• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.33 no.6
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• pp.39-44
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• 2005

Due to mismatch of thermal expansion coefficients between aluminum sheet and glass/epoxy sheet, thermal residual stresses generally appear in the FML. These stresses will affect the yield and fatigue strength of the FML. The numerically determined residual stresses in the Fiber-Metal-Laminates(FML) have been compared to the residual stresses measured from the curvature and tensile test methods. These two experimental methods have been developed for assessing the influence of residual stress in FML. Post-stretching process has been applied to remove the thermal residual stress and reverse the stress distribution. After post-stretching process, the residual stress has been measured from experiments. The results obtained show that analytical and experimental data are well agreed. The thermal residual stress can be removed by post-stretching process and it will increase the yield strength of FML.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.361-361
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• 2009

KEPCO High Temperature Superconducting (HTS) cable system rated with $3\Phi$, 22.9kV, 1250A was laid in 2006, and the long term test is in progress. The HTS cable system with the cooling system has been operated below cryogenic temperature. That environment exposes the system to the thermo-mechanical stress due to the significant temperature difference, and the cooling system has moving parts for the forced circulation of the coolant. Therefore the HTS cable system experiences thermal fatigue and moving part such as liquid nitrogen pump need a regular replacement every 5000 hours Building the assessment criterion, the maintenance procedure was established and regular preventive maintenance was done; improvement of the termination structure and the replacement of the bearing of liquid nitrogen pump. Following the proper process, the reliability assessment test including He leakage detection and the stability of flow rate was performed. This paper describes the process and result of the first regular maintenance of KEPCO HTS cable system

• Composites Research
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• v.26 no.5
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• pp.303-308
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• 2013

Carbon fiber (CF) reinforced polypropylene (PP) compositeis was increased to amount consumed. In this study, recycle of composites by recycle times. CF was containing 20%. Mechanical and interfacial propertis of CF/PP was evaluation for number of recycle time. Mechanical assessment of CF/PP was tension, bending, fatigue tension test and izod test method. Interfacial assessment of CF/PP was wettability test and FE-SEM of fracture surface method. Fiber and matrix was changed to recycle time. The more recycle of CF/PP, the more interfacial bonding was decreased. Because fiber and matrix was damaged to thermal damage. And then reinforced CF was shorter than original shape.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• Journal of the Korean institute of surface engineering
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• v.34 no.2
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• pp.161-168
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• 2001

A Thermal Barrier Coating (TBC) can play an important role in protecting parts from harmful environments at high temperatures such as oxidation, corrosion, and wear in order to improve the efficiency of aircraft engines by lowering the surface temperature of the turbine blade. The TBC can increase the life span of the product and improve the operating properties. Therefore, in this study the mechanical and thermal properties of the TBC such as oxidation, fatigue and shock at high temperatures were evaluated. A samples of a bond coat (CoNiCrAlY) produced by the High Velocity Oxygen Fuel (HVOF) and Low Pressure Plasma Spray (LPPS) method were used. The thickness of the HVOF coating layer was approximately $450\mu\textrm{m}$ to 500$\mu\textrm{m}$ and the hardness number of the coating layer was between 350Hv and 400Hv. The thickness of the LPPS coating was about 350$\mu\textrm{m}$ to 400$\mu\textrm{m}$ and the hardness number of the coating was about 370Hv to 420Hv. The X-ray diffraction analysis showed that CoNiCrAlY coating layer of the HVOF and LPPS was composed of the $\beta$and ${\gamma}$phase. After the high temperature oxidation test, the oxide scale with about l0$\mu\textrm{m}$ to 20$\mu\textrm{m}$ thickness appeared at the coating surface on the Al-depleted zone was observed under the oxide scale layer.

• Structural Engineering and Mechanics
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• v.27 no.3
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• pp.277-292
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• 2007

Based on the composite finite element simulation and a series of hydrostatic pressure and burst tests, autofrettage effects on strength and deformation of fiber reinforced pressure vessel with metallic liners have been studied in the paper (autofrettage: during the course of one pressure taking effect, the increasing internal stress in metallic liner can surpass the yielding point and the plastic deformation will happen, which result in that when there is no internal pressure, there are press stress in liner while tensile stress in fiber lamination). By making use of a composite finite element Ansys code and a series of experiments, the autofrettage pressure is determined in order to make the aluminium liner be totally in elastic state, under given hydrostatic test pressure. The stress intensity factors of the longitudinal crack in aluminum liner end under internal pressure and thermal loads have been computed and analyzed before and after the autofrettage processing. Through numerical calculation and experiment investigations, it is found that a correct choice for autofrettage pressure can improve the gas-tightness and fatigue strength of FRP vessel.

• Journal of Korean Society of Environmental Engineers
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• v.39 no.12
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• pp.733-740
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• 2017

'The facilities standards of water supply' issued by the Ministry of Environment in 2004 indicates that expansion joints cannot be used in welding water supply steel pipes. However, their reason is not clear and it is difficult to confirm the stability of the steel pipe for a water supply pipeline. The purpose of this study is to determine whether or not an expansion joint is necessary to improve the stability of water supply in steel pipe through a displacement analysis of the pipework. The test results are as follows. Firstly, it was found that expansion and contraction of the water supply steel pipe (D 2,400 mm) occur repeatedly in 4 cycles per year, and the maximum expansion and contraction amount of the pipe is 13.03 mm in 1.24 km pipelines. Secondly, the thermal stress caused by expansion and contraction of the steel pipe is $13.7{\sim}36.1kgf/cm^2$ according to the burial depth (0~4 m). The main comparison factors to determine the stability of the steel pipe (STWW 400) were the allowable tensile strength and the fatigue limit, which were computed to be $4,100kgf/cm^2$ and $1,840kgf/cm^2$, respectively. Finally, the thermal stress of the steel pipe is very small compared to the allowable tensile stress and fatigue stress. Therefore, thermal stress does not affect the stability of the steel pipe, although the expansion and contraction of the steel pipe occurs by temperature changes. In conclusion, the study demonstrated that expansion joints are not required in water supply steel pipelines.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.12
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• pp.1431-1434
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• 2014

The thermal barrier coating (TBC) applied to a gas turbine can be damaged by repeated thermal fatigue during operation, so an evaluation of its durability is needed. Thermally grown oxide (TGO) is generated inside the TBC in a high-temperature environment. The growth of TGO is known to be the main cause of damage to the TBC. Therefore, the durability of TBC should be evaluated according to the growth of TGO. In this research, Kim et al.'s work on the growth of TGO with aging was used as a basis for finite element analysis. The relationship between stress and aging was derived from the finite element analysis results. The durability of the TBC with aging was evaluated through a comparison between the results of the finite element analysis and a bond strength test.