• International Journal of Quality Innovation
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• v.2 no.2
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• pp.69-92
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• 2001

The laser-assisted seeding (LAS) process has potential to replace conventional electroless copper plating in Printed Circuit Board (PCB) manufacturing since it combines the steps of laser drilling and plating into one single process. In the LAS process, the single extra LAS step can metallize a microvia. Thus, the process steps can be greatly reduced and the productivity enhanced, but also the high aspect ratio microvias can be metallized. The objectives of this paper are to study the LAS copper thickness within PCB microvias and the thermal reliability of the microvias produced by this process. It was found that results were satisfactory in both the reliability test and also the LAS copper thickness which both comply with IPC standard, the copper thickness produced by the LAS process is sufficient for subsequent electro-plating process. The reliability of the microvias produced by LAS process is acceptable which are free from any voids, corner cracks, and distortion in the plated copper.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.79-84
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• 2002

The bottom-leaded plastic(BLP) packages have attracted substantial attention since its appearance in the electronic industry. Since the solder materials have relatively low creep resistance and are susceptible to low cycle fatigue, the life of the solder joints under the thermal loading is a critical issue for the reliability The represent study established a finite element model for the analysis of the solder joint reliability under thermal cyclic loading. An elasto-plastic constitutive relation was adopted for solder materials in the modeling and analysis. A 28-pin BLP assembly is modeled to investigate the effects of various epoxy molding compound, leadframe materials on solder joint reliability. The fatigue life of solder joint is estimated by the modified Coffin-Hanson equation. The two coefficients in the equation are also determined. A new design for lead is also evaluated by using finite element analysis. Parametric studies have been conducted to investigate the dependence of solder joint fatigue life on various package materials.

• Journal of the Korea Institute of Military Science and Technology
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• v.13 no.4
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• pp.542-550
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• 2010

Cooled infrared detector is widely used as the core part in a variety of the thermal imaging systems. For the selection of the highly reliable cooled infrared detector with good performance, it is necessary for us to possess the characterization methods of the well defined performance index of cooled infrared detector. In this paper, various performance index of the cooled infrared detector including reliability as well as the optical and cooling performance of cooled infrared detector are defined and their characterization methods will be investigated and implemented systematically.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.2
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• pp.88-92
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• 2020

Thermal effects in bulk and SOI FinFETs are briefly reviewed herein. Different techniques to measure these thermal effects are studied in detail. Self-heating effects show a strong dependency on geometrical parameters of the device, thereby affecting the reliability and performance of FinFETs. Mobility degradation leads to 7% higher current in bulk FinFETs than in SOI FinFETs. The lower thermal conductivity of SiO₂ and higher current densities due to a reduction in device dimensions are the potential reasons behind this degradation. A comparison of both bulk and SOI FinFETs shows that the thermal effects are more dominant in bulk FinFETs as they dissipate more heat because of their lower lattice temperature. However, these thermal effects can be minimized by integrating 2D materials along with high thermal conductive dielectrics into the FinFET device structure.

• 한국전산유체공학회:학술대회논문집
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• 2009.11a
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• pp.135-144
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• 2009

In this study, the heat transfer and fluid flow characteristics of a condenser for a refrigerator are analyzed with the numerical method. The main objective of the study is to obtain basic data in order to develop a new type of condenser focused on an influence of thermal resistance of air side and thermal contact resistance on the heat transfer performance. The CFD technique was used for whole study, and experiments were performed in order to verify the reliability of the numerical analysis and predict the thermal contact resistance. In this study, a heat exchanger sample was made of a part of condenser to make the experimental and numerical analysis simple and efficient. Water was used for the inner working fluid of the heat exchanger, and an experimental apparatus was composed concisely. A heat exchanger sample of tube type was used to verify the reliability of numerical analysis, and a heat exchanger of fin and tube type was used to predict the ratio of thermal contact resistance to the overall thermal resistance.

• Journal of computational fluids engineering
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• v.15 no.1
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• pp.46-55
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• 2010

In this study, the heat transfer and fluid flow characteristics of a condenser for a refrigerator are analyzed with the numerical method. The main objective of the study is to obtain basic data in order to develop a new type of condenser focused on an influence of thermal resistance of air side and thermal contact resistance on the heat transfer performance. The CFD technique was used for whole study, and experiments were performed in order to verify the reliability of the numerical analysis and predict the thermal contact resistance. In this study, a heat exchanger sample was made of a part of condenser to make the experimental and numerical analysis simple and efficient. Water was used for the inner working fluid of the heat exchanger, and an experimental apparatus was composed concisely. A heat exchanger sample of tube type was used to verify the reliability of numerical analysis, and a heat exchanger of fin and tube type was used to predict the ratio of thermal contact resistance to the overall thermal resistance.

• Journal of Korean Society for Quality Management
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• v.43 no.3
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• pp.253-272
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• 2015

Purpose: The purpose of this study is to enhance the reliability of quality inspection by standardize the fineness test method of the thermal insulator of military textiles Methods: We have measured the thermal insulator of military textiles by microscope with three different ways and the effectiveness of their difference were analyzed by one-way layout design. Results: We have suggest the standardized the fineness test method of the thermal insulator of military textiles through advanced research. As a result we have verified hollow ratio of heat insulating fiber affect fineness test methods. The fineness test method for the thermal insulator applied with different methods following hollow ratio. We have verified that when the hollow ratio over 90%, the fineness of the thermal insulator measured from fiber-length, if it has over 80%, the cross-section length of hollow and if it has less 80%, the cross-section area of hollow is applied, respectively. Conclusion: This study indicated that the test method of fineness shows high reliability. Heat insulating fibers which have high evenness shows narrow variations(5/% or less, only CV 25%) irrespectively under different testing equipment or institute. Based ons the results, we have suggest the standardization of test methods for fineness by microscope method and produced the registration of Group Standard in Korean Standards Association.

• Polymer(Korea)
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• v.33 no.5
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• pp.446-451
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• 2009

Reliability evaluations of linear low density polyethylene (LLDPE) pipe with respect of thermal exposure time have been investigated in accordance with RS M 0042, which is a reliability standard for polymer pipe. As the thermal exposure time is prolonged, a progressive increase, until 250 days, in tensile strength and a slight increase in hardness are observed, while a proportional decrease in elongation at break is showed. These results can be explained by the increase of crystallinity, followed by the increase of crosslinking density, chain scission and the decrease in chain mobility, due to thermal oxidation as the exposure time increases. Long term hydrostatic pressure test result implies the existence of transition point from ductile to brittle fracture. Oxidation induction time (OIT) test is employed to monitor the thermo-oxidative degradation of LLDPE pipe. This result shows that after the exposure time is 250 days, the depletion of antioxidants added in LLDPE pipe occurs. An empirical equation as function of exposure time, under $100^{\circ}C$ thermal-degradation condition, is proposed to assess the remaining amount of antioxidants owing to thermo-oxidative degradation. Fourier transform infrared spectroscopy results show the increase of carbonyl (-C=O) and hydroxyl (O-H) function groups on the surface of thermally exposed LLDPE pipe. This result suggests that the hydrocarbon groups locally undergo the oxidation on the LLDPE surface due to thermal-degradation.

• Journal of Power System Engineering
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• v.19 no.5
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• pp.93-98
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• 2015

Nuclear power plants has a number of valves, which are operating at a high temperature-high pressure and radiation environment conditions. Nevertheless, it is important to maintain the reliability of the valves to ensure safe operation of the nuclear power plant. However, the aging of the valves by increasing of years of plant operation and the system transients due to the sudden load change are working the failures of the reliability of the valve. In this paper, we evaluate experimentally the performance change according to the thermal aging of the valve. Results show that the valve stem and the actuator leakages were enlarged by the thermal aging.

• Journal of the Korean Society of Industry Convergence
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• v.23 no.3
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• pp.427-431
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• 2020

In this Study, as the structure of IT module for smart phone display becomes thin to catch up with slim product trend, the reliability of display module is on the rise as a issue for product design. Especially, almost part of cellular phone should undergo thermal dissipation test. thus many manufacturers have considered design guide line using CAE and simulation for more effective usage of limited resources on the market. This test simulates the case when cellular phone slips through user's fingers while he is talking on the phone. This paper studies a thermal simulation of display module in smart phone. This design for reliability improvements are suggested on the basis of the results of FVM Analysis and display of IT module and smart phone design.