• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.12
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• pp.1018-1022
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• 2009

In this paper, we proposed GaN trench Static Induction Transistor(SIT). Because The compound semiconductor had superior thermal characteristics, GaN and SiC power devices is next generation power semiconductor devices. We carried out modeling of GaN SIT with 2-D device and process simulator. As a result of modeling, we obtained 340 V breakdown voltage. The channel thickness was 3 urn and the channel doping concentration is $1e17\;cm^{-3}$. And we carried out thermal characteristics, too.

• JSTS:Journal of Semiconductor Technology and Science
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• v.7 no.2
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• pp.88-93
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• 2007

In this paper, a simple and improved noise parameter model of RF MOSFETs is developed and verified. Based on the analytical model of channel thermal noise, closed form expressions for four noise parameters are developed from proposed equivalent small signal circuit. The modeling results show a excellent agreement with the measured data of $0.13{\mu}m$ CMOS devices.

• Proceedings of the KIPE Conference
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• 2010.07a
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• pp.600-601
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• 2010

This paper presents the superheater dynamic modeling and parameter estimation for the thermal plant boiler. The temperature control is closely related to the power plant efficiency and boiler life. The dynamic modeling of the superheater and desuperheater is essentially needed and developed by using the heat balance principle. The simulated model outputs are well matched with the actual ones. It is expected that the proposed model is useful for the temperature controller design.

• Journal of the Semiconductor & Display Technology
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• v.6 no.2 s.19
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• pp.35-40
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• 2007

An integrated material removal model considering thermal, chemical and contact mechanical effects in CMP process is proposed. These effects are highly coupled together in the current modeling effort. The contact mechanics is employed in the model incorporated with the heat transfer and chemical reaction mechanisms. The mechanical abrasion actions happening due to the mechanical contacts between the wafer and abrasive particles in the slurry and between the wafer and pad asperities cause friction and consequently generate heats, which mainly acts as the heat source accelerating chemical reaction(s) between the wafer and slurry chemical(s). The proposed model may be a help in understanding multi-physical interactions in CMP process occurring among the wafer, pad and various consumables such as slurry.

• Journal of Institute of Convergence Technology
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• v.10 no.1
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• pp.37-40
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• 2020

Automotive battery system consists of various components such as battery cells, mechanical structures, cooling system, and control system. Recently, various computational technologies are required to develop an automotive battery system. Physics-based cell modeling is used for designing a new battery cell by conducting optimization of material selection and composition in electrodes. Structural analysis plays an important role in designing a protective system of battery system from mechanical shock and vibration. Thermal modeling is used in development of thermal management system to maintain the temperature of battery cells in safe range. Finally, vehicle simulation is conducted to validate the performance of electric vehicle with the developed battery system.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.4
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• pp.655-664
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• 2009

This paper, Part 1, describes the effective dual-input PSS parameter design procedure for the IEEE Type PSS2A against the Dangjin 612 MVA thermal plant's EX2000 excitation system. The suggested tuning technique used the model-based PSS tuning method and consisted of three steps: 1) generation system modeling; 2) determination of PSS2A model parameters using linear, time-domain transient and 3-phase simultaneous analyses, and 3) field testing and verification, which are described in Part 2. The effective PSS2A model parameters of EX2000 system in the Dangjin T/P #4 were designed according to the suggested procedure, and verified by using three analyses.

• Bulletin of the Korean Space Science Society
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• 2004.10b
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• pp.258-261
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• 2004

Numerical simulations are made to predict the axial force coefficients of a two-stage launch vehicle, and the results are compared with those by wind tunnel tests. It is found that the forebody axial force is not affected by whether the base of the body is modeled or not. Modeling the sting support used in wind tunnel tests reduced the base axial force compared to the results without it. The present calculation shows that the forebody axial forces are underestimated while the base axial forces are overestimated. The total axial force, therefore, compares with the experimental data with better accuracy by cancelling out the errors of opposite signs. Modeling of the sting support in numerical simulations is found to be necessary to get a better agreement with the experiments for both base and overall axial force coefficients.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.30 no.5
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• pp.381-387
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• 2017

Fiber-reinforced composites not only have a direction of thermal expansion coefficient, but also inevitably suffer thermal stress effects due to the difference between the manufacturing process temperature and the actual use temperature. The damage caused by thermal stress is more prominent in the case of thick composite laminates, which are increasingly applied in the aerospace industry, and have a great influence on the mechanical function and fracture strength of the laminates. In this study, the dimensional reduction and thermal stress recovery theory of composite beam structure having high slenderness ratio is introduced and show the efficiency and accuracy of the thermal stress comparison results between the 3-D finite element model and the dimension reduction beam model. Efficient recovery analysis study will be introduced by reconstructing the thermal stress of the composite beam section applied to the thermal environment by constructing the dimensional reduction modeling and recovery relations.

• Journal of Institute of Control, Robotics and Systems
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• v.5 no.4
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• pp.481-488
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• 1999

A thermal model based on the chamber geometry of the industry-standard AST SHS200MA rapid thermal processing system has been developed for the study of thermal uniformity and process repeatability thermal model combines radiation energy transfer directly from the tungsten-halogen lamps and the steady-state thermal conducting equations. Because of the difficulties of solving partial differential equation, calculation of wafer temperature was performed by using finite-difference approximation. The proposed thermal model was verified via titanium silicidation experiments. As a result, we can conclude that the thermal model show good estimation of wafer surface temperature distribution.

• Fire Science and Engineering
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• v.10 no.2
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• pp.28-39
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• 1996

A recently developed electro-thermal simulation methodology is used to analyze the behavior of a PWM(Pulse-Width-Modulated) voltage source inverter which uses IGBT(Insulated Gate Bipolar Transistor) as the switching devices. In the electro-thermal network simulation methdology, the simulator solves for the temperature distribution within the power semiconductor devices(IGBT electro-thermal model), control logic circuitry, the IGBT gate drivers, the thermal network component models for the power silicon chips, package, and heat sinks as well as the current and voltage within the electrical network. The thermal network describes the flow of heat form the chip surface through the package and heat sink and thus determines the evolution of the chip surface temperature used by the power semiconductor device models. The thermal component model for the device silicon chip, packages, and heat sink are developed by discretizing the nonlinear heat diffusion equation and are represented in component from so that the thermal component models for various package and heat sink can be readily connected to on another to form the thermal network.