• 제목/요약/키워드: Thermal reliability

검색결과 1,055건 처리시간 0.03초

CVVL BLDC 모터의 열피로 가속시험을 통한 수명보증시험 설계 (A Study on Reliability Compliance Test based on Thermal Fatigue Accelerated Test for CVVL BLDC Motor)

  • 이상훈;박상욱;김민근;선한걸;홍성렬;한만승
    • 한국신뢰성학회지:신뢰성응용연구
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    • 제15권4호
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    • pp.241-247
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    • 2015
  • Purpose : The demand for higher fuel economy vehicles has helped develop fuel-efficient vehicles such as a CVVL called continuous variable valve lift. Existing CVVL has been applying DC type motor to control intake valve, but recently some car parts manufacturers have been developing a BLDC type CVVL motor for improvements of endurance performance. The purpose of this study is to find the potential failure mechanism of the CVVL BLDC moto in early stage of development based on the design properties and design the accelerated life test model. Methods : CVVL BLDC is consist of brushs, coil, magnetic, PCB, bearing and so on. Each component has a latent failure mechanism caused by temperature, humidity, vibration. By analysis result of the failure mechanism, thermal fatigue is the most important factor of a durability of CVVL BLDC motor. So, we designed a new accelerated life test model for guarantee of the CVVL BLDC motor. Results : A crack occurred on via hole in test using the conditions we designed, so we did change the design to avoid this failure. The via hole dimension is changed a little larger, as a result we achieve improvements in reliability of the CVVL BLDC motor. By applying various kinds and extreme level of stresses, we can find the operating limits of products. Conclusion : In thesis, We analyzed the failure mechanism of CVVL BLDC and designed an accelerated life test method to give a guarantee for reliability. Based on the test results, we could improve the reliability of developments by change of design.

에폭시 박막 절연형 버스웨이 시스템의 장기 수명 및 신뢰성 평가에 관한 연구 (Study on the Estimation of Long Life Cycle and Reliability Tests for Epoxy Insulation Busway System)

  • 장동욱;박성희;이강원
    • 한국산학기술학회논문지
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    • 제19권9호
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    • pp.261-268
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    • 2018
  • 전력수요와 부하용량이 증가 되어감에 따라 부하에 전력공급을 위한 간선으로서의 케이블은 설치 시간의 과다와 공간의 제약으로 사용이 제한적이다. 이런 문제를 해결하기 위한 간선 시스템으로 대전류를 효율적으로 공급해 줄 수 있는 버스웨이 시스템의 사용이 증가되고 있으나, 신뢰성의 검증을 위한 시험평가 방법과 그에 대한 결과 제시가 부족한 실정이다. 본 논문에서는 에폭시를 주절연으로 하는 버스웨이 시스템의 신뢰성 검증을 위해서 IEC 61439-6에서 제시된 시험항목이외에 장기 사용성과 신뢰성을 평가할 수 있는 시험항목을 선정하였다. 열 및 전기적 스트레스를 동시에 인가하여 최대한 실사용 상태를 반영한 복합가속열화시험을 실시하였으며, 50년 수명 조건을 충족하도록 열화 조건을 선정하여 버스웨이 시스템의 절연성능 확인시험을 통해 수명을 만족함을 확인하였다. 또한, 버스웨이가 설치되는 온도, 습도 및 부하전류 사용 환경에 대한 적합성 확인에 대한 신뢰성 평가 시험항목으로서 열적 과전류 시험, 침수시험, 냉충격시험, 온도 사이클 시험을 선정하여 실시하였으며, 확인 시험을 통해 시험 전후의 특성 변화와 이상 유무를 검토하였다. 이 결과들로부터 에폭시 절연형 버스웨이 시스템의 평가항목으로서 본 논문에서 제시한 시험항목이 적절하고, 그에 대한 제품의 성능도 우수함을 확인하였다.

NCA 물성에 따른 극미세 피치 COG (Chip on Glass) In, Sn 접합부의 신뢰성 특성평가 (Improvement of Reliability of COG Bonding Using In, Sn Bumps and NCA)

  • 정승민;김영호
    • 마이크로전자및패키징학회지
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    • 제13권2호
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    • pp.21-26
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    • 2006
  • NCA의 물성이 미세피치 Chip on glass (COG) 접합부의 신뢰성에 미치는 영향을 연구하였다. Si 위에 Sn을, 유리기판 위에 In을 열증발 방법으로 증착하고 lift-off 방법을 이용하여 $30{\mu}m$ 피치를 가지는 솔더범프를 형성하였으며 열압착 방법으로 $120^{\circ}C$에서 In 범프와 Sn 범프를 접합하였다. 접합할 때 세 종류의 Non conductive adhesive (NCA)를 적용하였다. 신뢰성은 $0^{\circ}C$$100^{\circ}C$ 사이로 열충격시험을 2000회까지 실시하여 평가하였다. 4단자 저항측정법을 이용하여 접합부의 저항을 측정하였다. 필러의 양이 증가할수록 열충격시험 후 접합부의 저항이 가장 적게 증가하여 신뢰성이 우수하였다. 필러의 양이 증가할수록 NCA의 열팽창이 작아지기 때문이다.

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수치해석에 의한 고속팬용 밀폐구조형 BLDC모터의 열신뢰성 분석 (Thermal Reliability Analysis of BLDC Motor in a High Speed Axial Fan by Numerical Method)

  • 문선애;이재헌
    • 설비공학논문집
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    • 제22권3호
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    • pp.130-138
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    • 2010
  • The thermal reliability of the closed-type BLDC motor for the high speed axial fans is analyzed by a numerical method in this paper. Since the module and the motor part are combined in a closed case, the heat generated from a rotor in the motor and the electronic components in the PCB module can not be effectively removed to the outside. Therefore the module will easily fail by high temperature. The accelerated-life testing was accomplished to formulate the life equation and numerical method is used to predict the inside temperature of the PCB module, which is one of the life equation parameter according to the environment. When the environment temperature of BLDC motor is 21, 35 and 50 $^{\circ}C$, the temperature in the PCB space is predicted as 73.4, 87.5 and 102.4 $^{\circ}C$. Then the life time with the temperature are calculated as 2,239, 863 and 328 hours.

대형공간환기용 축류팬에 사용되는 밀폐형 모터의 열신뢰성 분석 (Thermal Reliability Analysis of a Closed Type Motor in an Axial Fan for the Large Space Ventilation)

  • 이태구;허진혁;문선애;유호선;문승재;이재헌
    • 대한설비공학회:학술대회논문집
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    • 대한설비공학회 2007년도 동계학술발표대회 논문집
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    • pp.494-499
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    • 2007
  • The thermal reliability of the closed-type BLDC motor for the high speed axial fans is analyzed by a numerical method in this dissertation. Since the module and the motor part are combined in a closed case, the heat generated from a rotor in the motor and the electronic components in the PCB module can not be effectively removed to the outside. Therefore the module will easily fail by high temperature. The accelerated-life testing was accomplished to formulate the life equation and numerical method is used to predict the inside temperature of the PCB module, which is one of the life equation parameter according to the environment. The experiment for measuring the surface heat flux of the electronic components is carried out to apply the boundary condition of numerical study. When the environment temperature of BLDC motor is 21, 35 and $50^{\circ}C$, the temperature in the PCB space is predicted as 73.4, 87.5 and $102.4^{\circ}C$. Then the life time with the temperature are calculated as 2,239, 863 and 328.

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소형 수소저장물질 유효열전도도 측정장치의 신뢰성 평가 (Reliability Evaluation of Miniaturized Measurement Cell of Effective Thermal Conductivity for Hydrogen Storage Materials)

  • 이영효;임연호
    • 한국수소및신에너지학회논문집
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    • 제26권5호
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    • pp.431-437
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    • 2015
  • Recently, a miniaturized measurement cell of effective thermal conductivity was developed to evaulate the heat transfer characteristics of hydrogen stroage material in the initial step of its development. In this work, the realiablity issues which can occur from this miniaturization of measurement cell were studied in detail by both experiments and numerical simulation of heat transfer. $LaNi_5$ as a reference was used for the reliability evaluation of the miniaturized measurement cell. Numerical simulations of heat transfer for this measurement system were verified through comparison with the experimental data. Under these reliablity studies, we discuss how to overcome the inherent drawbacks of this miniaturized system in order to achieve the high reliability.

가속수명시험에 의한 고속팬용 밀폐구조형 BLDC 모터의 열신뢰성 분석 (Thermal Reliability Analysis of BLDC Motor in a High Speed Axial Fan by the Accelerated Life Test)

  • 이태구;문종선;유호선;이재헌
    • 설비공학논문집
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    • 제17권12호
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    • pp.1169-1176
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    • 2005
  • In this paper, thermal reliability of a closed type BLDC (Brushless DC) motor for high speed axial fan was analyzed by the accelerated life test. The closed type BLDC (Model No. MB1-8855-J01) motor was controlled by PCB module, which was composed of various electrical components. The failure of the closed type BLDC motor happened in PCB module due to high temperature. Failure mechanism of the closed type BLDC motor appears to be electrolyte dry out of capacitor. The accelerate life test was performed in temperature stress of $85^{\circ}C\;and\;105^{\circ}C$, respectively The failure data from the accelerated life test were analyzed and the life in each stress level was estimated with 960h and 261 h. At last, both life expression according to operating temperature of PCB module and life of the closed type BLBC motor in normal condition $(50^{\circ}C)$ were suggested.

PCB-BOARD의 방열기 발열특성 해석 (Heat Characteristics Analysis of Radiator for PCB-Board)

  • 장성철;권민수;한수민
    • 동력기계공학회지
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    • 제20권6호
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    • pp.20-26
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    • 2016
  • For power electronic devices, the thermal energy density per unit volume has seen a rapid increase in recent years, owing to the miniaturization and dense integration of electronic components, as well as the continuous development in performance and function. This research examined the validity and reliability of a thermal safety model for managing the heating conditions of TRIAC electronic components. Among the electronic components of a PCB, these can be considered as a heat source. Using the model, the heating conditions of TRIAC components were maintained at their design target levels in the process of developing an LMT motor drive board. In addition, the heating characteristics of the entire PCB were analyzed to verify its thermal safety. Finally, the reliability and validity of the thermal safety model for maintaining the heating conditions of the TRIAC electronic elements at adequate levels was verified using a numerical analysis method.

Uncertainty Analysis of Dynamic Thermal Rating of Overhead Transmission Line

  • Zhou, Xing;Wang, Yanling;Zhou, Xiaofeng;Tao, Weihua;Niu, Zhiqiang;Qu, Ailing
    • Journal of Information Processing Systems
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    • 제15권2호
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    • pp.331-343
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    • 2019
  • Dynamic thermal rating of the overhead transmission lines is affected by many uncertain factors. The ambient temperature, wind speed and wind direction are the main sources of uncertainty. Measurement uncertainty is an important parameter to evaluate the reliability of measurement results. This paper presents the uncertainty analysis based on Monte Carlo. On the basis of establishing the mathematical model and setting the probability density function of the input parameter value, the probability density function of the output value is determined by probability distribution random sampling. Through the calculation and analysis of the transient thermal balance equation and the steady- state thermal balance equation, the steady-state current carrying capacity, the transient current carrying capacity, the standard uncertainty and the probability distribution of the minimum and maximum values of the conductor under 95% confidence interval are obtained. The simulation results indicate that Monte Carlo method can decrease the computational complexity, speed up the calculation, and increase the validity and reliability of the uncertainty evaluation.

Through-Silicon Via를 활용한 3D NAND Flash Memory의 전열 어닐링 발열 균일성 개선 (Electro-Thermal Annealing of 3D NAND Flash Memory Using Through-Silicon Via for Improved Heat Distribution)

  • 손영서;이광선;김유진;박준영
    • 한국전기전자재료학회논문지
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    • 제36권1호
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    • pp.23-28
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    • 2023
  • This paper demonstrates a novel NAND flash memory structure and annealing configuration including through-silicon via (TSV) inside the silicon substrate to improve annealing efficiency using an electro-thermal annealing (ETA) technique. Compared with the conventional ETA which utilizes WL-to-WL current flow, the proposed annealing method has a higher annealing temperature as well as more uniform heat distribution, because of thermal isolation on the silicon substrate. In addition, it was found that the annealing temperature is related to the electrical and thermal conductivity of the TSV materials. As a result, it is possible to improve the reliability of NAND flash memory. All the results are discussed based on 3-dimensional (3-D) simulations with the aid of the COMSOL simulator.