• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1993년도 추계학술대회 논문집
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• pp.187-192
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• 1993

Thermal deformation causes large amount of machine tool errors. In order to compensate for thermal and geometric errors of the machine tool an off-line geometric adaptive control (GAC) scheme was developed. THe GAC method was realized by using a measuring plate made of precision spheres. Error vectors and volumetric errors were measured by the measuring plate. Error compensation models were obtained from error vectors and a kinematic chain of machine tools. Reliability of the GAC system of thermal and geometric errors were confrimed by large amount of experiments.

• Journal of Power Electronics
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• 제15권3호
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• pp.830-840
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• 2015

The H-bridge inverter is the fundamental power cell of the cascaded distribution static synchronous compensator (DSTATCOM). Thus, cell reliability is important to the compensation performance and stability of the overall system. The concept of the power electronics building block (PEBB) is an ideal solution for the power cell design. In this paper, an H-bridge inverter-based “plug and play” HPEBB is introduced into the main circuit and the controller to improve the compensation performance and reliability of the device. The section that discusses the main circuit primarily emphasizes the design of electrical parameters, physical structure, and thermal dissipation. The section that presents the controller part focuses on the principle of complex programmable logic device -based universal controller This section also analyzes typical reliability and anti-interference issues. The function and reliability of HPEBB are verified by experiments that are conducted on an HPEBB test-bed and on a 10 kV/± 10 Mvar DSTATCOM industrial prototype.

• 한국응용과학기술학회지
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• 제26권4호
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• pp.379-384
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• 2009

Epoxy resin based encapsulants are widely used in semiconductor packaging applications. Epoxy resin based encapsulants are often subject to crack or delamination during the reliability test due to the thermal stress caused by high modulus nature of epoxy resins. Epoxy functional siloxanes are often added into epoxy resin to reduce the modulus so that the thermal stress can be reduced. Epoxy functional siloxanes, additives for reduced modulus, were synthesized and added into the curable epoxy resins. The modulus and the coefficient of thermal expansion (CTE) were also measured to investigate the thermal stress and to see whether the epoxy functional siloxane adversely affects the CTE or not. As a result, around 26% to 72% of thermal stress reduction was observed with no adverse effect on CTE.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1994년도 추계학술대회 논문집
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• pp.778-783
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• 1994

In operating automated manufacturing system, the long term stability and reliability of NC machine tools become most critical issues. Especially the machining accuracy is dominated by the thermal deformation of machine tools which remains still unsolved and causes troubles in manufacturing operations. Although researches have been carried out on the thermal behavior of a machine tools to minimize or control the thermal deformation of machine tools, the computer models for an analysis of the thermal behacior in machine tools has yet to appear in the open literature. The object of the paper is to present a method of modeling the thermal behavior of a machine tool. The method will make use of finite elements ad be capable of modeling whole machine structures as well as of heat generation processes in the kinematic system components. And temperature distributions and thermal deformations of a CNC lathe are analyzed using the finite element method and are compared with those measured in practice.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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• pp.922-923
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• 2006

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.

• 한국세라믹학회지
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• 제56권3호
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• pp.233-255
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• 2019

Thermal batteries are reserve batteries with molten salts as an electrolyte, which activates at high temperature. Due to their excellent reliability, long shelf life, and mechanical robustness, thermal batteries are used in military applications. A high-performance cathode for thermal batteries should be considered in terms of its high capacity, high voltage, and high thermal stability. Research progress on cathode materials from the recent decade is reviewed in this article. The major directions of research were surface modification, compounding of existing materials, fabrication of thin film cathode, and development of new materials. In order to develop a high-performance cathode, a proper combination of these research directions is required while considering mass production and cost.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.163-166
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• 2003

The electrothermal simulation of high voltage LIGBT(Lateral Insulated Gate Bipolar Transistor) in thin Silicon on insulator (SOI) and Silicon on sapphire (SOS) for thermal conductivity and sink is performed by means of MEDICI. The finite element simulations demonstrate that the thermal conductivity of the buried oxide is an important parameter for the modeling of the thermal behavior of silicon-on-insulator (SOI) devices. In this paper, using for SOI LIGBT, we simulated electrothermal for device that insulator layer with $SiO_2\;and\;Al_2O_3$ at before and after latch up to measured the thermal conductivity and temperature distribution of whole device and verified that SOI LIGBT with $Al_2O_3$ insulator had good thermal conductivity and reliability

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.208-209
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• 2006

This study presents the thermal stress characteristics of TL porcelain insulators(healthy and ageing) by the accelerating thermal mechanical ageing test with forced temperature gradient. The test temperature gradient is $95^{\circ}C(-35{\sim}60^{\circ}C)$, it was focused to high temperature thermal stress as compared with IEC 60575 standard. There was no a discrimination in the case of healthy aluminous porcelain insulators, dissimilarly in crystoballite insulators according to this test method. It was indicated that the long tenn reliability by thermal stress was conformed reasonably through the conventional accelerating ageing test methods.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.172-173
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• 2007

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The thermal analysis provides valuable information on the semiconductor rating, long-term reliability. In this paper, thermal distribution of the Non Punchthrough(NPT) Insulated Gate Bipolar Transistor has been studied. For analysis of thermal distribution, we obtained experimental and simulation results by using finite element simulator, Ansys and by using photographic infrared thermometer, we compared experimental date with simulation result. and got good agreement. Also this paper provided thermal distribution of IGBT connected to heat sinks. and this results will be good information to design optimal heat sink for IGBT.

• Computers and Concrete
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• 제17권2호
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• pp.173-188
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• 2016

Generally, thermal stress induced by hydration heat causes cracking in mass concrete structures, requiring a thorough control during the construction. The prediction of the thermal stress is currently undertaken by means of numerical analysis despite its lack of reliability due to the properties of concrete varying over time. In this paper, a method for the prediction of thermal stress in concrete structures by adjusting thermal stress measured by a thermal stress device according to the degree of restraint is proposed to improve the prediction accuracy. The ratio of stress in concrete structures to stress under complete restraint is used as the degree of restraint. To consider the history of the degree of restraint, incremental stress is predicted by comparing the degree of restraint and the incremental stress obtained by the thermal stress device. Furthermore, the thermal stresses of wall and foundation predicted by the proposed method are compared to those obtained by numerical analysis. The thermal stresses obtained by the proposed method are similar to those obtained by the analysis for structures with internally as well as externally strong restraint. It is therefore concluded that the prediction of thermal stress for concrete structures with various boundary conditions using the proposed method is suggested to be accurate.