• Title/Summary/Keyword: Thermal electron

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Electron sources for electron microsocpes (전자현미경의 전자원)

  • Cho, Boklae
    • Vacuum Magazine
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    • v.2 no.2
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    • pp.24-28
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    • 2015
  • The brightness of an electron source, along with the aberrations of an objective lens, determines the image resolution and beam current on samples, which are two important parameters for evaluating the performance of an electron microscope. Here we introduce thermal electron source, Schottky emitter and cold field electron emitter. Thermal electron source is the cheapest and stable electron source but it has the lowest brightness. Schottky emitter is 10000 times brighter than tungsten thermal electron source, but requires ultrahigh vacuum operating condition. Cold field electron emitter is 10 times brighter than Schottky emitters, but it is rather unstable and its operation requires most stringent vacuum condition, hindering its widespread use.

Predictions of Phonon and Electron Contributions to Thermal Conductivity in Silicon Films with Varying Doping Density (박막 실리콘 내 도핑 농도 변화에 따른 포논과 전자의 열전도율 기여도에 대한 수치해석)

  • Jin, Jae-Sik;Lee, Joon-Sik
    • Proceedings of the KSME Conference
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    • 2007.05b
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    • pp.2182-2187
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    • 2007
  • The relative contributions of phonon and electron to the thermal conductivity of silicon film with varying doping density are evaluated from the modified electron-phonon interaction model, which is applicable to the micro/nanoscale simulation of energy transport between energy carriers. The thermal conductivities of intrinsic silicon layer thicknesses from 20 nm to 500 nm are calculated and extended to the variation in n-type doping densities from 1.0 ${\times}$ $10^{18}$ to 5.0 ${\times}$ $10^{20}$ $cm^{-3}$, which agree well with the experimental data and theoretical model. From simulation results, the phonon and electron contributions to thermal conductivity are extracted. The electron contribution in the silicon is found to be not negligible above $10^{19}$ $cm^{-3}$, which can be classified as semimetal or metal by the value of its electrical resistivity at room temperature. The thermal conductivity due to electron is about 57.2% of the total thermal conductivity at doping concentration 5.0 ${\times}$ $10^{20}$ $cm^{-3}$ and silicon film thickness 100 nm.

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Effects of Thermal-Carrier Heat Conduction upon the Carrier Transport and the Drain Current Characteristics of Submicron GaAs MESFETs

  • Jyegal, Jang
    • Proceedings of the Korea Society for Industrial Systems Conference
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    • 1997.11a
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    • pp.451-462
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    • 1997
  • A 2-dimensional numerical analysis is presented for thermal-electron heat conduction effects upon the electron transport and the drain current-voltage characteristics of submicron GaAs MESFETs, based on the use of a nonstationary hydrodynamic transport model. It is shown that for submicron GaAs MESFETs, electron heat conduction effects are significant on their internal electronic properties and also drain current-voltage characteristics. Due to electron heat conduction effects, the electron energy is greatly one-djmensionalized over the entire device region. Also, the drain current decreases continuously with increasing thermal conductivity in the saturation region of large drain voltages above 1 V. However, the opposite trend is observed in the linear region of small drain voltages below 1 V. Accordingly, for a large thermal conductivity, negative differential resistance drain current characteristics are observed with a pronounced peak of current at the drain voltage of 1 V. On the contrary, for zero thermal conductivity, a Gunn oscillation characteristic is observed at drain voltages above 2 V under a zero gate bias condition.

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Analysis of Tension Mask Thermal Deformations under Localized Heating and Prediction of Electron Beam Landing Shifts (국부가열에 의한 Tension Mask 의 열변형 해석 및 전자빔의 오착 예측)

  • Shin, Woon-Seo;You, Se-Jonn;Jang, Bo-Woong
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.8
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    • pp.138-148
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    • 1999
  • Thermal deformations of tension mask under localized heating are analyzed using finite element method and electron beam landing shifts are predicted by the analysis results. In CRT, electron beam landing shifts due to thermal deformations of the tension mask make the color purity of screen worse. In order to get the final results of thermal deformations, firstly the tension processes of the mask and following welding processes between the tensional mask and rail must be analyzed sequentially. And then, nonlinear transient thermo-elastic finite element analysis is performed on every part inside CRT including tension mask, wherein thermal radiation is a main heat transfer mechanism. Because the tension mask has numerous slits, the effective thermal conductivity and effective and effective elastic modulus is calculated, and the tension mask is modeled as a shell without slits. From the displacement results of tension mask, electron beam landing shifts is calculated directly. Experiments are performed to confirm our analysis results. Temperature distributions and beam landing shifts of tension mask are measured and the results are in good agreement with those of analyses.

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Thermal Deformation Analysis of Shadow Mask in a Flat TV and Prediction of Electron Beam Landing Shift by FEM (유한요소법에 의한 평면 TV 새도우마스크의 열변형해석 및 전자빔 오착 예측)

  • Kim, Jeong;Park, Soo-Kil;Kang, Beom-Soo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.26 no.11
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    • pp.2297-2304
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    • 2002
  • Two-dimensional and three-dimensional finite element methods have been used to analyze the deformation behavior of a shadow mask due to thermal and tension load. The shadow mask inside the Braun tube of a TV set has numerous slits through which the electron beams are guided to land on the designed phosphor of red, green or blue. Its thermal deformation therefore causes landing shift of the electron beam and results in decolorization of a screen. For the realistic finite element analysis, the effective thermal conductivity and the effective elastic modulus arc calculated, and then the shadow mask is modeled as shell without slits. Next a transient thermal analysis of the shadow mask is performed, wherein thermal radiation is a major heat transfer mechanism. Analysis of the resulting thermal deformation is followed, from which the landing shift of the electron beam is obtained. The present finite element scheme may be efficiently used to reduce thermal deformation of a shadow mask and in developing prototypes of a large screen flat TV.

Chemical and Thermal Characterizations of Electron Beam Irradiated Jute Fibers (전자빔 조사된 황마섬유의 화학적 및 열적 특성분석)

  • Ji, Sang Gyu;Cho, Donghwan;Lee, Byung Cheol
    • Journal of Adhesion and Interface
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    • v.11 no.4
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    • pp.162-167
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    • 2010
  • In the present work, the effect of electron beam irradiation on the chemical and thermal characteristics of cellulose-based jute fibers was explored by means of chemical analysis, electron spin resonance analysis, ATR-FTIR spectroscopy, thermogravimetric analysis and thermomechanical analysis. Jute fiber bundles were uniformly irradiated in the range of 2~100 kGy by a continuous method using a conveyor cartin an electron beam tunnel. Electron beam treatment, which is a physical approach to change the surfaces, more or less changed the chemical composition of jute fibers. It was also found that the radicals on the jute fibers can be increasingly formed with increasing electron beam intensity. However, the electron beam irradiation did not change significantly the chemical functional groups existing on the jute fiber surfaces. The electron beam irradiation influenced the thermal stability and thermal shrinkage/expansion behavior and the behavior depended on the electron beam intensity.

A Study on Thermal Properties for Epoxy Micro-and-Nano Mixture Composites(EMNC) (에폭시 마이크로-나노 입자가 혼합된 콤포지트의 열적특성에 관한연구)

  • Lee, Chang-Hoon;Kim, Kuk-Jin;Kim, Suk-Man;Kang, Do-Hoon;Yeon, Da-Som;Park, Jae-Jun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.83-83
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    • 2010
  • This study investigates the thermal and mechanical properties of insulation elements through mixing epoxy based micro- and nano particles. Regarding thermal properties, DSC and DMA were used to calculate crosslinking densities for various types of insulation elements. In a mechanical property of bending strength, shape and scale parameters were obtained using the Weibull plot. This study obtained the most excellent results of scale parameters, such as Vol 3.2%, in the bending strength of EMNCs.

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Stabilization of PAN Nanofibers Using Electron Beam Irradiation and Thermal Compression Technique (전자선 조사와 열압축공정을 이용한 PAN 나노섬유의 안정화 및 특성분석)

  • Kim, Du Yeong;Jeun, Joon Pyo;Shin, Hye Kyoung;Kang, Phil Hyun
    • Journal of Radiation Industry
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    • v.6 no.1
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    • pp.55-59
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    • 2012
  • Polyacrylonitrile (PAN)-based carbon fibers have been widely used due to their unique chemical, electrical, and mechanical properties. Electron beam irradiation has been extensively employed as means of altering properties of polymeric materials. Electron beam irradiation can induce chemical reactions in materials without any catalyst. Electron beam irradiation may be useful in accelerating the thermal compression stabilization of PAN nanofibers. To investigate the irradiation effect on PAN fibers, PAN nanofibers were irradiated by electron beam at 1,000~5,000 kGy. Irradiated and non-irradiated PAN nanofibers were heated at 180 and $220^{\circ}C$ without applying pressure for 15 min. Then 1 metric ton has been applied for 5 min. SEM images have been found that the fiber kept its morphological behavior after the hot pressing up to electron beam irradiated 1,000 kGy. DSC thermograms showed that the peak temperatures of the exothermic reactions were found to decrease with increasing electron beam irradiation doses and temperature. FT-IR spectra have been found to decrease $C{\equiv}N$ stretch band with increasing the electron beam irradiation dose. These results indicate that the modification of PAN via reactions such as cyclization is significantly enhanced by electron beam irradiation and thermal compression technique.

Fabrication and Characterization of Cold Cathode Electron-gun of CRT using Mo-tip Field Emitter Array (몰리브덴 팁 전계 방출 소자를 이용한 CRT의 냉음극 전자총의 제조 및 특성 평가)

  • Ju, Byeong-Kwon;Kim, Hoon;Seo, Sang-Won;Park, Jong-Won;Lee, Yun-Hi;Kim, Nam-Su
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.50 no.8
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    • pp.409-413
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    • 2001
  • In the electron-gun of CRT, the Mo-tip FEA was employed as cold cathode in order to replace the conventional thermal cathode. The Mo-tip FEA was designed and fabricated according to CRT specification and mounted on the electron-gun. It was known that fabricated cold cathode electron-gun showed better performance in terms of maximum emission current and switch-on time when compared with the ones of thermal cathode electron-gun, but some geometrical structures in the inside of electron-gun must be changed to reduce the gate leakage current. Finally, the potential applicability was guaranteed by means of operating the 19 inch-sized LG-color CRT using the fabricated cold cathode electron-gun.

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A Comparative Study on Electron-Beam and Thermal Curing Properties of Epoxy Resins (에폭시 수지의 전자선 및 열경화 특성에 관한 연구)

  • 이재락;허건영;박수진
    • Polymer(Korea)
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    • v.26 no.1
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    • pp.80-87
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    • 2002
  • A comparative study using electron-beam(EB) and thermal curing techniques was carried out to determine the effect of cure behavior and thermal stability of epoxy resins. In this work, benzylquinoxalinium hexafluoroantimonate(BQH) was used as a latent cationic catalyst for an epoxy resin. According to the thermogravimetric analysis(TGA), the decomposed activation energy based on Coats-Redfern method was higher in the case of thermal curing technique. This could be interpreted in terms of slow thermal diffusion rate resulted from high crosslink density of the thermally cured epoxy resin. However, the increase of hydroxyl group in the epoxy resin cured by EB technique was observed in near-infrared spectroscopy(NIRS) measurements, resulting in improving the stable short aromatic chain structure, integral procedural decomposition temperature, and finally ductile properties for high impact strengths.