• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03b
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• pp.42-42
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• 2010

We have characterized the previously undescribed parameters for engineering the electrical properties of single-walled carbon nanotube (SWCNT) films for technological applications. The surface tension of the top coating passivation material and matching coefficients of thermal expansion for the substrate and carbon nanotube network are two crucial parameters for the fabrication of reliable and highly conductive single-walled carbon nanotube network thin films.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.278-278
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• 2010

We have characterized the previously undescribed parameters for engineering the electrical properties of single-walled carbon nanotube (SWCNT) films for technological applications. The surface tension of the top coating passivation material and matching coefficients of thermal expansion for the substrate and carbon nanotube network are two crucial parameters for the fabrication of reliable and highly conductive single-walled carbon nanotube network thin films.

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.1
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• pp.221-243
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• 1997

The objective of this study was to characterize the mechanical properties of $Y_{2}O_{3}$-containing glass infiltrated ceramic core material, which was made by pressureless powder packing method. A pure alumina powder with a grain size of about $4{\mu}m$ was packed without pressure is silicon mold to form a bar shaped sample, and applied PVA solution as a binder. Samples were sinterd at $1350^{\circ}C$ for 1 hour. After cooling, $Y_{2}O_{3}$-containing glass($SiO_{2},\;Y_{2}O_{3},\;B_{2}O_{3},\;Al_{2}O_{3}$, ect) was infiltrated to the sinterd samples at $1300^{\circ}C$ for 2 hours and cooled. Six different proportions $Y_{2}O_{3}$ of were used to know the effect of the mismatch of the thermal expansion coefficient between alumina powder and glass. The samples were ground to $3{\times}3{\times}30$ mm size and polished with $1{\mu}m$ diamond paste. Flexural strength, fracture toughness, hardness and other physical properties were obtained, and the fractured surface was examined with SEM and EPMA. Ten samples of each group were tested and compared with In-Ceram(tm) core materials of same size made in dental laboratory. The results were as follows : 1. The flexural strengths of group 1 and 3 were significantly not different with that of In-Ceram, but other experimental groups were lower than In-Ceram. 2. The shrinkage rate of samples was 0.42% after first firing, and 0.45% after glass infiltration. Total shrinkage rate was 0.87%. 3. After first firing, porosity rate of experimental groups was 50%, compared with 22.25% of In-Ceram. After glass infiltration, porosity rate of experimental groups was 2%, and 1% in In-Ceram. 4. There was no statistical difference in hardness between two materials tested, but in fracture toughness, group 2 and 3 were higher than In-Ceram. 5. The thermal expansion coefficients of experimental groups were varied to $4.51-5.35{\times}10^{-6}/^{\circ}C$ according to glass composition, also the flexural strengths of samples were varied. 6. In a view of SEM, many microparticles about $0.5{\mu}m$ diameter and $4{\mu}m$ diameter were observed in In-Ceram. But in experimental group, the size of most particles was about $4{\mu}m$, and a little microparticles was observed. The results obtained in this study showed that the mismatch of the thermal expansion coefficients between alumina powder and infiltrated glass affect the flexural strength of alumin/glass composite. The $Y_{2}O_{3}$-containing glass infiltrated ceramic core made by powder packing method will takes less time and cost with sufficient flexural strength similar to all ceramic crown made with slip casting technique.

• Journal of the Korean Ceramic Society
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• v.49 no.4
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• pp.301-307
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• 2012

SiAlON glasses are silicates or alumino-silicates, containing Mg, Ca, Y or rare earth (RE) ions as modifiers, in which nitrogen atoms substitute for oxygen atoms in the glass network. These glasses are found as intergranular films and at triple point junctions in silicon nitride ceramics and these grain boundary phases affect their fracture behaviour. This paper provides an overview of the preparation of M-SiAlON glasses and outlines the effects of composition on properties. As nitrogen substitutes for oxygen in SiAlON glasses, increases are observed in glass transition temperatures, viscosities, elastic moduli and microhardness. These property changes are compared with known effects of grain boundary glass chemistry in silicon nitride ceramics. Oxide sintering additives provide conditions for liquid phase sintering, reacting with surface silica on the $Si_3N_4$ particles and some of the nitride to form SiAlON liquid phases which on cooling remain as intergranular glasses. Thermal expansion mismatch between the grain boundary glass and the silicon nitride causes residual stresses in the material which can be determined from bulk SiAlON glass properties. The tensile residual stresses in the glass phase increase with increasing Y:Al ratio and this correlates with increasing fracture toughness as a result of easier debonding at the glass/${\beta}-Si_3N_4$ interface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.2
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• pp.151-157
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• 2023

Integrating dielectric materials into LTCC is a convenient method to increase the integration density in electronic circuits. To enable co-firing of the high-k and low-k dielectric LTCC materials in a multi-material hetero-laminate, the shrinkage characteristics of both materials should be similar. Moreover, thermal expansion mismatch between materials during co-firing should be minimized. The alternating stacking of an LTCC with silica filler and that with calcium-zirconate filler was observed to examine the use of the same glass in different LTCCs to minimize the difference in shrinkage and thermal expansion coefficient. For the LTCC of silica filler with a low dielectric constant and that of calcium zirconate filler with a high dielectric constant, the amount of shrinkage was examined through a thermomechanical analysis, and the predicted appropriate fraction of each filler was applied to green sheets by tape casting. The green sheets of different fillers were alternatingly laminated to the thickness of 500 ㎛. As a result of examining the junction, it was observed through SEM that a complete bonding was achieved by constrained sintering in the structure of 'calcium zirconate 50 vol%-silica 30 vol%-calcium zirconate 50 vol%'.

• Journal of Information Display
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• v.1 no.1
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• pp.14-19
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• 2000

Due to distinct properties of plastic substrates such as poor thermal resistance, non-rigidness and high thermal expansion, it is difficult to fabricate plastic film LCDs by conventional LCD processes. Poor thermal resistance and high thermal expansion of substrates induced deformation of substrates surface, mismatch of thermal expansion between ITO electrodes and substrates resulted in defects in the ITO electrodes during the high temperature process. Defects of ITO electrodes and non-uniform cell gap caused by non-rigid and flexible properties were also observed in the pressuring process. Based on in these observations, we used a newly developed material and fabrication process to prevent deformation of substrates, defects of electrodes and to maintain uniform cell gap. The maximum temperature of the process is limited up to $110^{\circ}C$ and pressure loaded during the process is five times less than conventional one. With these invented processes and materials, we obtained highly reliable Plastic Film STN LCDs whose electro-optical characteristics are better than or equivalent to those of typical glass LCDs.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.35-43
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• 2017

The three-dimensional integrated circuit (3D-IC) is a general trend for the miniaturized and high-performance electronic devices. The through-silicon-via (TSV) is the advanced interconnection method to achieve 3D integration, which uses vertical metal via through silicon substrate. However, the TSV based 3D-IC undergoes severe thermo-mechanical stress due to the CTE (coefficient of thermal expansion) mismatch between via and silicon. The thermo-mechanical stress induces mechanical failure on silicon and silicon-via interface, which reduces the device reliability. In this paper, the thermo-mechanical reliability of TSV based 3D-IC is reviewed in terms of mechanical fracture, heat conduction, and material characteristic. Furthermore, the state of the art via-level and package-level design techniques are introduced to improve the reliability of TSV based 3D-IC.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.68-73
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• 2014

Among through silicon via (TSV) technologies, for replacing Cu filling method, the method of molten solder filling has been proposed to reduce filling cost and filling time. However, because Sn alloy which has a high coefficient of thermal expansion (CTE) than Cu, CTE mismatch between Si and molten solder induced higher thermal stress than Cu filling method. This thermal stress can deteriorate reliability of TSV by forming defects like void, crack and so on. Therefore, we fabricated SiC composite filling material which had a low CTE for reducing thermal stress in TSV. To add SiC nano particles to molten solder, ball-typed SiC clusters, which were formed with Sn powders and SiC nano particles by ball mill process, put into molten Sn and then, nano particle-dispersed SiC composite filling material was produced. In the case of 1 wt.% of SiC particle, the CTE showed a lowest value which was a $14.8ppm/^{\circ}C$ and this value was lower than CTE of Cu. Up to 1 wt.% of SiC particle, Young's modulus increased as wt.% of SiC particle increased. And also, we observed cross-sectioned TSV which was filled with 1 wt.% of SiC particle and we confirmed a possibility of SiC composite material as a TSV filling material.

• Journal of the Korean Ceramic Society
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• v.37 no.3
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• pp.288-293
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• 2000

Effects of contact damage and residual stress for two kinds of dental restorative layered ceramics, porcelain/alumina and porcelain/zirconia bilayers, were observed with Hertzian and Vickers indentation methods. Indentation stress-strain behavior of each material, strength degradation of the coating material, and crack propagation behavior in the coating layer after Vickers indentation were examined by an optical microscope. As a result, porcelain as coating materials showed the classical brittleness. It was inferred that damage and strength in two bilayer system were dependent on thermal expansion mismatch between the coating material and the substrate, which affected the strength degradation. Residual stress resulting from thermal expansion mismtch was formed in the coating layer, and specially in the case of porcelain/zirconia, residual stress was eliminated as coating thickness decreased.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.63-66
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• 2000

This research addresses study on thermal residual stress of a composite patch repair of the edge cracked aluminium panel of aging aircraft. Composite patch repair is an efficient and economical technique to improve the damage tolerance of cracked metallic structures. These are thermal residual stresses due to the mismatch of coefficient of thermal expansion, and these are affected by the curing cycle of patch specimen. In this study, three curing cycles were selected for F.E. analysis. This study features the effect on composite patch and aluminum by thermal residual stress during crack propagation in aluminum plate.