• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 추계 기술심포지움 초록집
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• pp.30-30
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• 2004

• 마이크로전자및패키징학회지
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• 제11권3호
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• pp.71-76
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• 2004

레이저다이오드 냉각을 위해 사용되는 TEC의 소비전력을 3차원 유한요소해석으로 예측하고 실험을 통해 해석결과의 타당성을 검증하였다. 레이저다이오드의 소비전력, 제어온도, 외기온도, 열전달경로의 열저항 등이 고려되었다. 저소비전력 모듈의 설계를 위해 해석결과를 바탕으로 Pellet의 숫자와 치수로 결정되는 TEC 형태에 따른 소비전력특성을 고찰한 결과 Pellet의 숫자가 적으며 접지면적이 작고 길이가 길수록, 즉 열저항이 증가할수록 소비전력은 감소하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.25-26
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• 2007

In this paper, we studied the shadow effect which is one of environmental cause for hot-spot phenomenon on PV by considering electrical effects. We fabricated PV module in case of existence and nonexistence of bypass diode. And maximum output power and thermal distribution was analyzed by shadowing solar cell by increase of 5%. From the results, the PV module's(without bypass diode) maximum output power was reduced by hot-spot gradually. But the PV module's(with bypass diode) maximum output power had no reduction by operation of bypass diode, though solar cell is shadowed more than 60%. The solar cell temperature of PV module(without bypass diode) was $10^{\circ}C$ higher compared to module's one. This is a reason for shortening of durability of PV module.

• Bulletin of the Korean Chemical Society
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• 제18권1호
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• pp.108-109
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• 1997

• Bulletin of the Korean Chemical Society
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• 제17권6호
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• pp.536-538
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• 1996

• Journal of Electrical Engineering and Technology
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• 제11권5호
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• pp.1153-1164
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• 2016

• 전기학회논문지P
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• 제58권3호
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• pp.357-361
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• 2009

This study performed analysis on the thermal pattern and current characteristics of an LED ((Light Emitting Diode) street lamp. It did this using a TVS (Thermal Video System) to analyze the LED street lamp's thermal pattern, and measured its characteristics using an oscilloscope. The ambient temperature and humidity during the experiment were maintained at $24{\pm}2[^{\circ}C]$ and 50~60[%]. The capacity of the LED street lamp was 120[W] and nine sets of modules were arranged at uniform intervals. On one module, 24 LED lamps were arranged in a radial pattern. The analysis of the thermal diffusion pattern at the front of the LED lamp showed that the maximum surface temperature was approximately $34[^{\circ}C]$. In addition, there was almost no change in the temperature of the upper cover, and the temperature at the side showed a uniform thermal diffusion pattern. The surface temperature of the converter converting AC to DC increased to approximately $46[^{\circ}C]$. The analysis results of the thermal characteristics of one LED indicated uniform thermal characteristics for an initial eight minutes. However, the temperature at the center of the LED increased to approximately $82[^{\circ}C]$ after 12 minutes had elapsed. It can be seen from this that the temperature at the center of the LED was higher than the allowable temperature, $70[^{\circ}C]$ of the insulating material for general electrical devices. Therefore, it is necessary to design a lamp in such a way that the plastic insulating material does not come into contact with or get close to the LED lamp. The voltage of the LED lamp converted by the AC/DC converter was measured at DC 27[V] and the current was DC 13[A]. Consequently, it can be seen that in order to secure an adequate light source, it is important to supply a stable current that was greater than the current of other light sources. Therefore, appropriate radiation of heat is required to secure the stability and reliability of the system.

• 태양에너지
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• 제18권2호
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• pp.105-113
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• 1998

일반적으로 열 다이오드(thermo-diode)란 임의의 한 방향으로만 열 전달이 가능하도록 설계된 열 전달 기구이나, 열 흐름이 원하는 방향으로 이루어지는 양방향 열 다이오드를 사용한다면 겨울철 난방과 여름철 냉방부하 감소에 모두 효과적으로 적용될 수 있다. 본 연구에서는 루프형 양방향 열 다이오드를 응용한 태양열 이용 시스템을 설계 제작하였으며, test cell을 이용한 옥외 실험을 수행하여 실용 가능성을 확인하였다.

• E2M - 전기 전자와 첨단 소재
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• 제8권6호
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• pp.737-743
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• 1995

Two step RTD(Rapid Thermal Diffussion) of P into silicon wafer using tungsten halogen lamp was used to fabricated very shallow n$^{+}$p junction. 1st RTD was performed in the temperature range of 800.deg. C for 60 see and the heating rate was in the 50.deg. C/sec. Phosphrous solid source was transfered on the silicon surface. 2nd RTD process was performed in the temperature range 1050.deg. C, 10sec. Using 2 step RTD we can obtain a shallow junction 0.13.mu.m in depth. After RTD, the Ti-silicide process was performed by the two step RTA(Rapid Thermal Annealing) to reduced the electric resistance and to improve the n$^{+}$p junction diode. The titanium thickness was 300.angs.. The condition of lst RTA process was 600.deg. C of 30sec and that of 2nd RTA process was varied in the range 700.deg. C, 750.deg. C, 800.deg. C for 10sec-60sec. After 2 step RTA, sheet resistance was 46.ohm../[]. Ti-silicide n+p junction diode was fabricated and I-V characteristics were measured.red.

• 정보저장시스템학회논문집
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• 제2권1호
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• pp.21-25
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• 2006

The new multimedia information environment requires smaller optical data storage systems. However, one of the difficulties encountered in designing small form factor(SFF) optical pick-up is to emit the heat which is generated from laser diode(LD). Heat generated at the LD can reduce the optical performance of the system and the lifetime of LD. Therefore, it is important to include the thermal design in the design stage of SFF optical pick-up system for high performance and the longer lifetime of LD, and furthermore, to analyze the thermal characteristics of LD in detail micro heat transfer analysis is necessary. In the present study, micro heat transfer analysis was performed using the finite element method for the $28{\times}11{\times}2mm^3$ super slim swing-arm type optical pick-up actuator for Blu-ray disk. Two different materials were used for a swing-arm; a double layer polycarbonate/steel structure and a single aluminum structure.