 어셈블리의 실장 기술을 연구하고 COF 어셈블리의 신뢰성 분석을 수행하였다. 열팽창계수, 모듈러스, 유리전이온도 등 경화 후 ACF의 열-기계적 물성들을 분석하였으며, ACF의 경화거동 결과를 바탕으로 COF 접합공정 온도 및 시간을 최적화하였으며, 도전입자의 변형 관찰 및 전기적 접촉 저항 측정을 통해 본딩 압력에 대한 최적화를 수행하였다. 또한 ACF 물질 특성이 COF어셈블리의 신뢰성에 미치는 영향을 알아보기 위해 열-싸이클 시험, 고온 유지 시험, 고온고습 시험을 수행하였다. 신뢰성 시험 수행 후 ACF를 이용한 COF 어셈블리의 신뢰성에 가장문제가 되고 있는 점은 열-싸이클 신뢰성 시험에서 나타난 ACF joint의 접촉 저항 증가 문제였고, 이는 ACF 자체의 열-기계적 물성과 밀접한 관계가 있음을 확인하였다.

• 한국자동차공학회논문집
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• 제12권2호
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• pp.54-61
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• 2004

The engine-out flow is highly transient and hot, and may place tremendous thermal and inertial loads on a closed-coupled catalyst. Therefore, time-dependent and detailed flow and thermal field simulation may be crucial. The aim of this study is to develop combined chemical reaction and multi-dimensional fluid dynamic mathematical model and to study the effect of unsteady pulsating thermal and flow characteristics on thermal reliability of closed-coupled catalyst. The effect of cell density on the conversion performance under real running condition is also investigated. Unlike previous studies, the present study focuses on coupling between the problems of pulsating flow pattern and catalyst thermal response and conversion efficiency. The results are expressed in terms of temporal evolution of flow, pollutant and temperature distribution as well as transient characteristics of conversion efficiency. Fundamental understanding of the flow and thermal phenomena of closed-coupled catalyst under real running condition is presented. It is shown that instants of significantly low values of flow uniformity and conversion efficiency exist during exhaust blowdown and the temporal varaition of flow uniformity is very similar in pattern to one of conversion efficiency. It is also found that the location of hot spot in monolith is directly affected by transient flow pattern in closed-coupled catalyst.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.630-633
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and BGA solder joint s failure. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. A model based on plastic-strain rate such as the Coffin-Manson Fatigue Model is utilized in this study. The effects of random variables such as frequency, maximum temperature, and temperature variations on the failure probability of the BGA solder joint are systematically investigated by using a failure probability model with the first order reliability method(FORM).

• 한국전기전자재료학회논문지
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• 제22권8호
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• pp.625-631
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• 2009

In this thesis, lateral thermosonic bonding with ACFs was investigated as a process to make high reliability joints for FPD fabrication. Conditions for thermosonic and thermocompression bonding with ACFs were determined and used to make specimens in a driving test jig for testing of bond reliability by thermal shock. The results showed that thermosonic bonding temperature of $199\;^{\circ}C$ and bonding time of 1s produced bonds with good reliability. Additionally, thermosonic bonding temperature and time were reduced and thermal shock test results compared to this proposed curing condition. It is concluded that theromosonic bonding with ACFs can be effectively applied to reduce bonding temperature and time compared with that of thermocompression bonding.

• 한국해양공학회지
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• 제12권1호
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• pp.58-64
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• 1998

An analysis method for the reliability of ceramic structures subjected to thermal shocks is presented. Flaws with the size of given probability distribution function are assumed to be distributed at random with a certain density per unit volume in the structures. Criterions for crack instability are derived for brittle solids under general thermal stresses. A probabilistic failure model is presented to study the probability of crack instability for brittle solids containing cracks with uncertain size. The reliabilities of brittle structures are evaluated based on the weakest-link hypothesis, which states that a structure fails when the cracks in any differential volume become unstable. A numerical example is given to demonstrate the application of the proposed method.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.678-682
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• 2007

It is conducted that study on corner crack protection for various thermal environment in a flat panel display. Most of the consumer electronics consist of a plastic and a metal structure. And different properties of materials could cause failure of structural reliability due to the various operating temperatures. Especially for front bezel with thin and slender structure, the effect of temperature is significant, and the design for crack protection is crucial for thermal reliability of displays. In this study, it is prescribed the behavior of the front bezel in flat panel display for various operation temperatures and proposed design parameters to ensure the structural reliability of displays.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.954-958
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• 1996

An analysis method for the reliability of ceramic structures subjected to thermal shocks is presented, Flaws with the size of given probability distribution function are assumed to be distributed at random with a certain density per unit volume in the structures. Criterions for crack instability are derived for brittle solids under general thermal stresses. A probabilistic failure model is presented to study the probability of crack instability for blittle solids containing cracks with uncertain crack size. The reliabilities of brittle structures are evaluated based on the weakest-link hypothesis, which states that a structure fails when the cracks in any differential volume become unstable. A numerical example is given to demonstrate the application of the proposed method.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.254-256
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• 2007

In this paper, the effects of the reflow number in the mechanical reliability of flip chip solder joint was investigated by flip chip shear test and thermal shock test. For evaluation mechanical reliability of flip chip, We experiment that specimens were operated 3-times, 6-times, 9-times, 12-times under reflow Process. After shear test and thermal shock test, We measured max shear strength and coming first crack number of thermal cycle. And We observe fracture surface and cross section by using SEM(Scanning Electron Microscope) and optical scope. In the results, the more specimens were operated reflow process, the more decreased maximum shear strength and number of thermal cycle.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.

• 폴리머
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• 제29권5호
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• pp.508-517
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• 2005

가전제품용 플라스틱 재료의 열화 거동과 신뢰성을 고찰하기 위해 열분해에 따른 동역학적 매개변수를 결정하기 위하여 동역학적 열중량 분석기법을 사용하였고, 촉진 열화시험을 수행하였다. 또한, 플라스틱 재료의 내후성을 고찰하고자 제논 아크 광원을 사용하여 촉진 열화시험을 하였고, 가속 열화시험후 시료의 색차를 컬러 아이 3010 색차분석기를 이용하여 측정하였다. 재료는 중량감소율이 증가함에 따라 열분해 활성화 에너지도 증가하는 경향을 보였다. 플라스틱 재료의 열분해에 관한 기술은 Kim-Park법이 가장 효과적인 분석법으로 나타났다. 플라스틱 재료는 빠른 열화를 진행시키는 자외선에 아주 민감하게 반응하였다.