• Journal of Mechanical Science and Technology
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• v.19 no.4
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• pp.1044-1051
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• 2005

The isothermal characteristics of a rectangular parallelepiped sodium heat pipe were inves­tigated for high-temperature applications. The heat pipes was made of stainless steel of which the dimension was $140\;m\;(L)\;{\times}\;95m\;(W)\;{\times}\;46 m\;(H)$ and the thickness of the container was 5 mm. Both inner surfaces of evaporator and condenser were covered with screen meshes to help spread the liquid state working fluid. To provide additional path for the working fluid, a lattice structure covered with screen mesh wick was inserted in the heat pipe. The bottom surface of the heat pipe was heated by an electric heater and the top surface was cooled by circulating coolant. The concern in this study was to enhance the temperature uniformity at the bottom surface of the heat pipe while an uneven heat source up to 900 W was in contact. The temperature distribution over the bottom surface was monitored at more than twenty six locations. It was found that the operating performance of the sodium heat pipe was critically affected by the inner wall temperature of the condenser region where the working fluid may be changed to a solid phase unless the temperature was higher than its melting point. The maximum temperature difference across the bottom surface was observed to be $114^{\circ}C$ for 850 W thermal load and $100^{\circ}C$ coolant inlet temperature. The effects of fill charge ratio, coolant inlet temperature and operating temperature on thermal performance of heat pipe were analyzed and discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.254-254
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• 2011

The memories with nano-particles are very attractive because they are promising candidates for low operating voltage, long retention time and fast program/erase speed. In recent, various nano-floating gate memories with metal-oxide nanocrystals embedded in organic and inorganic layers have been reported. Because of the carrier generation in semiconductor, induced photon pulse enhanced the program/erase speed of memory device. We studied photo-induced electrical properties of these metal-oxide nanocrystal memory devices. At first, 2~10-nm-thick Sn and In metals were deposited by using thermal evaporation onto Si wafer including a channel with $n^+$ poly-Si source/drain in which the length and width are 10 ${\mu}m$ each. Then, a poly-amic-acid (PAA) was spin coated on the deposited Sn film. The PAA precursor used in this study was prepared by dissolving biphenyl-tetracarboxylic dianhydride-phenylene diamine (BPDA-PDA) commercial polyamic acid in N-methyl-2-pyrrolidon (NMP). Then the samples were cured at 400$^{\circ}C$ for 1 hour in N atmosphere after drying at 135$^{\circ}C$ for 30 min through rapid thermal annealing. The deposition of aluminum layer with thickness of 200 nm was followed by using a thermal evaporator, and then the gate electrode was defined by photolithography and etching. The electrical properties were measured at room temperature using an HP4156a precision semiconductor parameter analyzer and an Agilent 81101A pulse generator. Also, the optical pulse for the study on photo-induced electrical properties was applied by Xeon lamp light source and a monochromator system.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.314-314
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• 2012

The dilute magnetic semiconductors (DMS) have been developed to multi-functional electro-magnetic devices. Specially, the Si based DMS formed by ion implantation have strong advantages to improve magnetic properties because of the controllable effects of carrier concentration on ferromagnetism. In this study, we investigated the deep level states of Fe- and Co-ions implanted Si wafer during rapid thermal annealing (RTA) process. The p-type Si (100) wafers with hole concentration of $1{\times}10^{16}cm^{-3}$ were uniformly implanted by Fe and Co ions at a dose of $1{\times}10^{16}cm^{-2}$ with an energy of 60 keV. After RTA process at temperature ranges of $500{\sim}900^{\circ}C$ for 5 min in nitrogen ambient, the Au electrodes with thickness of 100 nm were deposited to fabricate a Schottky contact by thermal evaporator. The surface morphology, the crystal structure, and the defect state for Fe- and Co- ion implanted p-type Si wafers were investigated by an atomic force microscopy, a x-ray diffraction, and a deep level transient spectroscopy, respectively. Finally, we will discuss the physical relationship between the electrical properties and the variation of defect states for Fe- and Co-ions implanted Si wafer after RTA.

• Journal of the Korean Vacuum Society
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• v.20 no.5
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• pp.339-344
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• 2011

The Ohmic contact of Ti/Au metals on n-type ZnO thin film deposited on c-plane sapphire substrates by pulsed laser deposition was investigated by TLM (transfer length method) patterns. The Ti/Au metal films with thickness of 35 nm and 90 nm were deposited by electron-beam evaporator and thermal evaporator, respectively. By using the photo-lithography method, the $100{\times}100{\mu}m^2$ TLM patterns with $6{\sim}61{\mu}m$ gaps were formed. To improve the electrical properties as well as to decrease an interface states and stress between metal and semiconductor, the post-annelaing process was done in oxygen ambient by rapid thermal annealing system at temperature of $100{\sim}500^{\circ}C$ for 1 min. In this study, it appeared that the minimum specific contact resistivity shows about $1.1{\times}10^{-4}{\Omega}{\cdot}cm^2$ in $300^{\circ}C$ annealed sample, which may be originated from formation of oxygen vacancies of ZnO during an oxidation of Ti metal at the interface of Ohmic contacts.

• Journal of Bio-Environment Control
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• v.26 no.4
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• pp.317-323
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• 2017

In this study, the heating performance and the energy saving effect of the heat pump system using hot waste water(waste heat) of the thermal power plant discharged from a thermal power plant to the sea were analyzed. The greenhouse area was $5,280m^2$ and scale of the heat pump system was 120 RT(Refrigeration Ton), which was divided into 30 RT, 40 RT and 50 RT. The heat pump system consisted of the roll type heat exchangers, hot waste water transfer pipes, heat pumps(30, 40, 50 RT), a heat storage tank and fan coil units. The roll type heat exchangers was made of PE(Poly Ethylene) pipes in consideration of low cost and durability against corrosion, because hot waste water(sea water) is highly corrosive. And the heating period was 5 months from October to February. During the heating performance test(12 hours), the inlet water temperature of evaporator was changed from $32^{\circ}C$ to $26^{\circ}C$, and heat absorption of he evaporator was changed from 175 kW to 120 kW. The inlet water temperature of the condenser rose linearly from $15^{\circ}C$ to $50^{\circ}C$, and the heat release of condenser was reduced by 40 kW from 200 kW to 160 kW. And the power consumption of the heat pump system increased from 30 kW to 42 kW. When the inlet water temperature of condenser was $15^{\circ}C$, the heating COP(Coefficient Of Performance) was over 7.0. When it was $30^{\circ}C$, it dropped to 5.0, and when it was above $40^{\circ}C$, it decreased to less than 4.0. It was analyzed that the reduction of heating energy cost was 87% when compared to the duty free diesel that the carbon dioxide emission reduction effect was 62% by recycling the waste heat of the thermal power plant as a heat source of the heat pump system.

• Proceedings of the SAREK Conference
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• 2008.11a
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• pp.170-174
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• 2008

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of slimness of the devices, so it is not easy to find the optimal thermal management technology for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint. In the present study, the silicon and metal flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. Through the experimental study, the normal isothermal characteristic by vapor-liquid phase change was confirmed and the cooling device with 70mm of total length showed 6.8W of the heat transfer rate within the range of $4{\sim}5^{\circ}C$/W of thermal resistance. In the meantime, the metal cooling device was developed for commercialization. The device was designed to have all structures of evaporator, vapor flow path, liquid flow path and condenser in one plate. And an envelope of that could be completed by combining the two plates of same structure and size. And the simplicity of fabrication process and reduction of manufacturing cost could be accomplished by using the stamping technology for fabricating large flow paths relatively. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of that.

• Proceedings of the KIEE Conference
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• 1999.07d
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• pp.1959-1961
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• 1999

We prepared the $Ag[100\AA])/Sb_2S_3[3000\AA]$ films using the thermal evaporator. The films were exposed by the blue-pass filtered mercury lamp and the polarized He-Ne laser. We have investigated the dependence of the induced optical energy with Ag-doping and have observed the transmittance variation near the optical absorption edge with the light source. It was shown that the energy gap of this thin film was largely changed by exposing He-Ne laser, the light source of the near energy gap of this thin film. It is because of the structural change from Ag-doping. It is investigated that the dissolution, the diffusion, and the field effect of the Ag thin film generate the Ag spatial distribution.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2130-2135
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• 2007

Operating characteristics of a loop heat pipe (LHP) having a bypass line was investigated experimentally. The LHP had a sintered metal wick as a capillary structure and methanol as a working fluid. The sintered metal wick was made of stainless steel of which the average pore size was 5 ${\mu}m$and porosity of 47%. A bypass line of a small diameter was attached between the vapor escape passage and the liquid reservoir. The dimension of the flat evaporator was $50(L){\times}40(W){\times}30(H)$ mm and that of the condenser was $50(L){\times}40(W){\times}11(H)$ mm. Wall and pipe material of the LHP was stainless steel and heating area was 35(W) mm${\times}$35(L) mm. The inner diameters of vapor and liquid transport lines were 4.0 mm and 2.0 mm, and the lengths of the two lines were both 0.5 m. The LHP was tested for three different tilt angles of horizontal, favorite tilt, and adverse tilt. The thermal load range was up to 290 W at the condenser above evaporation position. Furthermore, the effect of a bypass line on the start-up transient as well as steady-state operation was presented and discussed.

• Journal of the Korean Society of Combustion
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• v.18 no.1
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• pp.21-26
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• 2013

In the Shell coal gasification process, the syngas produced in a gasifier passes through a syngas cooler for steam production and temperature control for gas cleaning. Fly slag present in the syngas may cause major operational problems such as erosion, slagging, and corrosion, especially in the upper part of the syngas cooler (gas reversal chamber, GRC). This study investigates the flow, heat transfer and particle behaviors in the GRC for a 300 MWe IGCC process using computational fluid dynamics. Three operational loads of 100%, 75% and 50% were considered. The gas and particle flows directly impinged on the wall opposite to the syngas inlet, which may lead to erosion of the membrane wall. The heat transfer to the wall was mainly by convection which was larger on the side wall at the inlet level due to the expansion of the cross-section. In the evaporator below the GRC, the particles were concentrated more on the outer channels, which needs to be considered for alleviation of fouling and blockage.

• Transactions of the Korean hydrogen and new energy society
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• v.26 no.6
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• pp.590-599
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• 2015

In this paper a performance analysis is carried out based on the first and second laws of thermodynamics for heat exchanger in organic Rankine cycle (ORC) for the recovery of low-temperature finite thermal energy source. In the analysis, effects of the selection of working fluid and pinch temperature difference are investigated on the performance of the heat exchanger including the effectiveness of the heat exchanger, exergy destruction, second-law efficiency, number of transfer unit (NTU), and pinch point. The temperature distribution are shown depending on the working fluids and the pinch temperature difference. The results show that the performance of the heat exchanger depends on the pinch temperature difference sensitively. As the pinch temperature increases, the exergy destruction in the evaporator increases but the effectiveness, second law efficiency and NTU decreases.