• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.473-474
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• 2006

We report on the rapid thermal annealing effect on the electrical, optical, and structural properties of IZO transparent conducting oxide films grown by box cathode sputtering (BCS). To investigate structural properties of rapid thermal annealed IZO films in $N_2$ atmosphere as a function of annealing temperature, syncrotron x-ray scattering experiment was carried out. It was shown that the amorphous structure of the IZO films was maintained until $400^{\circ}C$ because ZnO and $In_2O_3$ are immiscible and must undergo phase separation to allow crystallization. In addition, the IZO films grown at different Ar/$O_2$ ratio of 30/1.5 and 30/0 showed different preferred (222) and (440) orientation, respectively, with increase of rapid thermal annealing temperature. The electrical properties of the OLED with rapid thermal annealed IZO anode was degraded as rapid thermal annealing temperature of IZO increased. This indicates the amorphous IZO anode is more beneficial to make high-quality OLEDs.

• Carbon letters
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• v.14 no.1
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• pp.1-13
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• 2013

Carbon nanotubes (CNTs) are increasingly attracting scientific and industrial interest because of their outstanding characteristics, such as a high Young's modulus and tensile strength, low density, and excellent electrical and thermal properties. The incorporation of CNTs into polymer matrices greatly improves the electrical, thermal, and mechanical properties of the materials. Surface modification of CNTs can improve their processibility and dispersion within the composites. This paper aims to review the surface modification of CNTs, processing technologies, and mechanical and electrical properties of CNT-based epoxy composites.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.226-231
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• 2001

The purpose of this paper is to propose the experimental method of thermal properties of Phase Change Materials (PCMs) by using T-history method. As far, in order to measure the heat of fusion and specific heat of PCMs, conventional thermal analysis methods such as DSC and DTA have been used. Because these methods test very small samples, thermal properties of samples are usually different from those of materials consisting of several components. For these reasons, T-history method, the simple measurement method of the heat of fusion and specific heat of PCMs have been performed. In this paper, we investigated the thermal properties of low temperature PCMs(below $0^{\circ}C$) under the charging process by using T-history method. The results are compared to those of DSC method. The T-history method will be useful for selection of the best PCM from lots of candidates and development of new PCMs.

• Korean Journal of Food Science and Technology
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• v.23 no.1
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• pp.57-61
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• 1991

Rheological properties of Tongjinbyeo(Japonica) and Samgangbyeo($J{\times}Indica$) rice starches gelatinized with thermal or alkali solutions were investigated with rotational viscometer(Brabender Viscotron). The two starches showed Bingham pseudoplastics behavior in $4{\sim}8%$ thermal or alkali gelatinized starch solutions. Rheological properties of thermal gelatinized starch solutions were similar between the two varieties. However, alkali gelatinized Samgangbyeo starch solutions showed higher values of yield stress and consistency index than that of Tongjinbyeo starch. The values of pseudoplasticity, yield stress and consistency index were higher in the thermal gelatinized samples than those of in the alkali gelatinized ones.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.5
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• pp.535-540
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• 2015

We propose an enhanced Green's function approach to predict thermal stresses by considering temperature-dependent material properties. We introduce three correction factors for the maximum stress, the time taken to reach maximum stress, and the time required to attain steady state based on the Green's function results for each temperature. The proposed approach considers temperature-dependent material properties using correction factors, which are defined as polynomial expressions with respect to temperatures based on Green's functions, that we obtain from finite-element (FE) analyses at each temperature. We verify the proposed approach by performing detailed FE analyses on thermal transients. The Green's functions predicted by the proposed approach are in good agreement with those obtained from FE analyses for all temperatures. Moreover, the thermal stresses predicted using the proposed approach are also in good agreement with the FE results, and the proposed approach provides better predictions than the conventional Green's function approach using constant, time-independent material properties.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.11
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• pp.539-543
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• 2001

ln this paper, the $Sr_{l-x}Ca_xTiO_3(0\leqx\leq0.2)-based$ grain boundary layer ceramics were fabricated to measure dielectric properties with the sintering temperature and the thermal treatment time. The sintering temperature and time were $1420~15206{\circ}C$, 4hours, and the thermal treatment temperature and time of the specimen were $l150^{\circ}C$, 1, 2, 3hours, respectively. The structural and the dielectric properties were investigated by SEM, X-ray, HP4194A and K6517. The average grain size was increased with increasing the sintering temperature, but it decreased up to 15mo1% with increasing content of Ca. X-ray diffraction analysis results showed that all specimens were the cubic structure, and the main peaks were moved to right and the lattice constant were decreased with increasing content of Ca. The appropriate thermal treatment time and temperature of CuO to obtain dielectric properties of $\varepsilon_r>50000,\; tan \delta<0.05\; and \;\DeltaC<\pm10%$ were 2hrs and $l150^{\circ}C$, respectively.

• Textile Coloration and Finishing
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• v.26 no.3
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• pp.218-229
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• 2014

The wearing comfort of garment is governed by two kinds of characteristics such as moisture and thermal transport properties and mechanical properties of fabrics. The porosity influenced by yarn and fabric structural parameters is known as main factor for wearing comfort of garment related to the moisture and thermal transport properties. This study investigated effect of porosity of composite yarns to the moisture and thermal comfort properties of composite fabrics made of hollow composite DTY and ATY yarns. The theoretical porosity and pore size were inversely proportional to cover factor of fabric, but cover factor was not correlated with experimental pore size. The wicking property of hydrophobic PET filament fabric showed inferior result irrespective of porosity, pore size and cover factor. The drying rate was superior at composite fabrics with high pore size and low cover factor, and pore size was dominant factor for drying property. On the other hand, thermal conductivity of composite fabric was mainly influenced by cover factor and not influenced by porosity. Air permeability was influenced by both porosity and cover factor and was highly increased with increasing porosity and decreasing fabric cover factor.

• Composites Research
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• v.27 no.5
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• pp.196-200
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• 2014

A novel, simple and totally recyclable method has been developed for the synthesis of nontoxic, biocompatible and biodegradable bio-composite films from soy protein and silk protein. Bio films are defined as flexible films prepared from biological materials such as protein. These materials have potential application in medical and food as a packaging material. Their use depends on various parameters such as mechanical (strength and modulus), thermal, among others. In this study, prepare and characterization of bio films made from Soy Protein Isolate (SPI) (matrix) and Silk Fiber (SF) (reinforcement) through solution casting method by the addition of plasticizer and crosslinking agent. The obtained SPI and SPI/SF composites were subsequently subjected to evaluate their mechanical and thermal properties by using Universal Testing Machine and Thermal Gravimetric Analyzer respectively. The tensile testing showed significant improvements in strength with increasing amount of SF content and the % elongation at break of the composites of the SPI/SF was lower than that of the matrix. Though the interfacial bonding was moderate, the improvement in tensile strength and modulus was attributed to the higher tensile properties of the silk fiber.

• Journal of Welding and Joining
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• v.30 no.3
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• pp.32-37
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• 2012

Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

• Korean Journal of Materials Research
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• v.32 no.10
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• pp.403-407
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• 2022

This research investigated the effect of Si addition on the microstructure, mechanical properties, electric and thermal conductivity of as-extruded Al 6013 alloys. As the content of Si increased, the area fraction of the second phase increased. As the Si content increased, the average grain size decreased remarkably, from 182 (no Si addition) to 142 (1.5Si), 78 (3.0Si) and 77 ㎛ (4.5Si) due to dynamic recrystallization by the dispersed second particles in the aluminum matrix during the hot extrusion. As the Si content increased, the yield strength and ultimate tensile strength increased. The maximum values of yield strength and ultimate tensile strength were 224 MPa and 103 MPa for the 6013-4.5Si alloy. As the amount of Si added increased, the electrical and thermal conductivity decreased. The electrical and thermal conductivity of the Al6013-4.5Si alloy were 44.0 % IACS and 165.0 W/mK, respectively. The addition of Si to Al 6013 alloy had a significant effect on its thermal conductivity and mechanical properties.