• 센서학회지
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• 제31권1호
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.1163-1164
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• 2011

• 한국식품과학회지
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• 제29권1호
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• pp.65-71
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• 1997

압출성형공정에서 주로 자가발열로 전환되는 것으로 알려진 모터에너지를 자가발열 에너지와 기계에너지로 구분하였다. 온도 상승에 의한 에너지를 열에너지로 간주하였고, 모터에너지에서 자가발열로 전환된 에너지를 감한 나머지 에너지를 기계에너지로 정의하여, 일정한 배럴온도를 조건으로 할 때 열에너지 및 상대기계에너지(최저 스크류회전속도에서의 기계에너지를 0으로 기준하여 계산된 값)를 정량화할 수 있는 방법을 완성하였다. 콘그리트(corn grit)를 수분함량 $27{\sim}36%$의 범위에서 압출성형하였을 때, 스크류회전속도가 증가할수록 상대기계에너지는 크게 변화하였고, 열에너지는 거의 비슷하게 유지되었다. 수분함량이 높아질수록 상대기계에너지는 크게 증가하였고, 열에너지는 약간 증가하였다. 이로부터 수분함량이 높아질수록 모터에너지로부터 자가발열보다는 상대기계에너지의 작용이 커짐을 알 수 있었다.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.89-93
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• 2018

1200V 이상 급의 전기자동차의 파워 모듈에 적용되는 세라믹 기판은 구동 전력으로 고전력이 인가되는 특성상 고열전도도, 고 전기절연성, 저열팽창계수, 급격한 온도 변화에 대한 저항성의 특성이 요구된다. 방열기판에 적용되는 세라믹 중 질화알루미늄과 질화규소는 그 요구를 충족하는 소재로서 고려되고 있다. 이에 따라 본 논문에서는 질화알루미늄과 질화규소의 방열기판 소재로서의 특성을 상용해석프로그램을 통해 비교하였다. 그 결과 질화규소는 질화알루미늄에 대해 각각 동일한 조건의 열을 부여하는 공정을 시물레이션으로 구현했을 때 스트레스와 휨이 덜 발생하여 더 우세한 내충격성, 내stress성을 보였다. 열전도도 측면에서는 질화알루미늄이 방열 소재로서 더 우수한 특성을 지니지만 신뢰성 측면에서는 질화규소가 더 우세함을 시물레이션을 통해 관찰하였다.

• 한국전기전자재료학회논문지
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• 제27권9호
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• pp.594-599
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• 2014

The heat dissipation conditions of high-power 5 watt LEDs-based searchlight modules were optimized with varying LED bar'shape, materials, and ambient temperature. The LED junction temperature was estimated by using Computational Fluid Dynamics simulation. The optimal heat dissipation conditions were found as follows; LED bar' shape: L=80 mm, W=4 mm, t=10 mm, copper material, LED junction temperature of $116.6^{\circ}C$, ambient temperature of $50^{\circ}C$, total mass of 184 g, and shadowing area of $320mm^2$. The difference between the junction temperatures of our fabricated and simulated LEDs-based searchlight modules is about $3^{\circ}C$, which confirms the validity of our thermal simulation results.

• Journal of Electrical Engineering and Technology
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• 제11권3호
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• pp.690-698
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• 2016

In this paper, a study is carried out to investigate the dielectric, physical and chemical properties of Palm Oil (PO) and Coconut Oil (CO) under open thermal ageing condition. The type of PO used in this study is Refined Bleached and Deodorized Palm Oil (RBDPO) Olein. The ageing experiment was carried out at 85 ℃ and 115 ℃ for 1, 3, 5, 7 and 14 days. Several parameters were measured such as AC breakdown voltage, dielectric dissipation factor, relative permittivity, resistivity, viscosity, moisture and acidity throughout the ageing duration. Based on the study, it is found that there are no significant changes on the AC breakdown voltages and relative permittivities for both RBDPO and CO. At ageing temperature of 115℃, there are clear reduction trends of dielectric dissipation factor for CO and resistivities for most of RBDPO. On the other hand, no clear trends are observed for viscosities, moisture and acidities of RBDPO and CO throughout the ageing duration.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.402-403
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• 2009

Accelerated aging tests were conducted under laboratory conditions on two generator stator bars. Electrical stress is applied in No. 1 model stator bar. Electrical and thermal stresses are applied in No. 2 model stator bar. As aging times increased from 0 to 11460h, dissipation factor($tan{\delta}$) test was performed on No. 1 and No.2 model stator bars. The ${\Delta}tan{\delta}$ of No. 1 and No. 2 stator bars increased with increased in aging time.

• JSTS:Journal of Semiconductor Technology and Science
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• 제12권4호
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• pp.397-404
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• 2012

Thermal generation by power dissipation of the highly integrated System on Chip (SoC) device is irregularly distributed on the intra chip. It leads to thermal increment of the each thermally different region and effects on the propagation timing; consequently, the timing violation occurs due to the misestimated number of buffers. In this paper, the timing budgeting methodology considering thermal variation which contains buffer insertion with wire segmentation is proposed. Thermal aware LUT modeling for cell intrinsic delay is also proposed. Simulation results show the reduction of the worst delay after implementing thermal aware buffer insertion using by proposed wire segmentation up to 33% in contrast to the original buffer insertion. The error rates are measured by SPICE simulation results.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2061-2066
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• 2007

Recently, ultra-lightweight materials with open, periodic cell structures take much attention owing to its potential for multi-functionality such as load bearing, thermal dissipation, and actuation. This paper presents experimental results on the hydraulic and heat transfer characteristics for the Wire-woven Bulk Kagome(WBK) composed of aluminum 1100 wires. The overall pressure drop and heat transfer of the WBK specimen have been experimentally investigated under forced air convection condition. The pressure loss and heat transfer performance of the aluminum WBK are compared with other heat dissipation media. It was shown that heat transfer depended on relative density and surface area density. Comparison with metal foams and other heat dissipation media such as packed beds, lattice frame materials, louvered fins, and other materials suggests that the aluminum WBK competes favorably with the best available heat dissipation media in heat transfer performance.

• 대한기계학회논문집B
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• 제32권1호
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• pp.15-22
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• 2008

Recently, ultra-lightweight materials with open, periodic cell structures take much attention owing to its potential for multi-functionality such as load bearing, thermal dissipation, and actuation. This paper presents experimental results on the fluid flow and heat transfer characteristics for the Wire-woven Bulk Kagome (WBK) composed of aluminum 1100 wires. The overall pressure drop and heat transfer of the WBK specimen was experimentally investigated under forced air convection condition. The pressure loss and heat transfer performance of the aluminum WBK were compared with other heat dissipation media. It was shown that heat transfer characteristics depended on relative density and surface area density. Comparison with metal foams and other heat dissipation media such as packed beds, lattice frame materials, louvered fins, and others suggests that the aluminum WBK competes favorably with the best available heat dissipation media in heat transfer performance.